EP3SE50F780I3G - Stratix III E FPGA 47.5K LE | 780-FBGA | Intel
MPN： EP3SE50F780I3G ✗ 停產EP3SE50F780I3G 概覽
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the designer after manufacture. FPGAs occupy a unique position in the semiconductor hierarchy: programmable logic device (PLD) -> FPGA -> high-density FPGA with transceivers and DSP. The Stratix III E variant specifically addresses systems that demand a balance of logic density, transceiver throughput, and DSP throughput without the cost premium of the largest Stratix V-class parts.
Key features of the EP3SE50F780I3G include programmable power technology that dynamically adjusts logic and routing power based on operating frequency, partial reconfiguration support for in-system logic updates, and dedicated hard IP for memory controllers (DDR3 up to 800 MHz) and PCI Express Gen1 x8. The 780-pin FC-FBGA (29x29 mm) package supports 488 user I/O pins distributed across 12 banks, enabling flexible voltage and clock-domain partitioning at the PCB level.
Architecturally, the device leverages the Stratix III adaptive logic module (ALM) which combines 8-input fracturable look-up tables with dedicated adder/subtractor carry chains, improving effective logic utilization over the previous Stratix II generation. Memory is organized as M9K and M144K blocks, allowing efficient mapping of FIFO buffers, packet descriptors, and DSP coefficient storage. The transceiver blocks (GXB) support multiple protocols including PCIe Gen1, XAUI, Serial RapidIO, and CEI-6G with integrated PCS and PMA.
Typical applications include 10G/40G telecom line cards, wireless baseband processing, military radar front-ends, medical imaging pipelines, and high-performance ASIC prototyping. The 47.5K LE capacity comfortably holds 8-lane PCIe endpoints, custom DDR3 controllers, and 24-bit DSP dataplanes simultaneously, making it a strong fit for mid-tier system-on-chip emulation.
When designing with this device, pay close attention to power sequencing requirements: 1.1 V core, 2.5 V/3.0 V auxiliary, and 1.2 V/2.5 V transceiver supplies must ramp in a defined order documented in the Stratix III handbook. Use the Quartus II design software (13.0 or later) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in Stratix III family alternates, and practical design guidance not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP3SE50F780I3G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE50F780I3G （相同外形與佔位） — 差異在於 Package, Speed Grade, Family, Process Technology, Operating Temperature.
EP3SE110F780I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780I4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780I3
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F780I4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F780I4LN
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780I3G 最大額定值與電氣特性
| Family | Stratix III E |
| Logic Elements (LE) | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) |
| DSP Blocks | 264 (18x18 multipliers) |
| Maximum User I/O Pins | 488 |
| Transceivers | 12 channels, up to 3.75 Gbps |
| Core Voltage | 1.1 V |
| Process Technology | TSMC 40 nm |
| 封裝 | 780-pin FC-FBGA (F780) 29x29 mm |
| 工作溫度 | -40C to +100C (Industrial, I3) |
| Speed Grade | 3 |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM |
| PCI Express Hard IP | Gen1 x1/x4/x8 |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
EP3SE50F780I3G 780-pin fc-fbga (f780) 29x29 mm 腳位配置指南
EP3SE50F780I3G（780-pin fc-fbga (f780) 29x29 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE50F780I3G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE50F780I3G 適用於 6 應用s: 10G/40G Telecom Line Card, Wireless Baseband Processing, Military Radar Front-End, Medical Imaging Pipeline (Ultrasound/CT), High-Performance ASIC Prototyping, Industrial Motor Control and Automation.
10G/40G Telecom Line Card
The EP3SE50F780I3G fits telecom line-card designs because its 12 transceivers operate up to 3.75 Gbps, sufficient for XAUI (4x3.125 Gbps) and multiple PCIe Gen1 lanes, while the 264 DSP blocks handle FEC encoding and packet classification. The 8.7 Mbit embedded memory buffers packet descriptors without external SRAM for small queues. Power consumption stays manageable in the 40 nm process, and the F780 package exposes all transceivers and I/O for backplane connectivity. Compared to discrete ASIC implementations, this FPGA allows late firmware revisions and multi-protocol support (XAUI, Serial RapidIO, Interlaken) on a single board.
推薦
Wireless Baseband Processing
The EP3SE50F780I3G is well-suited to wireless baseband signal processing because its 264 dedicated 18x18 multipliers implement LMS/MMSE channel equalizers, FFT/iFFT engines, and turbo/LDPC decoders at LTE sample rates without consuming fabric LUTs. The DDR3 controller hard IP at 800 MHz supports high-bandwidth sample storage, while the F780 footprint provides ample I/O for CPRI/OBSAI fronthaul links. Industrial temperature grade (-40C to +100C) allows deployment in outdoor RRH (Remote Radio Head) enclosures.
推薦
Military Radar Front-End
The EP3SE50F780I3G targets military radar processing where 264 DSP blocks deliver 18x18 multiplications at hundreds of MHz for pulse compression, MTI filtering, and Doppler processing on multi-megasample ADC streams. Industrial temperature grade and BGA package suit ruggedized VPX cards. The 12 transceivers handle multi-channel ADC-to-FPGA links at 3.125 Gbps via JESD204B-equivalent protocols. Partial reconfiguration enables runtime mode switching between surveillance and tracking waveforms.
