EP3SL340H1152C3 - Stratix III L FPGA, 337.5K Cells, 1152-BGA | Intel
MPN： EP3SL340H1152C3 ✗ 停產EP3SL340H1152C3 概覽
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic is defined after manufacturing by loading a configuration bitstream into on-chip SRAM memory. FPGAs sit in the broader category of programmable logic devices (PLDs), which also includes CPLDs; FPGAs extend this concept to very high logic densities, embedded block RAM, DSP blocks, and multi-gigabit transceivers. Designers choose FPGAs to accelerate parallel algorithms, implement custom interfaces, and reduce PCB area by integrating glue logic and protocol bridges that previously required multiple ASICs.
The Stratix III L sub-series is engineered for logic-intensive workloads where routing flexibility and DSP throughput matter more than maximum transceiver count. The EP3SL340H1152C3 supports 744 user I/O pins via the 1152-pin FCBGA package, which exposes the device's full I/O bank count. Embedded block RAM, DSP blocks, and high-speed serial transceivers operate from dedicated power rails and are programmable through Intel's Quartus II design suite.
Typical applications include high-speed digital signal processing cards, telecommunications line cards, ASIC prototyping, image processing pipelines, and high-performance computing coprocessors. The 1.1 V core Vcc and separate VccPD, VccPT power domains are supplied through dedicated pins; PCB designers must follow Intel's power decoupling and ground-bonding guidelines.
When designing with the EP3SL340H1152C3, ensure the PCB has at least 6 dedicated ground bond-out pins per quadrant to support the package's thermal and signal-integrity requirements. Configuration can be loaded via JTAG, fast passive parallel, or a configuration flash, all of which are documented in the Stratix III handbook. Pricing is on the order of thousands of dollars per unit at low quantities.
This page synthesizes distributor pricing, drop-in same-family alternatives, and Stratix III L design notes not consolidated in the manufacturer datasheet. Engineers selecting the EP3SL340H1152C3 should also consult Intel's Stratix III Device Handbook for full pinout, timing, and power-supply sequencing guidance.
直接替換替代品，適用於 EP3SL340H1152C3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL340H1152C3 （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, Operating Temperature Grade, Configuration Memory.
EP3SL340H1152C2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SL340H1152C2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SL340F1152I3N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP3SL340H1152C3 最大額定值與電氣特性
| Family | Stratix III L |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (Cells) | 337,500 |
| LABs | 13,500 |
| Maximum User I/O Pins | 744 |
| Total Internal Memory Bits | 18,822,144 |
| Core Supply Voltage (VccINT) | 1.1 V |
| Core Fabric Frequency | 717 MHz |
| Process Technology | 65 nm CMOS |
| 封裝 | 1152-ball FCBGA (HBGA) |
| 安裝類型 | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | C3 |
| Configuration Method | JTAG / Passive Parallel / Active Serial / Configuration Flash |
EP3SL340H1152C3 1152-ball fcbga (hbga) 腳位配置指南
EP3SL340H1152C3（1152-ball fcbga (hbga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL340H1152C3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL340H1152C3 適用於 6 應用s: High-Speed Digital Signal Processing Card, Telecommunications Line Card, ASIC Prototyping Platform, Image Processing Pipeline, High-Performance Computing Coprocessor, Industrial Control and Test Equipment.
High-Speed Digital Signal Processing Card
The EP3SL340H1152C3 fits high-density DSP cards because its 337,500 logic elements and embedded DSP blocks deliver parallel multiply-accumulate throughput for radar, beamforming, and software-defined radio baseband. The 1.1 V VccINT combined with 744 user I/Os allows the device to interface to high-speed DDR2/DDR3 memories and multi-channel analog-to-digital converters in the same board. Quartus II synthesis places DSP-intensive kernels across the Stratix III L fabric while preserving timing margins in the 717 MHz core. Designers using this FPGA benefit from its block-RAM-rich architecture, which is critical for FFT windowing buffers and channelization filters. PCB layout uses the 1152-ball HBGA for controlled-impedance routing to the memory and ADC banks.
推薦
Telecommunications Line Card
Telecom line cards rely on FPGAs to bridge between backplane SERDES, network processors, and TDM/Ethernet framer ASICs. The EP3SL340H1152C3 provides 744 user I/Os which is sufficient for multi-port line card designs, and its 1152-ball FCBGA package supports the high pin density needed for parallel datapath routing. According to Stratix III literature, the L sub-family is well matched to control-plane logic and protocol translation rather than raw transceiver count. Combined with external PHY chips, this FPGA can implement MAC, framing, and traffic management functions. Industrial-temperature variants (-40C to +100C) are preferred for central-office deployments, so the I-grade speed grade is the recommended choice for telecom.
