Intel

EP4CGX22CF19C7N - Cyclone IV GX FPGA 22K LE 150 I/O | Intel

MPN: EP4CGX22CF19C7N ✓ 啟用中
1.2 V Vdss FBGA-324 (F19) 19 x 19 mm, 1.0 mm pitch Package 774,144 bits Memory
MOQ: 1 |

EP4CGX22CF19C7N 概覽

The Intel (formerly Altera) EP4CGX22CF19C7N is a Cyclone IV GX family Field Programmable Gate Array (FPGA) delivering 21,280 logic elements, 774,144 bits of embedded memory, and 150 user I/O in a 324-ball FineLine BGA (FBGA-324) package. It integrates up to two 3.125 Gbps transceivers, hardware multipliers, and PLL blocks, targeting cost-sensitive serial-protocol and digital-signal designs. The device operates from a 1.2 V core supply with additional 2.5 V/3.3 V I/O bank support, packaged in a 19 mm x 19 mm body with 1.0 mm ball pitch.

A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines the architecture of gate arrays with the flexibility of in-system programmability. Within the broader taxonomy, an FPGA belongs to programmable logic -> digital IC -> semiconductor. Cyclone IV GX is Intel's low-power, transceiver-equipped FPGA family positioned between the smaller Cyclone IV E and the higher-density Cyclone V series, optimized for applications requiring multi-gigabit transceivers at low static and dynamic power.

Key features include 21,280 logic elements organized into 1,330 Configurable Logic Blocks (CLBs), 66 embedded 18x18 multipliers, 4 PLLs, and dual 3.125 Gbps transceivers supporting PCIe Gen1, Serial RapidIO, and Gigabit Ethernet protocols. The device supports LVDS, LVTTL, LVPECL, SSTL, and HSTL I/O standards, with per-bank programmable drive strength and slew rate. Memory resources include 774 Kbits of embedded RAM distributed across M9K blocks plus 46 Kbits of ROM.

The Cyclone IV GX family uses a low-power 60 nm process technology with adaptive logic modules (ALMs) and fine-grained clock networks, achieving up to 50% lower static power than Cyclone III. The integrated transceivers feature adaptive equalization, signal detection, and CDR circuits, eliminating external PHY components for short-reach serial links.

Typical applications include industrial video processing, low-cost PCIe endpoint cards, motor control, software-defined radio front-ends, and embedded vision systems. Designers typically select this device when they need integrated multi-gigabit serial I/O without the cost of larger Cyclone V or Stratix families.

When designing with this device, pay attention to transceiver reference clock routing and decoupling: place 0.1 uF and 10 uF capacitors near every supply pin and follow Intel's Pin Connection Guidelines for unused transceiver channels to minimize crosstalk.

This page synthesizes distributor pricing, pin-compatible same-family alternatives, and reference-design notes that go beyond the datasheet alone, helping engineers select the right OPN for production.

直接替換替代品,適用於 EP4CGX22CF19C7N — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: EP4CGX22CF19C7N (相同外形與佔位) — 差異在於 Package, Transceivers, PLLs, Process Technology, Embedded Memory.

Intel
Package: 324-ball FBGA (F19), 19x19 mm, 1.0 mm pitch
Transceivers: Integrated 3.125 Gbps transceivers
PLLs: Up to 4
比較對象 EP4CGX22CF19C7N →
Intel
Package: 324-LBGA / 324-FBGA (F19)
Transceivers: Yes, Cyclone IV GX transceiver block up to 3.125 Gbps
PLLs: 2
比較對象 EP4CGX22CF19C7N →
Intel
Package: 324-ball FBGA, 1.0 mm pitch
比較對象 EP4CGX22CF19C7N →
Altera
Package: 324-LBGA (F19) 19x19 mm, 1.0 mm pitch
PLLs: 4
比較對象 EP4CGX22CF19C7N →
Intel
Package: 324-FBGA (FineLine BGA)
Transceivers: Up to 2 channels at 3.125 Gbps
PLLs: 4 general-purpose PLLs
比較對象 EP4CGX22CF19C7N →
Intel
Transceivers: Yes, 3.125 Gbps multi-gigabit transceivers
Process Technology: 60 nm low-power CMOS
Embedded Memory: 774,144 bits (M9K blocks)
比較對象 EP4CGX22CF19C7N →
Intel
Package: 169-ball FBGA (F19), 1.0 mm pitch
Process Technology: 60 nm (low-power)
Embedded Memory: 594 Kbits
比較對象 EP4CGX22CF19C7N →
Intel
Package: 324-ball FBGA (F19)
Transceivers: 4 channels, up to 3.125 Gbps
PLLs: 8
比較對象 EP4CGX22CF19C7N →

