EP3C55U484I7 - Cyclone III FPGA 55K LE 484-FBGA | Altera
MPN： EP3C55U484I7 ✓ 啟用中EP3C55U484I7 概覽
A Field-Programmable Gate Array (FPGA) is a reprogrammable digital integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers, and PLLs. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers, offering hardware-level parallelism for data-path and signal-processing workloads. The Cyclone III family specifically optimises logic density per dollar and per watt, positioning it below high-end Stratix devices in the Altera portfolio but above Cyclone II in features and below Cyclone IV GX in transceiver capability.
Key features of the EP3C55U484I7 include 3,491 LABs/CLBs, 2,396,160 bits of embedded RAM (approximately 234 kbit of M9K block RAM equivalent), up to 156 embedded 18x18 multipliers for DSP, four PLLs, and a maximum core clock frequency rated around 437 MHz. The 484-FBGA package measures 19 x 19 mm with a 0.8 mm ball pitch and supports surface-mount reflow assembly. The "I7" speed-grade suffix designates the industrial temperature range, making the device suitable for -40C to +100C ambient operation.
Architecturally, the Cyclone III device family is implemented on TSMC's 65 nm process node with a 1.2 V core, achieving notably lower static and dynamic power than the preceding Cyclone II generation. Designers can allocate embedded multipliers as DSP blocks for FIR/FFT pipelines, distribute block RAM across the fabric for buffering, and configure LVDS/LVTTL/PCIe-style I/O through the Quartus II toolchain. The combination of large logic capacity, ample block RAM, and dedicated DSP blocks makes the EP3C55 well-suited for parallel video processing, motor-control front ends, and protocol-bridging applications.
Typical applications include industrial machine vision and video pipelines, motor and motion control in factory automation, software-defined radio baseband, telecom protocol conversion, and display controllers. The wide logic capacity also supports multi-protocol bridging in industrial Ethernet gateways and embedded instrumentation.
When designing with the EP3C55U484I7, plan the power distribution network carefully: even at modest toggle rates the device can require 3-4 W of core supply, so multiple 0.1 uF + bulk decoupling capacitors are recommended adjacent to each supply ball, and a 4-6 layer PCB with continuous power/ground planes is essential. Verify pinout against the device-specific 484-FBGA ball map because multiple speed-grade and package variants share this footprint.
直接替換替代品，適用於 EP3C55U484I7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3C55U484I7 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Logic Elements, Process Technology, Family.
EP3C55U484I7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C55U484C8N
✅ 直接替換聯絡詢價
查看資料表 →EP3C55U484C7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C55U484C6N
✅ 直接替換聯絡詢價
查看資料表 →EP3C40U484I7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C55U484I7 最大額定值與電氣特性
| Family | Cyclone III |
| Manufacturer | Altera (Intel) |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.15 V to 1.25 V |
| Logic Elements | 55,856 |
| Number of LABs/CLBs | 3,491 |
| Total RAM Bits | 2,396,160 |
| Number of I/O Pins | 327 |
| 工作溫度 | -40C to +100C (industrial, "I7" grade) |
| 封裝 | 484-FBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch |
| 安裝類型 | Surface Mount |
| Maximum Operating Frequency | 437.5 MHz |
| Number of PLLs | 4 |
| Embedded Multipliers (18x18) | 156 |
| Series | Cyclone III |
EP3C55U484I7 484-fbga (ubga-484), 19 x 19 mm, 0.8 mm pitch 腳位配置指南
EP3C55U484I7（484-fbga (ubga-484), 19 x 19 mm, 0.8 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3C55U484I7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3C55U484I7 適用於 6 應用s: Industrial Machine Vision and Video Processing, Motor and Motion Control in Factory Automation, Software-Defined Radio Baseband and DSP Front-End, Telecom Protocol Conversion and Bridging, Display Controllers and Video Walls, Industrial Ethernet Gateways and Embedded Instrumentation.
Industrial Machine Vision and Video Processing
The Altera EP3C55U484I7 is well suited for real-time machine-vision and video pipelines because its 55,856 logic elements and 156 embedded 18x18 DSP multipliers can implement FIR filters, color-space converters, and pixel-level algorithms in parallel. Its 2,396,160 bits of block RAM (M9K) provide sufficient line-buffer memory to drive HDMI/VGA or LVDS display panels without external SRAM, while the 327 user I/Os can connect directly to parallel camera interfaces and on-board display controllers. With an industrial -40C to +100C temperature grade (I7 speed grade), the device operates reliably on factory floors where ambient temperatures fluctuate and vibration is common.
推薦
Motor and Motion Control in Factory Automation
The EP3C55U484I7 fits industrial servo, stepper, and BLDC motor control because its 4 PLLs and high logic density allow parallel generation of multi-axis PWM waveforms, encoder quadrature decoding, and current-loop compensators. The 65 nm low-power CMOS process minimises static dissipation so that multiple control axes can be driven from a single board. With 327 user I/Os and industrial temperature operation, the FPGA can interface directly to opto-isolated encoder inputs, gate drivers, and EtherCAT/Ethernet/IP MACs, replacing several discrete microcontrollers with a single programmable platform.
