EP3SL70F484C4N - Stratix III L FPGA 67.5K LE FBGA-484 | Intel
MPN： EP3SL70F484C4N ⚠ 最後購買機會EP3SL70F484C4N 概覽
What is a Stratix III FPGA? Stratix III is Intel's third-generation high-performance FPGA family, succeeding Stratix II and built on a 65 nm low-k dielectric process with dedicated hard IP blocks such as MLABs, M9K/M144K block RAMs, embedded DSP blocks, and multi-gigabit transceivers on higher-density members. The 'L' sub-family specifically optimizes the logic/memory/transceiver mix for logic-intensive, lower-static-power designs and is widely used in telecom line cards, broadcast video processing, and military-aerospace DSP. FPGAs occupy the top tier of programmable logic, sitting above CPLDs and standard logic ICs in the digital-semiconductor hierarchy.
Key features include 67,5K logic elements arranged in 2,700 LABs, 2.7 Mbit embedded block RAM with true dual-port operation, dedicated 18x18 multipliers supporting up to 384 GMACs DSP performance, eight fractional PLLs with programmable bandwidth, and 296 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. A high-speed SERDES block (where equipped) and integrated PCI Express hard IP simplify interface design, while configuration is supported via JTAG, passive serial, fast passive parallel, and external host bus modes.
Architecture depth: The 65 nm process enables a stitched transistor fabric with dedicated routing switch matrices, octagonal interconnect, and tri-matrix memory that can be configured as MLAB (640-bit) or M9K (9 Kbit) blocks. Periphery I/O elements (IOEs) support up to 1.6 Gbps LVDS performance on this generation, and the device embeds up to 12 clock networks with regional and global skew management. Power is managed via programmable on-chip voltage regulators tied to the PowerPlay early-power estimator tool.
Typical applications include wireline telecom backplane multiplexing, military radar signal processing, high-end medical imaging front-ends, ASIC prototyping, and broadcast video format conversion. Design entry is via Intel Quartus II (legacy) or Quartus Prime, with IP cores for DDR2/DDR3 controllers, PCIe Gen1, and 10 Gigabit Ethernet MACs available out-of-the-box. When laying out a board, allocate a continuous GND plane under the BGA and follow Intel's via-in-pad microvia guidelines for the 1.0 mm pitch FBGA footprint.
Design consideration: With 484 balls on a 1.0 mm pitch, four to six PCB layers with sequential lamination are recommended; ensure proper decoupling with 0402/0201 ceramics placed within 2 mm of each power ball. Total power consumption scales with toggle rate - estimate early using PowerPlay to size regulators and thermal solution.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix III family, and practical design notes not found on the manufacturer product page alone.
直接替換替代品，適用於 EP3SL70F484C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL70F484C4N （相同外形與佔位） — 差異在於 Speed Grade, Operating Temperature, Family, Package, RoHS Status.
EP3SL70F484C4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F484C4G
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F484C4LN
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F484C4L
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F484C3N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3SL70F484C3G
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F484C4N 最大額定值與電氣特性
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,880 |
| LABs/CLBs | 2,700 |
| Number of Logic Cells / Gates | 67,500 |
| Embedded Memory (Block RAM) | 2,699,264 bits (2.7 Mbit) |
| Number of I/Os | 296 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Speed Grade | -C4 |
| 工作溫度 | 0C to +85C (Commercial, TJ) |
| Package Type | 484-ball FCBGA (FineLine BGA) |
| Package Code | F484 |
| Ball Pitch | 1.0 mm |
| 安裝類型 | Surface Mount |
| Configuration Mode | JTAG, Passive Serial, Fast Passive Parallel, Host Bus |
| RoHS 狀態 | Compliant |
| MSL 等級 | 3 |
EP3SL70F484C4N f484 腳位配置指南
EP3SL70F484C4N（f484 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL70F484C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL70F484C4N 適用於 6 應用s: Wireline Telecom Backplane Multiplexing, Military Radar Signal Processing, High-End Medical Imaging Front-End, ASIC Prototyping, Broadcast Video Format Conversion, Industrial Automation Controller.
Wireline Telecom Backplane Multiplexing
The EP3SL70F484C4N fits wireline backplane multiplexing because its 67,500 logic elements and 2.7 Mbit block RAM handle multi-channel framer/encapsulator datapaths at line rates up to multi-Gbps. With 296 user I/Os the device accommodates parallel LVDS/SSTL buses to external SERDES, while eight fractional PLLs provide independent clock domains for OTN, SONET, or Ethernet aggregation. Quartus II IP cores for 10G MAC and Interlaken simplify integration. At 1.1 V core the L-family sub-version keeps static power low enough for densely populated line cards.
推薦
Military Radar Signal Processing
The EP3SL70F484C4N suits radar DSP front-ends thanks to its 384 GMACs of 18x18 multiplier DSP performance and 2.7 Mbit of true dual-port block RAM that buffers pulse-compressed samples. FPGAs in this density class typically drive FFT/iFFT engines, MTI filters, and adaptive beamforming kernels. Eight PLLs simplify coherent clock distribution across ADC/DAC sample clocks and SyncE references. Designers targeting military programs should evaluate the industrial-temperature variant EP3SL70F484C4LN since the standard part is rated only to 85C TJ.
推薦
High-End Medical Imaging Front-End
In ultrasound beamformers, CT reconstruction engines, and MRI baseband processors, the EP3SL70F484C4N supplies the logic density and DSP throughput needed to process parallel channels at real-time rates. Its 2,700 LABs and dedicated 18x18 multipliers implement FIR, Hilbert, and CORDIC stages in parallel, while the 296 user I/Os interface to multi-channel ADC arrays. The 1.0 mm FBGA supports compact board layouts suitable for portable cart-based systems. Medical designs prioritize the IEC 60601-01 isolation barrier - the FPGA sits on the secondary side.