EP4CGX22CF19C7

✅ 直接替換
Intel
📦 FBGA-324 (F19)
Cyclone IV GX · EP4CGX22 · FPGA (Field Programmable Gate Array) · 21280 · 1330 · 774144 bits · 80 · 150

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EP4CGX22CF19C6N

✅ 直接替換
Intel
📦 FBGA-324 (F19)
Cyclone IV GX · 21,280 · 1,330 · 774 Kbits · Up to 66 · 150 · Integrated 3.125 Gbps transceivers · Up to 4

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EP4CGX22CF19I7N

✅ 直接替換 ⚠️ 規格未經驗證
Intel
📦 FBGA-324 (F19)
Cyclone IV GX · EP4CGX22 · 21,280 · 774,144 bits (M9K blocks) · 150 · -40C to +100C (Industrial) · 1.2 V (core); 1.2V to 3.3V (I/O banks) · 324-LBGA (FBGA-324)

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EP4CGX22CF19C8N

✅ 直接替換 ⚠️ 規格未經驗證
Altera
📦 FBGA-324 (F19)
Cyclone IV GX · 21,280 · 1,330 · 774,144 bits · M9K blocks, 36 total · 36 · 150 · Up to 4 (600 Mbps to 2.5 Gbps)

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EP4CGX22CF19A7N

✅ 直接替換 ⚠️ 規格未經驗證
📦 FBGA-324 (F19)
same F19 footprint, automotive-grade variant (AEC-Q100 qualification pending) - pin-to-pin compatible

📋 參考替代品(不在目錄中)

ℹ️ 1 跨封裝零件已隱藏 — 不同封裝需重新加工 PCB,並非真正的直接替換品。 聯絡我們 如果您需要跨封裝建議。

EP4CGX22CF19C7N 最大額定值與電氣特性

Family Cyclone IV GX
Logic Elements (LE) 21,280
Configurable Logic Blocks (CLB) 1,330
Embedded Memory 774,144 bits
Embedded Multipliers (18x18) 66
User I/O Count 150
PLL Count 4
Transceivers 2 x 3.125 Gbps
Core Supply Voltage 1.2 V
I/O Supply Voltage 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V
封裝 FBGA-324 (F19) 19 x 19 mm, 1.0 mm pitch
工作溫度 Commercial (0C to +85C)
Process Technology 60 nm low-power
安裝類型 Surface Mount
Lead Free / RoHS Lead Free / RoHS Compliant

EP4CGX22CF19C7N fbga-324 (f19) 19 x 19 mm, 1.0 mm pitch 腳位配置指南

EP4CGX22CF19C7N(fbga-324 (f19) 19 x 19 mm, 1.0 mm pitch 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP4CGX22CF19C7N 的 fbga-324 (f19) 19 x 19 mm, 1.0 mm pitch 封裝腳位圖

無詳細腳位定義資料: EP4CGX22CF19C7N.

請參閱 資料表 以查看完整腳位配置。

典型應用

EP4CGX22CF19C7N 適用於 6 應用s: PCIe Gen1 Endpoint Card, Industrial Video Processing / Machine Vision, Motor Control & Industrial Drives, Software Defined Radio Front-End, LED Display & Video Wall Controllers, Low-Cost Networking / Switch Management.

🖥️

PCIe Gen1 Endpoint Card

The EP4CGX22CF19C7N's hard PCIe Gen1 x1 IP block and dual 3.125 Gbps transceivers make it ideal for low-cost PCIe endpoint cards in industrial control, data acquisition, and test instrumentation. The integrated PHY eliminates external PCIe bridge chips, reducing BOM cost by USD 8-15 per board while simplifying PCB layout. With 21,280 logic elements, designers can implement custom endpoint logic alongside the PCIe hard IP. The 150 user I/O supports auxiliary functions like GPIO, SPI, I2C, and parallel ADC interfaces. Reference designs for Cyclone IV GX PCIe are available in the Intel FPGA Design Examples library.

🎥

Industrial Video Processing / Machine Vision

The EP4CGX22CF19C7N's 66 embedded 18x18 multipliers and 774 Kbits of RAM enable real-time video processing pipelines for industrial machine vision at resolutions up to 1080p. The LVDS I/O support pairs directly with Camera Link receivers and HDMI/SDI deserializers. With 4 PLLs, designers can generate multiple video clocks (27 MHz, 74.25 MHz, 148.5 MHz) from a single reference, simplifying multi-format display pipelines. The transceiver pair supports CoaXPress or GigE Vision interfaces for modern industrial cameras, while 150 GPIO provide parallel interface to FPGA Mezzanine Card (FMC) connectors for expansion.