推薦
Medical Imaging Pipeline (Ultrasound/CT)
The EP3SE50F780I3G powers mid-tier ultrasound beamformers and CT reconstruction pipelines, with 264 DSP blocks executing FIR filtering, Hilbert transforms, and back-projection kernels in real time. The 488 user I/Os accept multi-channel 12-/14-bit ADC data and drive LVDS display panels, while DDR3 hard IP buffers raw frame data. The industrial temperature grade supports continuous operation in hospital imaging suites, and the F780 package fits standard 6U boards used in medical OEM equipment.
推薦
High-Performance ASIC Prototyping
The EP3SE50F780I3G is a practical platform for ASIC prototyping because its 47.5K logic elements comfortably map mid-range SoC designs after partitioning across multiple FPGAs, with the 780-pin FC-BGA exposing all signals for inter-board cabling. The hard PCIe and DDR3 controllers allow realistic performance validation. Quartus II's incremental compilation preserves previous compilation passes when only portions of the design change, accelerating iterative bring-up.
推薦
Industrial Motor Control and Automation
The EP3SE50F780I3G handles multi-axis industrial servo control by combining 488 I/O for encoder feedback (EnDat, BiSS, SSI), PWM outputs for IGBT drivers, and 264 DSP blocks executing field-oriented control (FOC) loops within 4 microseconds. The DDR3 controller captures data logs, and the transceiver links synchronize multiple drive chassis over EtherCAT or SERCOS III. Industrial temperature grade -40C to +100C suits factory-floor enclosures.
推薦
工程參考資料，適用於 EP3SE50F780I3G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE110F780I3N | EP3SE50F780I4N | EP3SE50F780I3 | EP3SE110F780I4N |
|---|---|---|---|---|---|
| Package | 780-pin FC-FBGA (F780) | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E |
| Logic Elements | 47,500 LE | 106,500 LE (+124%) | 47,500 LE (same) | 47,500 LE (same) | 106,500 LE (+124%) |
| Speed Grade | 3 (I3, faster) | 3 (I3, same) | 4 (I4, slower by one step) | 3 (I3, same) | 4 (I4, slower by one step) |
| Embedded Memory | 8.7 Mbits | 17.8 Mbits | 8.7 Mbits (same) | 8.7 Mbits (same) | 17.8 Mbits |
| DSP Blocks (18x18) | 264 | 528 | 264 (same) | 264 (same) | 528 |
| User I/O Pins | 488 | 488 (same) | 488 (same) | 488 (same) | 488 (same) |
主要差異化特點
- 12 high-speed transceivers at 3.75 Gbps (對比EP3C80F780C8N)
- 264 hard DSP blocks for high-throughput arithmetic (對比EP3SE50F780I4N)
- Industrial temperature grade with same die as commercial (對比EP3SE110F780I3N)
設計說明
The Stratix III E device requires a specific power-up sequence to avoid long-term reliability issues. Apply VCC (1.1 V core) and VCCAUX (2.5 V) simultaneously within 100 ms, then apply VCCD_PLL (1.1 V) and per-bank VCCIO (1.2 V to 3.3 V). Use the LM21212A or EN5339 power sequencer or an FPGA-supervisor IC like the MAX6870. Estimated: total quiescent current for the EP3SE50 at 100C ambient approaches 2.5 A on the 1.1 V rail when transceivers are active; budget 15% margin for the regulator.
Estimated: at 100% logic utilization with all 12 transceivers active, total power dissipation reaches approximately 8-10 W. The F780 FC-FBGA package has theta_JA of approximately 11 C/W with a 4-layer JEDEC test board. To maintain junction temperature below 100C in industrial environments, the PCB must include at least 6 thermal vias in the central array and 2 oz copper inner planes. For sealed enclosures, derate to 70% transceiver utilization or add an aluminum cold-finger.
Route all 12 transceiver channels using 100 ohm differential microstrip or stripline with continuous reference plane on layer 3. Maintain 4W (W = dielectric thickness from trace to plane) spacing between adjacent transceiver pairs to avoid crosstalk exceeding -30 dB. Place AC-coupling capacitors (0.1 uF 0201 X7R) within 200 mil of the FPGA BGA balls; the EP3SE50 internal transmitter pre-emphasis compensates for the resulting channel loss.
Common pitfalls when designing with the EP3SE50F780I3G include: (1) omitting the dedicated VREF pin per bank when using differential SSTL/HSTL I/O standards; (2) leaving CONFIG_DONE floating, which prevents configuration from completing; (3) using Quartus II versions earlier than 13.0 SP1, which do not contain final Stratix III timing models; (4) not connecting the JTAG TCK pin to a pull-down, causing false TCK detection during power-up.
Place decoupling capacitors on the bottom side of the PCB directly beneath the BGA footprint using 0201 case size for 0.1 uF X7R and 0402 for 10 uF X5R bulk. Use one 0.1 uF cap per VCC/VCCAUX power pin pair, and one 22 uF tantalum or polymer cap for every 4 banks. Keep the high-speed transceiver loop area less than 50 sq mm to control EMI emissions below FCC Class A limits.
合規資訊
RoHS and REACH compliance confirmed per Arrow/Heisener listing. Not AEC-Q100 qualified (FPGA is not typically AEC-Q100 - alternative automotive-grade Xilinx Zynq or Lattice ECP5-Auto for that requirement). Conflict-free DRC per Abacus Technologies listing.