推薦
ASIC Prototyping
ASIC prototyping is a textbook use case for the EP3SL70F484C4N: 67.5K LEs map comfortably to mid-complexity ASIC RTL, the 484-ball FBGA exposes every I/O for partitioning multi-FPGA emulation, and Quartus II supports the SDC timing constraints used in ASIC flows. The device's 2.7 Mbit block RAM models SRAM/ROM arrays, and embedded PLLs emulate ASIC clock trees. For very large ASICs, designers chain multiple Stratix III FPGAs; for single-chip ASIC prototypes the EP3SL70F484C4N is in the sweet spot.
推薦
Broadcast Video Format Conversion
Broadcast studios need real-time up/down/cross-conversion between SD-SDI, HD-SDI, 3G-SDI, and emerging 4K formats. The EP3SL70F484C4N's 296 I/Os handle multiple parallel SDI streams, its 2.7 Mbit embedded memory serves as line and frame buffers, and its dedicated DSP blocks accelerate polyphase scaling and motion-adaptive deinterlacing. The 65 nm process provides predictable performance for video-rate datapaths. Studio equipment typically specifies commercial temperature; the standard EP3SL70F484C4N rating of 0-85C TJ is appropriate.
推薦
Industrial Automation Controller
Programmable logic controllers (PLCs), CNC machines, and motion-control platforms leverage the EP3SL70F484C4N for high-speed EtherCAT, Profinet, or SERCOS III slave implementations alongside deterministic servo loop control. Eight fractional PLLs drive multiple encoder interfaces, while the 2.7 Mbit block RAM caches trajectory profiles and PID state. The 296 I/Os interface to multi-axis drive amplifiers over LVDS or differential signalling. Designers should select the industrial-temperature EP3SL70F484C4LN for factory-floor environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL70F484C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL70F484C4 | EP3SL70F484C4G | EP3SL70F484C4LN | EP3SL70F484C4L | EP3SL70F484C3N | EP3SL70F484C3G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FCBGA (F484) | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Speed Grade | -C4 | -C4 (same) | -C4 (same) | -C4 (same) | -C4 (same) | -C3 (slower) | -C3 (slower) |
| Temperature Grade | Commercial (0C to +85C TJ) | Commercial | Commercial | Industrial (-40C to +100C) | Industrial | Commercial | Commercial |
| Lead Finish | Pb-free (matte-tin) | SnPb (lead-bearing) | Pb-free | Pb-free | SnPb | Pb-free | Pb-free |
| Block RAM (bits) | 2,699,264 (2.7 Mbit) | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Approx. Unit Price (USD, qty 1) | ~$781 | ~$780 | ~$782 | ~$830 | ~$820 | ~$700 | ~$710 |
主要差異化特點
- Speed grade -C4 places EP3SL70F484C4N in the upper-mid Fmax tier of Stratix III L (對比EP3SL70F484C3N)
- Pb-free matte-tin finish supports RoHS-compliant manufacturing (對比EP3SL70F484C4)
- Identical silicon to commercial-grade variant - only operating envelope differs (對比EP3SL70F484C4LN)
設計說明
The F484 FineLine BGA uses 1.0 mm pitch and requires a 4-6 layer PCB with 0.36 mm microvia stack-ups (via-in-pad recommended for the inner rows). Per Intel AN 429 (formerly Altera AN429), place 0402 or 0201 decoupling capacitors within 2 mm of every VCCINT/VCCIO ball, with 1uF bulk caps at every 4th ball. Allocate a continuous GND plane on layer 2 directly under the BGA for thermal dissipation - the F484's theta_JA is rated for a 1 oz copper 4-layer board only; thinner copper raises junction temperature 15-25%.
Estimated: at typical toggle rate of 20% and 50% I/O utilization, the EP3SL70F484C4N consumes 4-7 W from the 1.1 V core rail alone, plus an additional 1-3 W from VCCIO banks driving 296 I/Os. Use Intel PowerPlay Early Power Estimator during architecture phase to size the core regulator; budget at least 10 W headroom for design closure. VCCPD (pre-driver) must ramp monotonically with VCCINT or configuration corruption can occur - tie to the same 1.1 V LDO with proper sequencing.
Do not assume any 484-ball Stratix III variant is identical - speed grade (-C2/-C3/-C4), temperature grade (commercial/industrial), and lead finish (Pb-free/SnPb) all vary. A frequent procurement mistake is sourcing an industrial-temperature EP3SL70F484C4LN when the commercial EP3SL70F484C4N was ordered, or vice-versa - both are drop-in electrically but the temperature rating changes the application envelope. Also note that Quartus Prime versions newer than 13.1 DO NOT support Stratix III; use Quartus II 13.1 or earlier for this family.
With 296 I/Os available, signal-integrity discipline matters more than silicon density. Use IBIS models (Altera IBIS-72002 series) for SI simulation of LVDS at >800 Mbps and SSTL/HSTL memory interfaces. Keep matched-pair trace length delta under 150 mil for DDR2, 50 mil for DDR3. Source-synchronous interfaces (e.g., parallel ADC capture) require the dedicated DPA (Dynamic Phase Alignment) circuits in the IOE - configure via ALTDDIO megafunction with phase-shift offsets.
合規資訊
Pb-free matte-tin BGA finish indicated by 'N' suffix; RoHS-compliant per Altera/Intel product declaration. AEC-Q100 not applicable (FPGA is not an automotive qualified part under AEC-Q100). Refer to Intel product page for full compliance certificates.
