EP3SE50F780I3N - Stratix III E FPGA, 47.5K Logic Elements, 780-FBGA | Intel
MPN： EP3SE50F780I3N ⚠ 最後購買機會EP3SE50F780I3N 概覽
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, M20K memory blocks, transceivers, and PLLs. FPGAs sit within the semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit, and serve as the highest-density reconfigurable digital fabric between microcontrollers and custom ASICs. Stratix III devices specifically target high-bandwidth signal processing, high-speed serial connectivity, and embedded-processor integration.
Key features of the EP3SE50F780I3N include 47,500 logic elements, 488 user I/Os (the highest pin-count variant in the Stratix III E family at 780-BGA), 5,760,000 bits of embedded RAM, full Boundary-Scan Test (BST) support per JTAG IEEE Std. 1149.1, and DSP blocks tuned for high-throughput fixed- and floating-point arithmetic. The FC-FBGA package supports high-speed I/O and offers signal-integrity advantages for memory and transceiver interfaces.
Architecturally, the Stratix III E family uses Altera's adaptive logic modules (ALMs), an 8-input fracturable LUT, dedicated 18x18 multipliers, M20K memory blocks, and a programmable power management engine (Altera's Programmable Power Technology) that reduces dynamic power by up to 30% versus the previous Stratix II generation. Device configuration is supported through JTAG IEEE 1149.1 and Altera's passive serial, fast passive parallel, and active serial configuration schemes.
Typical applications for the EP3SE50F780I3N include high-performance digital signal processing, wireline telecom line cards, software-defined radio, ASIC prototyping, military/aerospace image processing, and high-end test and measurement. When designing with this part, allocate sufficient decoupling on each power rail, use 1.0 V core and 0.9 V analog supplies per the datasheet, and verify the JTAG chain against the 1149.1 boundary-scan architecture before board bring-up.
This page synthesizes distributor pricing, same-family and cross-family drop-in alternatives, lifecycle guidance, and practical design notes not found in the manufacturer datasheet alone, supporting engineers who must replace, second-source, or qualify the EP3SE50F780I3N for new programs.
直接替換替代品，適用於 EP3SE50F780I3N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE50F780I3N （相同外形與佔位） — 差異在於 Package, Speed Grade, RoHS Status, Operating Temperature, Embedded Memory Bits.
EP3SE50F780I3G
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780I3
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780C4L
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F780I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780I3N 最大額定值與電氣特性
| Manufacturer | Intel (formerly Altera) |
| Family | Stratix III E |
| Logic Elements | 47,500 |
| Embedded Memory Bits | 5,760,000 bits |
| User I/O Pins | 488 |
| 封裝 | 780-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Industrial |
| Configuration Interface | JTAG IEEE Std. 1149.1 (BST), Passive Serial, Fast Passive Parallel, Active Serial |
| Boundary-Scan Support | Yes (IEEE 1149.1) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| 生命週期狀態 | Last Time Buy (Stratix III family EOL announced) |
| Supply Type | Tray (per JAK Electronics listing) |
EP3SE50F780I3N 780-ball fc-fbga (fine-pitch chip-scale bga) 腳位配置指南
EP3SE50F780I3N（780-ball fc-fbga (fine-pitch chip-scale bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE50F780I3N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE50F780I3N 適用於 6 應用s: High-Performance Digital Signal Processing, ASIC Prototyping and Emulation, Wireline Telecom Line Cards, Military and Aerospace Signal Processing, Software-Defined Radio Baseband, Test and Measurement Instrumentation.
High-Performance Digital Signal Processing
The EP3SE50F780I3N's 47,500 logic elements and Stratix III E family's enhanced DSP blocks make it well-suited for high-throughput DSP workloads. The E variant packs more 18x18 multipliers and M20K memory blocks than the L variant, delivering higher DSP bandwidth for FFTs, FIR filters, and forward-error-correction pipelines. With 0.9 V core operation and industrial temperature grade, the part handles signal-processing cards in outdoor or ruggedized telecom platforms.
推薦
ASIC Prototyping and Emulation
The EP3SE50F780I3N is widely used as an ASIC prototyping vehicle because it offers 47,500 logic elements, 5,760,000 bits of embedded memory, and 488 user I/Os in a single FC-FBGA package. Engineers can map large RTL blocks, run gate-level simulations at hardware speed, and validate system behavior before committing to a mask set. The 780-ball BGA exposes enough I/O to mimic multi-million-gate ASICs in multi-FPGA partition flows.