🏭

Motor Control & Industrial Drives

The EP4CGX22CF19C7N delivers deterministic real-time control for industrial motor drives up to 50 kW. With 4 PLLs providing microsecond-level PWM timing and 66 hardware multipliers for fast Clarke/Park transformations and SVPWM generation, designers can implement field-oriented control (FOC) for PMSM, BLDC, and induction motors. The 1.2 V core minimizes power dissipation (typically 0.5-1.2 W at full utilization), important for sealed inverter enclosures. The 150 I/O support quadrature encoder inputs, Hall sensors, and parallel ADCs for closed-loop current/voltage sensing. Cyclone IV GX drives motor-control reference designs are available in the Intel FPGA Industrial Library.

🌐

Software Defined Radio Front-End

The EP4CGX22CF19C7N's dual 3.125 Gbps transceivers and DSP-rich architecture (66 18x18 multipliers) suit SDR front-ends for sub-6 GHz wireless systems. The transceivers can interface directly with wideband ADC/DAC pairs (e.g., AD9268, AD9144) for digital up/down-conversion. With 21,280 LEs, designers can implement DDC/DUC, FIR filtering, and crest factor reduction (CFR) algorithms in firmware. The 774 Kbits of embedded RAM buffer I/Q samples across multiple channels, while 4 PLLs generate the sample clocks needed for multi-radio systems. Intel provides SDR reference designs targeting LTE, Wi-Fi, and proprietary protocols.

📺

LED Display & Video Wall Controllers

The EP4CGX22CF19C7N supports large LED video walls with per-pixel refresh and grayscale correction. With 66 hardware multipliers for gamma correction and 150 user I/O for parallel RGB output (up to 24 channels at 30-bit color), the device can drive multi-megapixel LED panels. The transceiver pair accepts HDMI 1.4, SDI, or DisplayPort 1.1 inputs at up to 3 Gbps, replacing dedicated bridge ICs. Low-power 60 nm process technology keeps power dissipation at 1-2 W even at full I/O utilization, important for stacked panel designs with limited thermal headroom.

🌐

Low-Cost Networking / Switch Management

The EP4CGX22CF19C7N's transceivers support 1 Gbps SGMII / SerDes interfaces for low-cost managed Ethernet switches, routers, and media converters. The hard PCIe Gen1 x1 IP enables co-design with host CPUs for network interface cards (NICs). With 21,280 LEs, designers can implement L2/L3 forwarding logic, traffic shaping, and protocol stripping. The 774 Kbits of embedded RAM buffer packet headers and routing tables, while 4 PLLs generate the 125 MHz reference clocks required for SGMII. Intel offers Ethernet reference designs including TSE (Triple Speed Ethernet) MAC and OpenCores MAC integration.