推薦
ASIC Prototyping Platform
ASIC prototyping on FPGAs requires very high logic capacity and abundant block RAM to emulate large ASIC designs at full speed. The EP3SL340H1152C3's 337,500 logic elements and 18.8 Mbit of embedded block RAM make it a strong candidate for emulating mid-complexity ASICs such as baseband processors, image signal processors, and custom AI inference pipelines. The 1152-ball FCBGA exposes all I/O banks so designers can map ASIC pins directly to FPGA pins via Quartus II pin assignments. Multi-FPGA partitioning tools break the ASIC netlist across multiple EP3SL340 devices on a single prototyping board, achieving near-ASIC verification speeds.
推薦
Image Processing Pipeline
Real-time image processing pipelines for medical imaging, machine vision, and surveillance require parallel pixel-domain arithmetic. The EP3SL340H1152C3 with its 337,500 logic elements and abundant block RAM implements convolution kernels, color-space converters, and motion estimators at HD and 4K resolutions. The 744 user I/Os accept parallel camera sensor inputs and feed DDR memory buffers for line-store processing. According to Stratix III literature, the L sub-family is DSP-block-rich, which accelerates fixed-point pixel multiply-accumulate loops. PCB designers use the 1152-ball HBGA for controlled-impedance routing to the camera and memory interfaces.
推薦
High-Performance Computing Coprocessor
Coprocessor cards in HPC and AI workloads offload parallel kernels from the host CPU onto FPGAs. The EP3SL340H1152C3 with 337,500 logic elements and embedded DSP blocks accelerates vector dot-products, matrix multiplication, and cryptographic primitives in OpenCL or RTL flows. The 1.1 V VccINT and dedicated PLL count support multi-clock domain designs, which is essential when bridging between the host PCIe interface and external DDR memory. Quartus II HLS flows let software engineers target the device from OpenCL kernels. The 1152-ball FCBGA supports the high pin density required for multi-channel DDR3/DDR4 memory interfaces.
推薦
Industrial Control and Test Equipment
Industrial controllers and automated test equipment require deterministic logic and high I/O density. The EP3SL340H1152C3 delivers 744 user I/Os which is sufficient for multi-axis motion controllers, PXI cards, and high-channel-count data acquisition systems. Its 337,500 logic elements host custom state machines, timing generators, and on-the-fly DSP. The 65 nm CMOS process provides the noise immunity required for factory-floor deployment. Industrial temperature variants such as EP3SL340H1152I3 are recommended for harsh environments, while the commercial-grade EP3SL340H1152C3 is reserved for lab and OEM integration.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL340H1152C3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL340H1152C2N | EP3SL340H1152C2 | EP3SL340F1152I3N |
|---|---|---|---|---|
| Package | 1152-ball FCBGA (HBGA) | 1152-ball FCBGA (HBGA) - same | 1152-ball FCBGA (HBGA) - same | 1152-ball FCBGA - same ball count, different ball map |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | C3 | C2 (slower) | C2 (slower) | I3 (industrial temp, same speed) |
| Maximum User I/O | 744 | 744 | 744 | 744 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest logic element density in the Stratix III L family at the 1152-ball HBGA tier (對比EP3SL200H780C3)
- Logic-optimized fabric for DSP and control-plane workloads (對比EP3SE260H1152C3)
- Same-footprint industrial temperature option available (對比EP3SL340H1152I3)
設計說明
The EP3SL340H1152C3 requires at least four separate power rails: VccINT (1.1 V core), VccPD (I/O pre-driver), VccPT (transceiver analog), and VccIO (per-bank I/O). Each rail must have its own decoupling network with bulk, mid-frequency, and high-frequency ceramic capacitors placed as close as possible to the package balls. According to Intel's Stratix III power management guidelines, the VccINT rail must ramp monotonically and reach 90% of its nominal value within the prescribed time to avoid configuration failure.
Estimated: at full logic utilization with 100% toggle rate, the EP3SL340H1152C3 can dissipate 10-15 W. The 1152-ball FCBGA requires a substantial PCB thermal solution including inner ground planes and thermal vias under the die. Designers should simulate junction temperature using Quartus II PowerPlay early in the design cycle. For systems without airflow, derate the design or migrate to the lower-density Stratix III family members.
The 1152-ball FCBGA package has a 1.0 mm ball pitch, which requires microvia or fine-line PCB technology. Stack-up planning must include controlled-impedance layers for high-speed I/O and SERDES, plus dedicated ground bond-out balls per quadrant. According to Intel's package guidelines, at least 6 ground balls per quadrant must be soldered for thermal and signal-integrity integrity. Use a 4-2-4 or 6-2-6 stack-up for 50 ohm single-ended and 100 ohm differential routing.
Do not confuse the EP3SL340H1152C3 (Stratix III L) with the EP3SE260H1152C3 (Stratix III E); they use the same 1152-ball HBGA but have different ball maps. Designers should always verify the ball map against the device-specific pin tables in volume 1 of the Stratix III handbook before PCB layout. Mixing the two dies will result in incorrect I/O mapping and non-functional hardware.
合規資訊
RoHS and lead-free status were not available in the verified web data for the EP3SL340H1152C3. Markers [DATA_NEEDED: rohs status] and [DATA_NEEDED] are used for these fields.
