EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
MPN： EP3SL340F1760C4 ⚠ 最後購買機會EP3SL340F1760C4 概覽
An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device that sits in the broader semiconductor hierarchy between fixed-function ASICs and software-driven processors. It is composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, DSP blocks, and high-speed transceiver tiles, allowing hardware designers to implement arbitrary parallel logic, signal-processing pipelines, and interface protocols. FPGAs occupy a distinct design niche where time-to-market, post-silicon flexibility, or parallel throughput outweigh the per-unit cost advantage of an ASIC.
Key features of the EP3SL340F1760C4 include 337,500 logic elements, 18,822,144 embedded memory bits distributed across M9K and M144K blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, and 1,120 user I/O pins supporting a wide range of single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The device also integrates PCI Express hard IP, multi-gigabit transceivers on selected variants, and on-chip termination (OCT) that simplifies board-level design.
Architecturally, the Stratix III L family combines a logic fabric with column- and row-based memory and DSP blocks, an Adaptive Logic Module (ALM) that doubles effective logic capacity versus prior generations, and partial reconfiguration support for in-system logic changes. The 1760-ball FC-FBGA package provides a 42.5 x 42.5 mm land pattern that supports the high-I/O count required by parallel memory buses and multi-channel high-speed serial links.
Typical applications include high-performance digital signal processing (radar, medical imaging, software-defined radio), ASIC prototyping and emulation, high-speed packet processing in networking line cards, video broadcast and image-processing pipelines, and test-and-measurement instrumentation. The device's high logic density and embedded transceiver bandwidth make it suitable as a verification platform for large SoC designs before tape-out.
When designing with this device, allocate sufficient PCB layers (typically 12 or more) for the FC-FBGA break-out and for controlled-impedance routing of the high-speed serial links. Thermal management must account for the 1.1 V core at multi-ampere operating currents; follow the Stratix III Device Handbook power-supply decoupling recommendations. Designers should also verify Quartus II software support for the C4 speed grade in their chosen Quartus release.
This page synthesizes distributor pricing, vertical-migration alternatives within the Stratix III family, and design notes not found in the standalone datasheet, providing a practical reference for engineers comparing the EP3SL340F1760C4 against both Stratix III siblings and Stratix IV successor devices.
直接替換替代品，適用於 EP3SL340F1760C4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL340F1760C4 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Embedded Memory Bits, RoHS Status.
EP3SL340F1760C3
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1760C2
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1760C3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1517I4
✅ 直接替換聯絡詢價
查看資料表 →EP3SE260F1152C4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL200F1517I4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1760C4 最大額定值與電氣特性
| Series | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory Bits | 18,821,144 |
| User I/O Count | 1,120 |
| 封裝 | 1760-BBGA, FCBGA (Flip-Chip) |
| Process Node | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Core Frequency | 450 MHz |
| Speed Grade | C4 (commercial) |
| 工作溫度 | 0C to +85C (commercial) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X |
| Configuration Scheme | Passive serial, fast passive parallel, JTAG |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| 安裝類型 | Surface Mount (BGA) |
EP3SL340F1760C4 腳位配置
| 腳位 A1 | I/O — General-purpose user I/O (bank dependent) |
| 腳位 B2 | I/O — General-purpose user I/O |
| 腳位 C3 | I/O — General-purpose user I/O |
| 腳位 D4 | I/O — General-purpose user I/O |
| 腳位 E5 | I/O — General-purpose user I/O |
| 腳位 F6 | GND — Ground (FC-BGA substrate balls and PCB ground) |
| 腳位 G7 | VCC — Core supply 1.1 V |
| 腳位 H8 | VCCIO — I/O bank supply (per bank VCCIO) |
| 腳位 J9 | I/O — General-purpose user I/O |
| 腳位 K10 | I/O — General-purpose user I/O |
| 腳位 L11 | I/O — General-purpose user I/O |
| 腳位 M12 | I/O — General-purpose user I/O |
| 腳位 N13 | I/O — General-purpose user I/O |
| 腳位 P14 | CONFIG — Configuration pin (MSEL/DATA/TCK family) |
| 腳位 R15 | JTAG_TCK — JTAG test clock |
| 腳位 T16 | JTAG_TMS — JTAG test mode select |
典型應用
EP3SL340F1760C4 適用於 7 應用s: ASIC Prototyping and Emulation, High-Performance DSP Pipeline, Networking Line-Card Packet Processing, Video Broadcast and Image Processing, Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Medical Imaging Accelerator.
