EP4CGX110DF27C7 - Cyclone IV GX FPGA, 110K LE, 672-BGA | Intel
MPN： EP4CGX110DF27C7 ✓ 啟用中EP4CGX110DF27C7 概覽
FPGAs are user-programmable semiconductor devices built from a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, block RAM, and DSP slices. Within the broader IC hierarchy, an FPGA sits between general-purpose processors and fixed-function ASICs, offering higher performance than software on a CPU and lower NRE cost than a full custom ASIC for medium-volume production. The Cyclone IV GX family specifically targets cost-sensitive applications needing 3.125 Gbps transceivers without the power or price of high-end Stratix-class parts.
Key specifications include a 1.2 V core supply with hot-socketing support, 56 embedded 18 x 18 multipliers, 4 PLLs, and 8 transceiver channels capable of protocols such as PCIe Gen1, Gigabit Ethernet, CPRI, and Serial RapidIO. The C7 speed grade balances Fmax against static power and is rated for commercial 0 C to +85 C ambient operation. The device supports configuration via active serial, passive serial, fast passive parallel, and JTAG modes.
Architecturally, the EP4CGX110 uses a 60 nm low-power process and shares the same Quartus II/Quartus Prime design flow as other Cyclone IV variants, simplifying IP reuse across Cyclone IV E and Cyclone IV GX designs. Engineers can leverage existing reference designs for PCIe endpoints, DDR2/DDR3 controllers, and 10/100/1000 Ethernet MACs.
Typical applications include industrial video broadcast equipment, low-cost PCIe add-in cards, motor control and industrial automation backplanes, wireless remote-radio-head (RRH) baseband pre-processing, and handheld test instrumentation. The integrated transceivers eliminate external PHY ICs in many designs.
Design tip: the 672-ball BGA requires careful PCB stack-up planning, with matched-length differential pairs for the eight transceiver lanes and a continuous GND reference plane beneath the BGA footprint for signal integrity and thermal dissipation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus-driven design notes not bundled into the manufacturer datasheet.
直接替換替代品，適用於 EP4CGX110DF27C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4CGX110DF27C7 （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Process Technology, Transceiver Data Rate.
EP4CGX110DF27C8
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX110DF27I7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX110DF27C6N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX110DF27C7 最大額定值與電氣特性
| Series | Cyclone IV GX |
| Logic Elements (LE) | 109,424 |
| Embedded Memory Bits | 5,621,760 |
| Maximum User I/O | 393 |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Transceiver Channels | 8 |
| Transceiver Data Rate (max) | 3.125 Gbps |
| Core Supply Voltage | 1.2 V |
| Speed Grade | C7 |
| 工作溫度 | 0 C to +85 C (Commercial) |
| 封裝 | 672-ball FBGA (F27), 27 mm |
| Process Node | 60 nm low-power |
| Configuration Methods | AS, PS, FPP, JTAG |
| RoHS 狀態 | Compliant |
EP4CGX110DF27C7 672-ball fbga (f27), 27 mm 腳位配置指南
EP4CGX110DF27C7（672-ball fbga (f27), 27 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4CGX110DF27C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4CGX110DF27C7 適用於 6 應用s: Industrial Video Broadcast Equipment, Low-Cost PCIe Gen1 Endpoint Card, Wireless Remote Radio Head (RRH) Baseband Pre-Processing, Industrial Motor Control and Automation, Handheld Test and Measurement Instrumentation, Gigabit Ethernet Aggregation / Switch Line Card.
Industrial Video Broadcast Equipment
The EP4CGX110DF27C7 is well suited for SDI/HD-SDI broadcast routers and video format converters requiring up to 3.125 Gbps serial links. Its 8 transceivers drive multiple SDI channels with hardware 8B/10B encoding, while the 109,424 logic elements provide headroom for color-space conversion, scaling, and overlay processing. The 1.2 V core and 60 nm low-power process keep board thermal load manageable in 1U broadcast frames where airflow is restricted.
推薦
Low-Cost PCIe Gen1 Endpoint Card
With 8 integrated transceivers and hard PCIe Gen1 IP, the EP4CGX110DF27C7 enables a single-chip PCIe x1/x4 endpoint without external PHY. The 672-ball BGA exposes the 4-lane PCIe interface plus side-band signals, while 56 embedded 18x18 multipliers accelerate DSP pre-processing. This suits low-volume industrial capture cards, data acquisition, and FPGA-based coprocessor designs where a discrete PCIe PHY would add cost.
推薦
Wireless Remote Radio Head (RRH) Baseband Pre-Processing
The EP4CGX110DF27C7's 8 CPRI-capable transceivers at 3.072 Gbps and 56 DSP multipliers make it a fit for RRH fronthaul pre-processing, including uplink crest-factor reduction (CFR) and digital predistortion (DPD). The 109K LE budget holds real-time DPD lookup tables, while the 5.6 Mbits of block RAM buffer sub-frame samples. Commercial C7 temperature rating fits outdoor cabinet designs with sealed enclosures.