推薦
Wireline Telecom Line Cards
The EP3SE50F780I3N is a strong fit for wireline line cards handling packet classification, traffic shaping, and HDLC/framer glue logic. The 488 I/O pins of the 780-ball FC-FBGA expose enough LVDS and HSTL I/O for multi-port SGMII and SPI-4.2 interfaces. Industrial temperature grade and 0.9 V core operation suit central-office deployments, while the Stratix III E DSP blocks can accelerate packet-header parsing in software-defined networking equipment.
推薦
Military and Aerospace Signal Processing
The EP3SE50F780I3N's industrial temperature grade and high DSP throughput suit radar, electronic-warfare, and secure-communications preprocessing. The 780-ball FC-FBGA provides extensive I/O for ADAS-style sensor fusion, beamforming front-ends, and real-time image processing. Its Altera heritage (now Intel) provides legacy design files across multiple programs, supporting long-lifecycle aerospace procurement with explicit Last Time Buy planning.
推薦
Software-Defined Radio Baseband
The EP3SE50F780I3N accelerates SDR baseband processing by mapping digital down-conversion, channelization, and demodulation onto DSP slices and parallel logic. The 5,760,000-bit embedded memory buffer enables sample-rate conversion and pulse-shaping without external SRAM. The 780-ball FC-FBGA exposes LVDS and differential I/O for high-speed ADC/DAC interfaces typical in SDR front-ends.
推薦
Test and Measurement Instrumentation
The EP3SE50F780I3N's high logic density and abundant memory suit test and measurement instruments such as protocol analyzers, BERT equipment, and arbitrary waveform generators. The 488 I/Os of the FC-FBGA package support parallel stimulus/response buses, while the embedded DSP blocks accelerate real-time correlation and pattern-matching. Industrial temperature grade suits laboratory and production-floor environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SE50F780I3N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE50F780I3G | EP3SE50F780C4N | EP3SL50F780C4L | EP3SE110F780I3N |
|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 110,000 |
| Family Variant | Stratix III E (DSP-enhanced) | Stratix III E (DSP-enhanced) | Stratix III E (DSP-enhanced) | Stratix III L (logic-optimized) | Stratix III E (DSP-enhanced) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 3 | 3 | 4 (faster) | 4 | 3 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
主要差異化特點
- Stratix III E DSP-enhanced variant (對比EP3SL50F780C4L)
- Industrial temperature grade at speed grade 3 (對比EP3SE50F780C4N)
- Same-footprint upgrade path to 110K logic elements (對比EP3SE110F780I3N)
設計說明
Decouple each Stratix III power rail (VCCINT 0.9 V, VCCIO 1.2-3.0 V per bank, VCCPD, VCCAUX, VCCBAT) with the capacitor network recommended in the Stratix III Power Management chapter. Place 0.1 uF and 10 uF ceramics within 100 mils of each pin pair. Use PowerPlay Early Power Estimator before layout to size the regulator; at maximum DSP throughput the EP3SE50F780I3N can draw 5-10 W from VCCINT alone. Sequence rails as documented in the datasheet to avoid latch-up.
The 780-ball FC-FBGA package requires a multilayer PCB with microvia stack-ups. Per JEDEC/IPC-9701, design 1-2-1 or 1-2-1-2-1 stack-ups with laser-drilled microvias on the top/bottom and filled/via-in-pad for the BGA pads. Match trace impedance to 50 ohm single-ended / 100 ohm differential for high-speed transceiver and LVDS pairs. Keep at least 4-6 ground return vias stitched around the BGA perimeter to provide a low-impedance return path.
Do not apply power before the configuration is complete and the CONF_DONE pin goes high - earlier transitions can corrupt the FPGA state. Wire the JTAG chain with TRST properly tied through the recommended resistor network; floating TRST can randomly put the device in test mode. When migrating from EP3SE50F780I3N to the EP3SE50F484I3N or another footprint, verify the Quartus II pin-out file (.pin) for every pin - same silicon, different package, different ball-to-pin mapping.
合規資訊
RoHS and lead-free status confirmed by Altera/Intel product page and DigiKey listing. AEC-Q100 not applicable (commercial/industrial FPGA, not automotive). Conflict-minerals compliance per Intel's CMRT disclosure.
