EP4SGX360HF35C2N - Stratix IV GX 353600-Cell FPGA | Intel
MPN： EP4SGX360HF35C2N ✗ 停產EP4SGX360HF35C2N 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected via programmable interconnect and surrounded by programmable I/O cells. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, and they are distinguished from CPLDs and ASICs by their fine-grained architecture, massive parallelism, and the ability to be reconfigured in-system. The Stratix IV GX family targets high-bandwidth applications that require both abundant logic and multi-gigabit transceivers.
Key features include 14,144 LABs/CLBs, 353,600 logic cells, 564 user I/Os, embedded transceiver blocks capable of multi-gigabit serial rates, hardware DSP blocks for high-throughput signal processing, and on-chip memory supporting up to 23,105,536 bits of RAM. The device is built on TSMC's 40 nm low-power process and supports 0.9 V core operation with separate programmable I/O voltage banks for mixed-voltage interfacing.
Architecturally, the Stratix IV GX family combines adaptive logic modules (ALMs), 9-Kbit M9K and 144-Kbit M144K memory blocks, variable-precision DSP blocks, and partial reconfiguration support. This makes the platform suitable for both data-path-heavy designs (telecom baseband, video processing) and control-plane workloads (protocol bridging, glue logic). The HF35 speed grade and C2 power/temperature profile target commercial-tolerance deployments.
Typical applications include high-speed serial interface bridging, telecom baseband processing, military/aerospace signal processing, ASIC prototyping, and high-performance DSP pipelines. Designers select this device when they need Stratix IV GX transceivers alongside 350K+ LE capacity.
When designing with this device, ensure the PCB layout supports the FC-FBGA-1152 ball-grid footprint with appropriate microvia stack-up, provide clean low-noise power rails for the 0.9 V core, and follow Altera/Intel pin-out guidelines for transceiver reference-clock routing to maintain signal integrity at multi-gigabit rates.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not typically aggregated on the manufacturer datasheet, supporting faster component selection and PCB reuse decisions.
直接替換替代品，適用於 EP4SGX360HF35C2N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX360HF35C2N （相同外形與佔位） — 差異在於 Package, Transceivers, Family, Operating Temperature, Speed Grade.
EP4SGX360HF35C2
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360HF35I4G
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SGX360FF35I4N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360FF35C4N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360FH29C2N
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SGX360FH29I3N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360HF35C2N 最大額定值與電氣特性
| Series | Stratix IV GX |
| Family | FPGA - Field Programmable Gate Array |
| Number of Logic Elements/Cells | 353,600 |
| Number of LABs/CLBs | 14,144 |
| Number of I/O | 564 |
| Total RAM Bits | 23,105,536 |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| DSP Performance | 800 MHz |
| 封裝 | 1152-BBGA, FCBGA (HF35) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0C to +85C (commercial) |
| Lead Free | Yes |
| Speed Grade | 35 (HF35) |
| Power/Temperature Grade | C2 |
| Embedded Transceivers | Yes (multi-gigabit) |
| DSP Blocks | Yes (variable-precision) |
EP4SGX360HF35C2N 1152-bbga, fcbga (hf35) 腳位配置指南
EP4SGX360HF35C2N（1152-bbga, fcbga (hf35) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX360HF35C2N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX360HF35C2N 適用於 6 應用s: Telecom Baseband Processing, ASIC Prototyping, High-Performance DSP Pipelines, High-Speed Serial Interface Bridging, Military and Aerospace Signal Processing, Video and Image Processing.
Telecom Baseband Processing
The EP4SGX360HF35C2N's 353,600 logic elements, embedded multi-gigabit transceivers, and 800 MHz DSP blocks make it well suited for telecom baseband signal processing. The 14,144 LABs and 23 Mbit of embedded RAM support channelization, FEC, and baseband demodulation pipelines. Compared with smaller FPGAs, the EP4SGX360HF35C2N absorbs entire multi-carrier baseband designs on a single device, eliminating multi-FGA partitioning complexity. The 0.9 V core and HF35 commercial speed grade are sufficient for indoor base-station thermal envelopes.
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ASIC Prototyping
ASIC prototyping demands the highest logic density available per package, and the EP4SGX360HF35C2N's 353,600 logic elements plus 23 Mbit of embedded RAM let engineers map large SoC designs onto one or two FPGAs. The HF35 1152-ball FC-FBGA exposes the full Stratix IV GX I/O set, enabling comprehensive ASIC pin-out replication. The 40 nm process and 0.9 V core deliver predictable timing closure. Drop-in siblings like the EP4SGX360HF35C2 enable multi-FPGA emulation stacks without re-layout.
推薦
High-Performance DSP Pipelines
The EP4SGX360HF35C2N's variable-precision DSP blocks running at 800 MHz deliver hundreds of GMACs for radar, medical imaging, and signal-intelligence workloads. The 353,600 logic elements provide control-plane headroom alongside the DSP data path. Its 23 Mbit embedded RAM sustains high-throughput sample buffering between pipeline stages. The 564 user I/Os allow direct ADC/DAC interfacing at LVDS rates. Compared with smaller Stratix IV GX devices, the EP4SGX360HF35C2N consolidates what would otherwise require multi-FPGA partitioning.