推薦
Software-Defined Radio Baseband and DSP Front-End
The EP3C55U484I7 delivers adequate DSP throughput for SDR baseband processing in the HF/VHF band. Its 156 18x18 hardware multipliers accelerate FIR/IIR filtering, FFTs, and digital down-conversion, while 2.4 Mbit of block RAM stores tap coefficients and signal history. The four on-chip PLLs derive the multiple clock domains needed for ADC sampling and DAC reconstruction. Industrial temperature operation and 327 I/Os enable direct connection to RF ADCs/DACs and FPGA Mezzanine Card (FMC) connectors in compact SDR platforms.
推薦
Telecom Protocol Conversion and Bridging
The EP3C55U484I7 is widely used in telecom equipment for protocol bridging between legacy TDM buses (E1/T1, H.110) and modern packet networks (Ethernet, PCIe, CPRI). Its 55,856 logic elements implement multi-channel HDLC, UART, and I2S cores concurrently while the embedded DSP blocks handle voice compression algorithms such as G.729. Industrial temperature operation and surface-mount 484-FBGA packaging suit carrier-grade equipment where board space is constrained and reliability is critical.
推薦
Display Controllers and Video Walls
The EP3C55U484I7 integrates multi-channel LVDS display drivers, frame-rate converters, and on-screen display generators. Its 327 user I/Os support multiple 24-bit TTL/LVDS display interfaces simultaneously, and its 2.4 Mbit of block RAM holds frame buffers for small video walls. The industrial I7 temperature grade and 484-FBGA package allow compact fan-less display controller boards used in digital signage, medical imaging monitors, and automotive instrument clusters.
推薦
Industrial Ethernet Gateways and Embedded Instrumentation
The EP3C55U484I7 supports PROFINET, EtherCAT, EtherNet/IP, and Modbus TCP soft-IP cores simultaneously thanks to its 55,856 logic elements and 327 I/Os. It can also implement multi-channel data acquisition front-ends, performing simultaneous sampling, decimation, and FIR filtering using the 156 hardware multipliers. The industrial temperature grade (I7) and low-power 65 nm process suit DIN-rail mounted controllers and embedded test instruments where heat dissipation and reliability are critical.
推薦
推薦產品摘要
工程參考資料，適用於 EP3C55U484I7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3C55U484I7N | EP3C55U484C8N | EP3C55U484C7N | EP3C55U484C6N | EP3C40U484I7N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (U484), 19x19 mm, 0.8 mm pitch | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 |
| Speed Grade | I7 (industrial, fastest) | I7N (industrial, lead-free) | C8 (commercial) | C7 (commercial, slower) | C6 (commercial, slowest) | I7N (industrial, lead-free) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Total RAM Bits | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 1,161,216 |
| User I/Os | 327 | 327 | 327 | 327 | 327 | 331 |
| Embedded Multipliers (18x18) | 156 | 156 | 156 | 156 | 156 | 108 |
主要差異化特點
- Highest Cyclone III logic density in 484-FBGA U484 package (對比EP3C40U484I7N)
- Industrial temperature grade (I7) for harsh-environment deployment (對比EP3C55U484C8N)
- Cyclone III process and tool-chain maturity (對比Newer Cyclone IV/V families)
設計說明
The Cyclone III EP3C55 core draws approximately 3-4 W from the 1.2 V rail at moderate toggle rates, with peaks up to 5 W during heavy DSP activity. Place a minimum of eight 0.1 uF MLCC decoupling capacitors adjacent to the core supply balls and at least four 10 uF bulk capacitors under the package footprint. Use a star-ground or split-plane topology so the 1.2 V core return does not share a high-current path with the I/O bank returns, otherwise ground bounce can corrupt LVDS signalling.
The 484-FBGA U484 package has a 0.8 mm ball pitch, which mandates a 4-layer PCB with microvia or via-in-pad construction for reliable breakout. Route inner signal layers directly under the BGA in a dog-bone or via-in-pad fanout and escape to outer layers with controlled-impedance traces. Maintain a continuous ground reference plane directly beneath the device to control return paths and minimise crosstalk on parallel LVDS buses.
Do not confuse the U484 FBGA package with the F484 variant: although both have 484 balls, the ball assignments differ and the parts are NOT pin-to-pin drop-in compatible. Always regenerate the Quartus II pin-out file (CSV/QSF) for the specific package code before finalising your PCB layout. Mixing pin maps between U484 and F484 will cause silent configuration failures or shorted I/O banks.
The Cyclone III EP3C55 in a 19x19 mm U484 package has a typical theta_JA around 20 C/W with sufficient PCB copper. At 4 W dissipation the junction temperature rises approximately 80C above ambient, so industrial enclosures with 70C internal ambient still keep Tj well below the 100C maximum. Add a thermal via array under the central ground balls to conduct heat into the inner ground plane; an exposed heat-spreader is optional for fan-less designs.
合規資訊
RoHS/REACH/lead-free status was not confirmed in the verified distributor snippets. Altera's Cyclone III family is generally manufactured with Pb-free terminal finishes, but engineers should request the full material declaration from the distributor or Altera (Intel) before committing to RoHS-critical end products. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-grade IC.
