EP3CLS200F484C8N - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel
MPN： EP3CLS200F484C8N ✓ 啟用中EP3CLS200F484C8N 概覽
A Cyclone III LS FPGA belongs to the broader PLD (Programmable Logic Device) hierarchy, which sits under digital ICs and complements microcontrollers and DSPs by providing massively parallel, reconfigurable logic. Compared with ASICs, FPGAs like the EP3CLS200F484C8N allow full in-system reprogrammability, accelerating time-to-market and enabling late-stage design changes without respinning silicon.
Key features include 198,464 logic elements, 8.21 Mbit of embedded SRAM, 396 18x18 multipliers for DSP pipelines, four general-purpose PLLs, and support for external memory interfaces such as DDR/DDR2/QDRII. The LS variant adds enhanced security features (AES bitstream encryption) and improved SEU mitigation versus the standard Cyclone III, while keeping static power below 0.25 W in typical operating conditions - a major advantage for thermally constrained enclosures.
Architecturally, the device uses 65 nm low-leakage process technology, multi-level adaptive logic modules (ALMs), and column-based M9K memory blocks. Global and regional clock networks feed PLLs and logic, supporting frequency synthesis up to 402 MHz fabric operation. The 484-FBGA (23 x 23 mm) FineLine BGA provides controlled-impedance signal integrity for LVDS and DDR memory interfaces.
Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment (non-safety), military/aerospace secure communications (with AES bitstream encryption), telecom line cards, and portable medical instrumentation. The large logic capacity also supports multi-protocol bridging (PCIe soft IP, Ethernet MAC, LCD controllers) on a single device.
When designing with this device, plan for 1.2 V core, 2.5 V/3.3 V I/O bank supplies, a dedicated configuration device (EPCS16 or larger), and proper JTAG chain management. Quartus II Web Edition (free) supports the full design flow; power estimation requires the Early Power Estimator (EPE) spreadsheet before place-and-route.
直接替換替代品，適用於 EP3CLS200F484C8N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3CLS200F484C8N （相同外形與佔位） — 差異在於 Process Technology, Operating Temperature, Package, Speed Grade, Maximum Operating Frequency.
EP3CLS200F484C7N
✅ 直接替換聯絡詢價
查看資料表 →EP3CLS200F484C8
✅ 直接替換聯絡詢價
查看資料表 →EP3CLS200F484C8ES
✅ 直接替換聯絡詢價
查看資料表 →EP3CLS150F484C8N
✅ 直接替換聯絡詢價
查看資料表 →EP3CLS100F484C8N
✅ 直接替換聯絡詢價
查看資料表 →EP3CLS200F484C8N 最大額定值與電氣特性
| Series | Cyclone III LS |
| Family | Cyclone® III LS |
| Logic Elements | 198,464 |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) |
| Embedded Multipliers (18x18) | 396 |
| User I/O Pins | 210 |
| Number of PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm CMOS, low-leakage |
| Maximum Operating Frequency | 402 MHz (fabric) |
| 封裝 | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Speed Grade | 8 (slowest) |
| Temperature Grade | Commercial (0C to +85C TJ) |
| Bitstream Encryption | AES-128 (256-bit key via separate license) |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount (BGA) |
EP3CLS200F484C8N 484-ball fbga (fineline bga), 23 x 23 mm 腳位配置指南
EP3CLS200F484C8N（484-ball fbga (fineline bga), 23 x 23 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3CLS200F484C8N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3CLS200F484C8N 適用於 6 應用s: Industrial Motor Control, Video Surveillance & Image Processing, Telecom Line Cards & Protocol Bridging, Aerospace Secure Communications, Medical Imaging & Portable Instrumentation, Automotive Infotainment & Driver Display.
Industrial Motor Control
The EP3CLS200F484C8N fits multi-axis industrial motor control because its 198,464 logic elements and 396 18x18 multipliers support parallel field-oriented control (FOC) loops for up to 6-8 axes. Its 4 PLLs generate the high-resolution PWM frequencies needed for IGBT gate drivers, while the 8.21 Mbit embedded memory buffers encoder feedback streams. The 1.2 V core with low-leakage 65 nm process keeps static power under 0.25 W, enabling fanless sealed enclosures common on factory floors.
推薦
Video Surveillance & Image Processing
For video surveillance systems, the EP3CLS200F484C8N delivers 198K LEs that comfortably absorb H.264 encode/decode pipelines at D1 resolution with motion detection overlays. Its 396 hardware multipliers accelerate DCT/IDCT and motion-estimation kernels, while the DDR2 memory controller IP streams pixel data into external SDRAM. AES-128 bitstream encryption protects proprietary analytics IP from cloning - critical for OEM security camera differentiation.
推薦
Telecom Line Cards & Protocol Bridging
The EP3CLS200F484C8N suits telecom line-card applications where multiple protocols (TDM, Ethernet MAC, SERDES bridging) must terminate in a single device. Its 210 user I/O pins connect to multiple PHYs, while the PLLs synthesize independent clock trees per channel. The 65 nm low-leakage process is well-suited for NEBS-compliant thermally constrained chassis where ambient air may reach 55C without active cooling.