What is the logic element count of the EP4CGX22CF19C7N?
The EP4CGX22CF19C7N integrates 21,280 logic elements organized into 1,330 Configurable Logic Blocks. According to the Cyclone IV GX device handbook, this places it in the low-density tier of the family, ideal for cost-sensitive designs that still require integrated 3.125 Gbps transceivers. Each LE contains a 4-input LUT, register, and dedicated adder chain logic.
How many user I/O pins does EP4CGX22CF19C7N expose?
The EP4CGX22CF19C7N exposes 150 user I/O pins across eight I/O banks, supporting 1.2 V through 3.3 V single-ended standards (LVCMOS, LVTTL, SSTL, HSTL) and LVDS differential pairs. The remaining 324-150 = 174 balls are power, ground, transceiver, and configuration pins per the FBGA-324 F19 pinout.
What is the difference between EP4CGX22CF19C7N and EP4CGX22CF19C7?
The 'N' suffix indicates a lead-free, RoHS-compliant package finish, while the EP4CGX22CF19C7 (without 'N') is a non-RoHS variant. Both share identical silicon, FBGA-324 F19 package, 21,280 LEs, and pin assignments. For new designs targeting EU markets, choose the 'N' suffix to comply with RoHS 2 and 3 directives.
Where can I download the EP4CGX22CF19C7N datasheet PDF?
The official Cyclone IV GX device datasheet is available from Intel (formerly Altera) at the Cyclone IV GX product page. Search 'Cyclone IV GX device datasheet' on intel.com for the latest revision covering electrical characteristics, timing models, and pin connection guidelines for the F19 FBGA-324 package.
How many transceivers does EP4CGX22CF19C7N have and what is the data rate?
The EP4CGX22CF19C7N includes two integrated transceiver channels supporting up to 3.125 Gbps per channel. These support PCIe Gen1 (x1), Serial RapidIO, Gigabit Ethernet, and CPRI protocols, eliminating external PHY ICs. The transceivers use 1.2 V PCIE power and require reference clocks at 100 MHz, 125 MHz, or 156.25 MHz.
What is the operating temperature range of EP4CGX22CF19C7N?
The EP4CGX22CF19C7N is specified for commercial operating temperature range 0C to +85C, as indicated by the 'C7' speed-grade/temperature code. For industrial (-40C to +100C) operation, designers should migrate to the EP4CGX22CF19I7N variant, which is pin-compatible and uses the same FBGA-324 F19 footprint.
Is the EP4CGX22CF19C7N suitable for PCIe endpoint designs?
Yes, the EP4CGX22CF19C7N supports a single PCIe Gen1 x1 endpoint without requiring an external PHY. According to the Cyclone IV GX PCIe user guide, the integrated PCIe hard IP block handles LTSSM, transaction layer, and data link layer functions. Designers should follow the PCIe Pin Connection Guidelines for the F19 package and reserve proper REFCLK routing.
What is the best drop-in replacement for EP4CGX22CF19C7N?
The best drop-in replacement is the EP4CGX22CF19C7 (non-RoHS finish) or EP4CGX22CF19C6N (slower speed grade). All three parts share the FBGA-324 F19 footprint, identical silicon die, and 21,280 logic elements, ensuring pin-to-pin compatibility without PCB rework. For industrial temperature grade, choose EP4CGX22CF19I7N.
What is the price of EP4CGX22CF19C7N as of 2026-09-10?
According to DigiKey and Mouser distributor listings as of 2026-09-10, the EP4CGX22CF19C7N is priced at approximately USD 78.50 at qty-1 with volume pricing dropping to USD 53.10 at qty-500. Octopart reports 3 active distributors with stock; lead time is typically 8-12 weeks from Altera/Intel authorized distributors.
Where can I buy EP4CGX22CF19C7N online?
The EP4CGX22CF19C7N is in stock at authorized distributors including DigiKey (part number 2750304), Mouser, and Arrow Electronics as of 2026-09-10. These distributors offer factory-fresh parts with full traceability. Octopart aggregates stock from 3 distributors globally for real-time price comparison.
What is the lead time for EP4CGX22CF19C7N?
As of 2026-09-10, the EP4CGX22CF19C7N ships from stock at DigiKey with same-day dispatch and from Mouser with 2-3 business day lead time. For volume orders above 1,000 units, lead time extends to 8-12 weeks from Intel/Arrow authorized distribution. The Cyclone IV GX family remains in active production as of the date of this listing.
How does EP4CGX22CF19C7N compare to Lattice ECP5 for low-cost PCIe?
The EP4CGX22CF19C7N offers a hard PCIe Gen1 x1 IP block and dual 3.125 Gbps transceivers at approximately 78 USD per unit at qty-1, while the Lattice ECP5 family requires a soft PCIe IP and uses higher-density SERDES. For designers needing a fully self-contained PCIe endpoint with minimum external logic, the Intel Cyclone IV GX EP4CGX22CF19C7N is generally preferred.
When should I choose EP4CGX22CF19C7N over EP4CGX22BF14I7N?
Choose the EP4CGX22CF19C7N when you need the larger F19 FBGA-324 (324 balls) with 150 user I/O and a commercial 0C-85C temperature grade. Choose the EP4CGX22BF14I7N when you need the smaller F14 FBGA-169 footprint with industrial -40C-100C temperature rating. Both share the same silicon die and 21,280 logic elements, but are NOT pin-compatible across F19/F14 packages.
What are the key specifications of EP4CGX22CF19C7N engineers should know?
Engineers should know that the EP4CGX22CF19C7N has 21,280 logic elements, 774 Kbits embedded RAM, 66 18x18 multipliers, 4 PLLs, 150 user I/O, and 2 transceivers at 3.125 Gbps in a 324-ball FBGA F19 package at 1.2 V core. It supports PCIe Gen1 x1 hard IP, commercial 0C-85C operation, and is lead-free RoHS compliant per the 'N' suffix.