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High-Speed Serial Interface Bridging
The Stratix IV GX family integrates multi-gigabit transceivers that the EP4SGX360HF35C2N uses to bridge protocols like PCIe Gen2, Serial RapidIO, XAUI, and custom serial links. The 353,600 logic elements provide protocol-stack headroom while the transceivers handle the PHY layer at 6 Gbps and beyond. The 564 user I/Os support parallel side-band signaling alongside serial links. This combination is well matched to legacy system-modernization cards where high-density glue logic meets multi-protocol bridging.
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Military and Aerospace Signal Processing
Military and aerospace platforms depend on high-density FPGAs with extended temperature tolerance and radiation-aware designs. The EP4SGX360HF35C2N's 353,600 logic elements support channelized radar, EW, and secure-comm workloads on a single device. The HF35 commercial speed grade suits benign environments; for harsher conditions, drop-in siblings like the EP4SGX360HF35I4G and EP4SGX360FF35I4N extend the temperature range to industrial -40C to +100C without changing the 1152-ball footprint, easing platform qualification reuse.
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Video and Image Processing
Video broadcast and machine-vision pipelines benefit from the EP4SGX360HF35C2N's 353,600 logic elements, 23 Mbit embedded RAM, and 564 user I/Os to ingest multi-stream HD/4K video and apply real-time processing such as scaling, overlay, and encoding. The DSP blocks accelerate pixel-domain transforms and filters. Compared with smaller FPGAs, the EP4SGX360HF35C2N handles multi-channel video without external memory bottlenecks. The HF35 commercial speed grade is adequate for indoor broadcast and surveillance equipment.
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推薦產品摘要
工程參考資料，適用於 EP4SGX360HF35C2N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX360HF35C2 | EP4SGX360HF35I4G | EP4SGX360FF35I4N | EP4SGX360FF35C4N | EP4SGX360FH29C2N | EP4SGX360FH29I3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA FCBGA (HF35) | 1152-BBGA FCBGA (HF35) - same | 1152-BBGA FCBGA (HF35) - same | 1152-BBGA FCBGA (FF35) - same pin count | 1152-BBGA FCBGA (FF35) - same pin count | 1152-BGA FCBGA (FH29) - same pin count | 1152-BGA FCBGA (FH29) - same pin count |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Embedded RAM | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits |
| Speed Grade | HF35 | HF35 - same | HF35 - same | FF35 (slower) | FF35 (slower) | FH29 (different speed) | FH29 (different speed) |
| Temperature Grade | Commercial 0C to +85C (C2) | Commercial (C2) | Industrial -40C to +100C (I4) | Industrial -40C to +100C (I4) | Commercial (C4) | Commercial (C2) | Industrial -40C to +85C (I3) |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Direct commercial-grade same-footprint alternative (對比EP4SGX360HF35C2)
- Industrial temperature upgrade path (對比EP4SGX360HF35I4G)
- Slower speed-grade option for cost-sensitive designs (對比EP4SGX360FF35C4N)
- Alternative package variant for board layout flexibility (對比EP4SGX360FH29C2N)
設計說明
The EP4SGX360HF35C2N requires a clean 0.9 V core supply and separate programmable I/O bank voltages. Estimated: a fully utilized Stratix IV GX 360 device can draw 10-25 A on the 0.9 V rail at high toggle rates; use a multi-phase buck converter with low-ESR ceramic output capacitors and at least 8-10 bulk decoupling capacitors placed adjacent to the BGA balls. Power-rail sequencing must follow Intel/Altera guidelines to avoid latch-up during hot-swap or in-system reconfiguration.
The 1152-ball FC-FBGA package requires a high-density PCB stack-up with microvias and fine line/space rules. Use at least 8 PCB layers with dedicated ground and power planes; route transceiver differential pairs with 100 ohm differential impedance and maintain length matching within 5 mil for multi-gigabit signals. Estimated: a 4 mil (0.1 mm) pitch BGA escape requires laser-drilled microvias and an HDI stack-up (e.g., 1-2-1 or 2-4-2). Plan for 1-2 oz copper pours to manage thermal dissipation.
Multi-gigabit transceiver channels demand controlled-impedance routing, AC-coupled capacitors at TX/RX pins, and clean reference-clock distribution. Place the reference clock within 5 cm of the transceiver block and use a dedicated clock buffer for fan-out. For LVDS side-band I/O, maintain 100 ohm differential impedance and keep stubs short. Decoupling: place 0.1 uF and 0.01 uF capacitors within 2 mm of each power pin, plus bulk capacitors near the package perimeter.
Estimated: a fully utilized EP4SGX360HF35C2N at 0.9 V core can dissipate 15-25 W, requiring the FC-FBGA thermal pad to be soldered to a copper heat-spreader or thermal vias array. Without adequate cooling, junction temperature can exceed the 85 C commercial limit and trigger thermal throttling. Design 9-12 thermal vias (0.3 mm drill) under the center pad to inner ground planes for heat extraction.
Do not assume the EP4SGX360HF35C2N (commercial C2 grade) meets industrial temperature requirements - choose the EP4SGX360HF35I4G or EP4SGX360FF35I4N variants for -40C to +100C operation. Verify pin compatibility before substituting speed-grade variants (HF35 vs FF35 vs FH29); although they share the 1152-ball footprint, ball assignments may differ between package codes. Confirm against the Stratix IV GX Device Handbook pin-out files before PCB reuse.
合規資訊
Lead-free per 'N' suffix in MPN per JEDEC J-STD-609. RoHS, REACH, halogen-free, and conflict-mineral status were not confirmed in the verified web data and are marked as 'unknown'. AEC-Q100 not applicable for FPGAs.