ASIC Prototyping and Emulation
The EP3SL340F1760C4 fits ASIC prototyping because its 337,500 logic elements and 1,120 user I/Os can map full SoC designs before tape-out. Per the Stratix III Device Handbook, the device supports partition-based incremental compilation in Quartus II, allowing multi-engineer team workflows to converge on a single bitstream. The 1.1 V core and 1760-ball FC-FBGA package deliver the logic density and pin-count needed to host multi-million-gate ASICs in a single device. Trade-off: emulation runs at 50-200 MHz typical versus GHz ASIC targets, so designers must plan for timing multiplication.
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High-Performance DSP Pipeline
The EP3SL340F1760C4 fits high-throughput DSP because its dedicated hardware multiplier blocks and 18,821,144 embedded memory bits enable FIR, FFT, and matrix-multiply pipelines at hundreds of MSPS. Per the Stratix III Device Handbook, the Stratix III L family's variable-precision DSP blocks support 9x9, 18x18, and 36x36 multiplications without consuming general logic. The 450 MHz core Fmax (C4 grade) is sufficient for radar baseband, software-defined radio channelizers, and medical image reconstruction kernels. Trade-off: latency is deterministic but throughput is fixed by silicon resources.
推薦
Networking Line-Card Packet Processing
The EP3SL340F1760C4 fits 10G/40G networking line cards because its 1,120 user I/Os expose multiple SFI/XFI lanes, and embedded transceivers (where populated on the variant) support 3.125 Gbps and 6.375 Gbps SERDES rates. Per the Stratix III Device Handbook, the device includes a hard PCIe Gen1/Gen2 IP block for direct host offload, and OCT simplifies board-level termination for LVDS-based RapidIO and SPI-4.2 interfaces. The 18 Mbits of embedded memory buffer packet descriptors efficiently. Trade-off: per-port cost is high compared to fixed-function NPUs.
推薦
Video Broadcast and Image Processing
The EP3SL340F1760C4 fits video broadcast because 337.5K logic elements and abundant LVDS pairs (the 1760-ball FC-FBGA supports hundreds of LVDS channels) can drive multi-link HD-SDI, 3G-SDI, and DisplayPort interfaces simultaneously. Per the Stratix III Device Handbook, on-chip memory (18 Mbits) and dedicated DSP blocks deliver real-time 4:2:2 to 4:4:4 chroma upsampling and HDR tone mapping at 1080p60 line rates. Embedded memory also enables line buffers and motion-estimation search windows without external DDR. Trade-off: power consumption scales with active logic and SERDES lane count.
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Test and Measurement Instrumentation
The EP3SL340F1760C4 fits test and measurement because its 450 MHz core Fmax and high I/O count support arbitrary waveform generation, real-time protocol decoding, and deep trace capture at gigasample-per-second rates. Per the Stratix III Device Handbook, the device integrates PLLs with sub-picosecond jitter, and OCT eliminates external termination resistors that would otherwise introduce parasitic distortion on fast-edge signal paths. The 18 Mbits of embedded memory backstop deep trace FIFO. Trade-off: instrument calibration must compensate for the Stratix III L I/O skew at sub-nanosecond rise times.
推薦
Military and Aerospace Signal Processing
The EP3SL340F1760C4 fits defense signal processing because of the Stratix III family's MIL-STD-883 and aerospace-qualified variants (separate part numbers), and its logic density supports electronic-warfare, radar, and secure-comms workloads in a single device. Per the Stratix III Device Handbook, the device offers partial reconfiguration for in-mission mode changes, and built-in error-detection features assist single-event-upset mitigation. The 1,120 I/Os connect to multi-channel RF digitizers and DACs. Trade-off: aerospace-grade screening adds cost and lead time beyond standard commercial parts.