推薦
Aerospace Secure Communications
The Cyclone III LS variant's AES-128 bitstream encryption and SEU-mitigation features make the EP3CLS200F484C8N attractive for aerospace secure-radio and avionics databus applications. The 198K LEs hold entire waveform processing chains (modulation, FEC, crypto) on one chip. According to Intel AN 341, the volatile key buffer ensures decrypted IP is never exposed at power-down - a hard requirement for ITAR-controlled designs.
推薦
Medical Imaging & Portable Instrumentation
The EP3CLS200F484C8N serves portable ultrasound and patient-monitoring devices where 198K LEs process beamforming, FFT spectral analysis, and LCD display control in a single FPGA. Its low static power extends battery runtime, while the 8.21 Mbit embedded memory stores frame buffers and waveform history. The AES bitstream encryption protects FDA-regulated algorithm IP from reverse engineering during manufacturing.
推薦
Automotive Infotainment & Driver Display
For non-safety automotive infotainment head units, the EP3CLS200F484C8N drives multi-display LVDS panels (cluster, head-up, center stack) with hardware-accelerated graphics compositing. Its 210 user I/O connect to MOST/Ethernet PHYs, CAN transceivers, and audio codecs. Designers targeting AEC-Q100 should migrate to Cyclone V or later; the LS part is appropriate for non-safety modules where cost and density dominate.
推薦
推薦產品摘要
工程參考資料，適用於 EP3CLS200F484C8N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3CLS200F484C7N | EP3CLS200F484C8 | EP3CLS200F484C8ES | EP3CLS150F484C8N | EP3CLS100F484C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Logic Elements | 198,464 | 198,464 | 198,464 | 198,464 | 150,848 | 100,448 |
| Embedded Memory | 8,211,456 bits | 8,211,456 bits | 8,211,456 bits | 8,211,456 bits | 6,858,624 bits | 4,455,936 bits |
| Embedded Multipliers (18x18) | 396 | 396 | 396 | 396 | 320 | 224 |
| User I/O | 210 | 210 | 210 | 210 | 210 | 210 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | 8 (slowest) | 7 (faster) | 8 | 8 | 8 | 8 |
| AES Bitstream Encryption | Yes (AES-128) | Yes (AES-128) | Yes (AES-128) | Yes (AES-128) | Yes (AES-128) | Yes (AES-128) |
主要差異化特點
- Highest density in the Cyclone III LS family with full security features (對比EP3CLS150F484C8N)
- AES-128 bitstream encryption built-in at no extra cost (對比EP3C80F484C8N (non-LS))
- Best value speed-grade option for cost-sensitive designs (對比EP3CLS200F484C7N)
設計說明
Estimated: Cyclone III LS EP3CLS200 typical core current at 198K LE utilization ~70% and 100 MHz toggle rate is approximately 0.8-1.0 A from the 1.2 V rail. Designers should use Intel's Early Power Estimator (EPE) spreadsheet before PCB layout to size the 1.2 V regulator with adequate headroom. Add 10-15% margin for inrush during configuration.
The 484-FBGA at 1.0 mm ball pitch requires 4-6 layer PCB with 0.5 oz copper and microvia-in-pad stackups for reliable assembly. Per Intel AN 75, route all 1.2 V core and 2.5 V/3.3 V PLL analog supply pins with star-ground topology. Place decoupling capacitors (0.1 uF + 10 uF bulk per VCC pin group) within 100 mil of each BGA via to suppress simultaneous-switching noise on the 210 user I/O.
Differential pairs (LVDS) must be length-matched within 20 mil and routed over a continuous reference plane. According to Cyclone III external memory interface guidelines, DDR2 DQ/DQS groups should be matched to within +/- 25 ps to avoid read/write capture margin loss. Use the Quartus pin planner to assign differential pairs to dedicated DIO pins near the PLL.
Do not apply power before nCONFIG is pulled high and CONF_DONE is observed low - the device may latch up if VCC ramps before the configuration controller is ready. Always include a configuration flash device (EPCS16 minimum for AES-128) on every board; JTAG-only programming is for development only and is not acceptable for production. Re-verify all configuration file (.pof/.sof/.jic) bitstream checksums before final tape-out.
Estimated: Cyclone III LS EP3CLS200 at full 198K LE utilization with 100% toggle activity dissipates approximately 1.5-2.0 W. The 484-FBGA has theta_JA ~12 C/W with standard JEDEC JESD51-7 4-layer test board, giving a junction rise of ~25-30 C above ambient at maximum activity. Commercial-grade parts are rated to 85 C junction; verify worst-case ambient using EPE before declaring thermal margins.
合規資訊
RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified (choose Cyclone V or later for automotive safety). AES-128 bitstream encryption available via Quartus II programming file generator with a license file for AES-256.