推薦
Industrial Motor Control and Automation
The EP4CGX110DF27C7 supports multi-axis motor control with its 56 hardware multipliers for Park/Clarke transforms, SVPWM, and field-oriented control (FOC) loops. The 8 transceivers connect to multi-axis encoder feedback via EnDat or BiSS protocols, while 393 user I/O drive PWM channels and GPIO. The commercial C7 temperature grade suits factory-floor enclosures; for harsher environments the I7N speed grade drop-in extends range to -40 C.
推薦
Handheld Test and Measurement Instrumentation
The EP4CGX110DF27C7's low static power from the 60 nm process and 1.2 V core make it appropriate for portable oscilloscopes, logic analyzers, and protocol analyzers. The 8 transceivers support USB 3.0 PHY bridging, Ethernet, or serial protocol triggering, while 5.6 Mbits of embedded memory capture deep waveform traces. Quartus II support and mature reference designs shorten development cycles for low-volume T&M products.
推薦
Gigabit Ethernet Aggregation / Switch Line Card
The EP4CGX110DF27C7 integrates 8 transceivers capable of SGMII / 1000BASE-X, supporting up to 8 Gigabit Ethernet ports plus an uplink with hardware 8B/10B encoding. The 109K LE holds custom packet classification and QoS logic, while 5.6 Mbits of block RAM buffer statistics counters. The 672-ball BGA provides more than enough I/O for 8 SFP cages, MDIO, I2C management, and board-level GPIO.
推薦
推薦產品摘要
工程參考資料，適用於 EP4CGX110DF27C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4CGX110DF27C8 | EP4CGX110DF27I7N | EP4CGX110DF27C6N | EP4CGX110DF23I7N |
|---|---|---|---|---|---|
| Package | 672-BGA (F27) 27 mm | 672-BGA (F27) 27 mm - same | 672-BGA (F27) 27 mm - same | 672-BGA (F27) 27 mm - same | 484-BGA (F23) - different |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C7 | C8 (faster) | I7 | C6 (slower) | I7 |
| Temperature Range | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Transceivers | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 |
| Lead-Free / RoHS | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
主要差異化特點
- Largest Cyclone IV GX device in 672-ball BGA, maximum logic density (對比EP4CGX110DF23I7N)
- Faster Fmax than C6 in same package (對比EP4CGX110DF27C6N)
- Commercial temperature versus industrial I7N substitute (對比EP4CGX110DF27I7N)
設計說明
Estimated: The 672-ball F27 BGA at 1.0 mm ball pitch requires a minimum 4-layer PCB stack-up with a continuous GND plane directly beneath the BGA footprint. Use 0.5 oz copper on outer layers with microvia-in-pad if BGA pitch drops below 1.0 mm. Route 100 ohm differential pairs for the 8 transceiver lanes with intra-pair skew under 1 ps and length matching to within 5 mil across all 8 channels.
Cyclone IV GX requires 1.2 V core, 2.5 V auxiliary, 3.0 V or 3.3 V I/O banks, and separate PLL analog supplies. Use a TI or Linear Technology point-of-load regulator per rail; decouple each supply pin with 0.1 uF and 10 uF ceramic caps placed within 100 mil of the pin. Power-on-reset (POR) requires each rail to ramp within 50 ms of the others to avoid configuration failure.
Estimated: At 100% utilization of 56 multipliers and 8 transceivers at 3.125 Gbps, the EP4CGX110DF27C7 dissipates approximately 4-6 W. With 672-ball BGA theta-JA of approximately 15 C/W (still air, JEDEC test board), expect 60-90 C junction-to-ambient rise. Mount the device on a 4-layer board with a 1 oz copper ground pour and consider a small heatsink or forced-air cooling for closed-enclosure designs.
Do not apply non-zero VCC before VCCAUX or VCCD_PLL - this violates Intel power-sequencing requirements and risks long-term reliability damage. Configure unused transceiver channels to enable power-down via Quartus fitter settings; otherwise leakage adds 100 mW per active channel. Ensure the CONF_DONE pin pulls high correctly before exiting configuration mode.
Transceiver reference clock input pins require a 100 ohm differential source termination as close as possible to the FPGA pin. Keep reference clock traces within 200 mil and away from switching signals. For PCIe Gen1 implementations, the 100 MHz reference clock must be PCIe-compliant; use a dedicated clock buffer like the CDCV304.
合規資訊
RoHS compliant and lead-free per distributor listings. Commercial temperature grade (C7); use I7N for industrial applications. No AEC-Q100 grade available in the Cyclone IV GX family.
