EP3SL340H1152C2N - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel
MPN： EP3SL340H1152C2N ⚠ 最後購買機會EP3SL340H1152C2N 概覽
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed after manufacturing. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs, microcontrollers, and DSPs as building blocks of modern digital systems. The Stratix III L family specifically emphasizes low-power, high-logic-density designs with dedicated DSP blocks, embedded TriMatrix memory, and high-speed serial transceivers, occupying the high-end tier of Intel's (formerly Altera's) programmable logic portfolio.
Key differentiating features include 337,500 logic elements (LEs) for fine-grained parallel processing, 18,822,144 embedded memory bits for wide data buffering without external SRAM, 744 dedicated hardware multipliers (18x18) for fixed- and floating-point DSP acceleration, and integrated PLLs for multi-domain clock management. The flip-chip 1152-BGA package exposes the full I/O count and high-performance serial interface pins while delivering a low-inductance power distribution network.
Architecturally, the EP3SL340H1152C2N combines LUT-based adaptive logic modules (ALMs), TriMatrix memory blocks (MLAB, M9K, M144K), DSP blocks, and clock networks routed across a multi-tier interconnect. The 65 nm process and Stratix III L variant minimize dynamic power via programmable power technology, allowing unused fabric regions to be put into a low-power state without losing state. Compared with discrete processor-plus-DSP solutions, the integrated fabric yields deterministic latency and far higher parallel throughput.
Typical applications include high-end telecommunications baseband and backhaul cards, real-time digital signal processing for radar and medical imaging, ASIC prototyping, high-performance computing accelerators, and broadcast video processing. Designers choose this device when the design exceeds the logic, memory, or DSP budget of smaller FPGAs or when deterministic parallel throughput is required.
A practical design consideration is power delivery: the 1152-BGA package requires a multi-rail PDN with bulk decoupling at each supply island and high-frequency ceramics under the BGA via field. PCB stack-up should target 1-oz copper inner planes with microvia access to inner pads to meet the simultaneous-switching output (SSO) noise budget.
This page synthesizes distributor pricing, drop-in Stratix III L alternatives from the Site MPN catalog, and practical design notes not found in the manufacturer datasheet alone, enabling faster BOM selection and PCB reuse across related part numbers.
直接替換替代品，適用於 EP3SL340H1152C2N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL340H1152C2N （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Family.
EP3SL340H1152C2
✅ 直接替換聯絡詢價
查看資料表 →EP3SL200H780C2N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE260H780C2N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1760I4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE260F1152C2N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL110F1152C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340H1152C2N 最大額定值與電氣特性
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory Bits | 18,822,144 |
| DSP Blocks (18x18 multipliers) | 744 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 0.9 V |
| Auxiliary / I/O Supply | 1.1 V |
| Maximum Fabric Frequency | 600 MHz |
| 封裝 | 1152-Ball FC-HFBGA (flip-chip) |
| 安裝類型 | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead-free (per distributor listing) |
| Operating Temperature Grade | Commercial |
| Speed Grade | C2 (moderate) |
| JTAG Support | IEEE Std 1149.1 Boundary-Scan |
| 記憶體類型 | TriMatrix (MLAB + M9K + M144K) |
EP3SL340H1152C2N 1152-ball fc-hfbga (flip-chip) 腳位配置指南
EP3SL340H1152C2N（1152-ball fc-hfbga (flip-chip) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL340H1152C2N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL340H1152C2N 適用於 6 應用s: Telecommunications Baseband Processing, Real-Time DSP for Radar and Imaging, ASIC Prototyping and Emulation, High-Performance Computing Acceleration, Broadcast Video Processing, Industrial Automation and Control.
Telecommunications Baseband Processing
The EP3SL340H1152C2N fits high-throughput baseband and backhaul cards where 337,500 logic elements and 744 dedicated 18x18 hardware multipliers enable multi-channel FFT, channel coding, and modulation in a single device. Its 18 Mbits of TriMatrix embedded memory buffers large symbol maps without external SRAM, while the 1152-BGA exposes enough user pins to interface multiple SFP+/QSFP links. Designers route the 0.9V core and 1.1V auxiliary through a multi-rail PDN with bulk ceramics under each supply island to meet SSN budgets.
推薦
Real-Time DSP for Radar and Imaging
With 744 hardware multipliers and deterministic parallel fabric, the EP3SL340H1152C2N is well matched to real-time radar, sonar, and medical-imaging pipelines. Pulse compression, beamforming, and FFT stages map cleanly onto the DSP block array, and the 18 Mbit embedded memory holds sample windows at full ADC rate. The flip-chip 1152-BGA offers low inductance for the simultaneous-switching ADC/DAC interfaces, preserving SNR at hundreds of MHz sample rates.
推薦
ASIC Prototyping and Emulation
Designers use the EP3SL340H1152C2N as an ASIC prototype target because the 337.5K LE, 18 Mbit memory, and 744 multipliers map cleanly onto mid-complexity ASIC RTL. The device supports multi-FPGA partitioning via LVDS and SERDES links, and the JTAG IEEE 1149.1 boundary scan plus SignalTap logic analyzer instances provide real-time debug without external probes. Pin-compatible Stratix III siblings let a prototype re-spin re-use the same PCB while increasing or reducing logic capacity.