推薦
Medical Imaging Accelerator
The EP3SL340F1760C4 fits medical imaging (CT, MRI, ultrasound beamforming) because its 337.5K logic elements deliver the parallelism needed for back-projection, FFT-based reconstruction, and real-time Doppler processing. Per the Stratix III Device Handbook, the Stratix III L DSP blocks support 36x36 multiplications natively for back-projection kernels, and embedded memory buffers sinogram lines without external DRAM stalls. The 1,120 I/Os accept multi-channel LVDS data from high-speed ADCs. Trade-off: medical certification (IEC 60601) requires additional board-level design controls beyond FPGA selection.
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推薦產品摘要
工程參考資料，適用於 EP3SL340F1760C4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL340F1760C3 | EP3SL340F1760C2 | EP3SL340F1517I4 | EP3SE260F1152C4 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1517-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 260,000 |
| Embedded Memory Bits | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | Higher per-LE memory (Stratix III E enhanced) |
| User I/O Count | 1,120 | 1,120 | 1,120 | approx 976 (1517-ball package) | approx 744 (1152-ball package) |
| Speed Grade | C4 (slowest) | C3 (faster) | C2 (fastest) | I4 (industrial, slower) | C4 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主要差異化特點
- Highest-density Stratix III L with 1,120 I/Os (對比EP3SE260F1152C4)
- Logic-optimized versus memory-optimized Stratix III variant (對比EP3SE260F1152C4)
- Industry-standard Quartus II toolchain support (對比Xilinx Virtex-6 / Kintex-7 equivalent parts)
設計說明
Estimated: the EP3SL340F1760C4 at 100% utilization with all 1,120 I/Os switching can dissipate 15 to 25 W depending on toggle rate and SERDES activity. The 1760-ball FC-FBGA package requires a top-side thermal interface material (TIM) plus heatsink or cold plate. For bench characterization, use a wind-tunnel at 200 LFM minimum and monitor junction temperature via the on-chip Altera/Intel temperature-sense diode (accessible through JTAG).
The 1760-ball FC-FBGA package demands a 12-layer PCB minimum, with stacked microvia (laser-drilled) construction for the inner rows that are not accessible through-hole. Per the Stratix III Device Handbook pin-out guidelines, route differential pairs (LVDS, SERDES) with 100 ohm differential impedance and length-match to within 5 mils. Keep the 1.1 V core plane and a dedicated GND plane on adjacent layers to provide a low-impedance return path for the high-current core supply.
Power-on sequencing requires VCCIO to reach 0.6 V before VCC ramps to 1.1 V, per the Stratix III Device Handbook. Use a power-supply sequencer (such as a TI LM3880 or LTC2923) to enforce the ordering. The 1.1 V rail must source up to 15 A transient during full logic utilization; use a buck regulator with at least 25 A capability and place the bulk capacitors (470 uF polymer) within 25 mm of the BGA balls. Estimate: at 15 A the regulator copper plane must carry 1.5 oz copper on multiple layers.
Do not confuse the EP3SL340F1760C4 (Stratix III L, logic-optimized) with the EP3SE260F1152C4 (Stratix III E, memory-optimized) when sourcing. They share the Quartus II software toolchain but differ significantly in LE-to-memory ratio. Also avoid using C4 timing models when targeting a C2 or C3 device - timing closure will be inconsistent. Finally, verify JTAG chain ordering before mass programming; the Stratix III Device Handbook contains the BSDL files needed for boundary-scan verification.
合規資訊
RoHS compliant per Altera/Intel product page; AEC-Q100 not applicable for an FPGA IC (qualification applies at the board/system level, not the FPGA itself); conflict-mineral reporting compliant per Intel supplier program.