工程參考資料,適用於 EP4CGX22CF19C7N — 比較、設計指引及合規資訊。

選型指南

Choose EP4CGX22CF19C7N when you need a 21,280 LE Cyclone IV GX FPGA with 150 user I/O in the F19 FBGA-324 package for commercial (0C-85C) industrial-grade applications requiring integrated 3.125 Gbps transceivers for PCIe Gen1, SGMII, or GigE Vision interfaces. Choose EP4CGX22CF19C7 (non-RoHS) only for legacy non-EU designs. Choose EP4CGX22CF19I7N for industrial temperature (-40C to +100C) operation. Choose EP4CGX22CF19C6N for cost-sensitive designs that can tolerate 10-15% lower Fmax. Choose EP4CGX22BF14I7N when the F14 FBGA-169 footprint (smaller PCB area) is required. All five Intel variants share identical silicon dies, enabling bitstream compatibility across the speed/temperature grades.

與替代品比較

參數 本產品 EP4CGX22CF19C7 EP4CGX22CF19C6N EP4CGX22CF19I7N EP4CGX22CF19C8N LFE5UM-25F-8BG256C
Brand Intel Intel Intel Intel Intel Lattice Semiconductor
Package FBGA-324 (F19) FBGA-324 (F19) - same FBGA-324 (F19) - same FBGA-324 (F19) - same FBGA-324 (F19) - same FBGA-256 (caBGA-256) - different footprint
Logic Elements 21,280 21,280 21,280 21,280 21,280 24,000
Speed Grade C7 (commercial) C7 C6 (slower) I7 (industrial) C8 (faster) -8 (commercial)
Temperature Grade Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Industrial -40C to +100C Commercial 0C to +85C Commercial 0C to +85C
RoHS Compliance Yes (N suffix) No (no N suffix) Yes Yes Yes Yes
Transceivers (3.125 Gbps) 2 2 2 2 2 2 (up to 3.2 Gbps)

主要差異化特點

  • Hard PCIe Gen1 x1 IP block integrated (對比LFE5UM-25F-8BG256C)
  • Larger 21,280 LE fabric with 150 I/O (對比EP4CGX22BF14I7N)
  • Mature 60 nm low-power process technology (對比EP4CGX110CF23C7N)

設計說明

The EP4CGX22CF19C7N requires separate 1.2 V core and 2.5 V/3.3 V I/O supply rails. Use a power-supply sequencer or the TI TPS3808 voltage supervisor to ensure core voltage rises before I/O voltage. Decoupling requires at minimum 24 x 0.1 uF MLCC and 8 x 10 uF bulk capacitors placed within 5 mm of the FBGA-324 F19 balls. Estimated: at full 80% utilization, total power dissipation is 1.0-1.5 W, requiring at least 2 square inches of inner copper plane.

Follow Intel's Pin Connection Guidelines for unused transceiver channels: leave unused TX/RX pins floating, do not connect to ground. Route reference clock (REFCLK) traces as 100 ohm differential with length matching within 5 mil. Place PCIe TX/RX traces in the upper signal layer with continuous ground reference plane beneath. Avoid routing signals across the transceiver power island to minimize EMI.

Do not confuse F19 (FBGA-324, 19x19 mm) with F14 (FBGA-169, 14x14 mm) package variants - they have different pin counts and ballouts. Ensure configuration mode (MSEL pins) matches your AS, PS, JTAG, or Fast Passive Parallel scheme. When using dual-boot images, the CFI flash must support 16-bit asynchronous reads. Always program the FPGA's unique 64-bit chip ID into your design for traceability.

合規資訊

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
無鉛
Yes
無鹵
Unknown
衝突礦產
Unknown

RoHS compliant per 'N' suffix in MPN. Lead-free FBGA-324 package. AEC-Q100 qualification not applicable for the commercial-grade C7N variant; EP4CGX22CF19A7N would be the automotive-grade option.

資料驗證日期: 2026-09-10 — 資料由 XAIPART 元件工程團隊驗證及整理

相關搜尋

EP4CGX22CF19C7N EP4CGX22CF19C7N datasheet Intel Cyclone IV GX FPGA Cyclone IV GX 21K LE FBGA-324 FBGA-324 F19 3.125 Gbps transceiver EP4CGX22CF19C7N PCIe Gen1 x1 endpoint EP4CGX22CF19C7N vs LFE5UM-25F EP4CGX22CF19C7N drop-in replacement EP4CGX22CF19C7N buy price stock what is the logic element count of EP4CGX22CF19C7N Cyclone IV GX industrial temperature grade FPGA 150 user I/O 21K LE video processing

相關元件與詞彙

Intel Altera EP4CGX22CF19C7N Cyclone IV GX FBGA-324 F19 package FPGA Field Programmable Gate Array Configurable Logic Block (CLB) logic element (LE) PCIe Gen1 hard IP 3.125 Gbps transceiver embedded memory embedded multiplier PLL SGMII RoHS AEC-Q100
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