推薦
High-Performance Computing Acceleration
The EP3SL340H1152C2N serves as a compute accelerator for HPC and financial workloads where massive bit-level parallelism outperforms CPUs. 337,500 logic elements run many parallel arithmetic units per clock, while 744 hardware multipliers deliver sustained GMACs for Monte Carlo or option-pricing kernels. The 1152-BGA exposes PCIe-like edge pinout patterns and high-speed LVDS lanes for host-link integration, and the Stratix III L fabric targets low dynamic power relative to earlier Stratix families.
推薦
Broadcast Video Processing
The EP3SL340H1152C2N is used in broadcast video routers, format converters, and multi-channel encoders. Its 337,500 logic elements implement multiple parallel video pipelines at 3G-SDI / 6G-SDI rates, while 18 Mbits of embedded memory line-buffer video frames without external DDR. The 1152-BGA's high user-pin count connects to multiple SDI transceivers simultaneously. Designers pick this part over smaller FPGAs to consolidate multiple video channels onto one silicon device.
推薦
Industrial Automation and Control
The EP3SL340H1152C2N supports high-channel-count industrial automation where many sensors, actuators, and communication interfaces are processed in parallel. 337,500 logic elements implement EtherCAT, Profinet, and EtherNet/IP stacks, while 744 multipliers handle real-time control loops. The Stratix III L family offers Programmable Power Technology for unused fabric to reduce dynamic power in long-running factory installations. The 1152-BGA integrates cleanly onto backplanes with high pin-count sensor headers.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL340H1152C2N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL340H1152C2 | EP3SL200H780C2N | EP3SE260H780C2N | EP3SL340F1760I4N | EP3SE260F1152C2N | EP3SL110F1152C4N |
|---|---|---|---|---|---|---|---|
| Package | 1152-BGA (FC-HFBGA) | 1152-BGA (FC-HFBGA) - same | 780-BGA | 780-BGA | 1760-BGA | 1152-BGA | 1152-BGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 337,500 | 337,500 | 200,000 | 256,000 | 337,500 | 256,000 | 107,500 |
| Embedded Memory (bits) | 18,822,144 | 18,822,144 | 9,663,744 | 13,475,712 | 18,822,144 | 13,475,712 | 5,810,688 |
| DSP Blocks (18x18 multipliers) | 744 | 744 | 384 | 384 | 744 | 384 | 192 |
| Family / Sub-Series | Stratix III L | Stratix III L | Stratix III L | Stratix III E | Stratix III L | Stratix III E | Stratix III L |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主要差異化特點
- Higher logic density at 337,500 LEs (對比EP3SL200H780C2N)
- Higher DSP block count (對比EP3SE260F1152C2N)
- Compact 1152-BGA with full I/O access (對比EP3SL340F1760I4N)
- Stratix III L low-power architecture (對比EP3SE260H780C2N)
設計說明
The EP3SL340H1152C2N requires a multi-rail power distribution network: 0.9 V VCC core, 1.1 V VCCAUX/PLL analog, and per-bank VCCIO rails. Place bulk electrolytic or polymer capacitors at the BGA edge with at least one 10 uF X5R ceramic per supply island. High-frequency decoupling should use 0.1 uF and 1 nF X7R ceramics under the BGA via field. Decoupling budgets of ~30-50 bulk + 100+ ceramic caps per device are typical for dense 1152-BGA designs.
Estimated: at 100% fabric utilization with 600 MHz clock, the EP3SL340H1152C2N can dissipate 8-12 W. The flip-chip 1152-BGA requires a thermal pad or top-side heatsink attached to the lid. Ensure PCB stack-up routes thermal vias (0.3 mm pitch, 12+ vias under BGA center) to an internal copper plane. Without thermal management, junction temperature can exceed 100 C in poorly ventilated enclosures.
The 1152-ball flip-chip BGA requires microvia or via-in-pad construction to escape the inner rows. Recommended PCB stack-up is at least 8 layers with 1-oz copper inner planes and a high-Tg FR-4 dielectric. Match BGA pad pitch (1.0 mm typical for this package) to the PCB fab capability. Maintain a continuous reference plane under the BGA via field to control impedance of high-speed SERDES and LVDS lanes.
Do not confuse the Stratix III L (low-power) sub-series with the Stratix III E (enhanced logic/memory) sub-series - they differ in DSP/memory ratios and power. Verify pinout against the device-specific handbook addendum, not the family handbook, because BGA ball maps vary by density grade. Confirm all VCCIO banks match the I/O voltage of attached peripherals before board bring-up to avoid I/O damage.
Route SERDES differential pairs (TX/RX) with 100 ohm differential impedance and keep lengths matched within 150 mil. Separate clock inputs from switching I/O by at least 3x the trace spacing rule. Place JTAG TDI/TDO/TMS/TCK at the BGA edge to allow easy test header access. Keep PLLs powered by quiet 1.1 V with a pi-filter (ferrite bead + capacitors) to minimize jitter.
合規資訊
Lead-free per distributor listing. RoHS compliant. AEC-Q100 not applicable for FPGAs (different qualification standard). Halogen-free status not stated in available data. Conflict-minerals compliance per Intel standard policy.
