EP4SGX360KF40C2N - 360K LE Stratix IV GX FPGA, 1517-FBGA | Intel
MPN： EP4SGX360KF40C2N ⚠ 最後購買機會EP4SGX360KF40C2N 概覽
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing programmable logic blocks (logic elements, LABs, DSP blocks, and block memory) connected by a configurable interconnect matrix. After manufacturing, the designer configures both the logic function and the routing using a Hardware Description Language (HDL) such as Verilog or VHDL. FPGAs sit in the hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> SoC FPGA, offering the highest density and performance for parallel, latency-sensitive workloads. The Stratix IV family from Intel is positioned for high-end telecom, ASIC prototyping, and high-performance DSP.
Key features include a 0.9 V core supply, embedded transceivers capable of multi-gigabit serial I/O, DSP blocks configurable as 9x9, 12x12, 18x18, or 36x36-bit full-precision multipliers operating up to 600 MHz, and dual-port RAM support for true dual-port memory and FIFO buffers. The device also supports high-speed external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II.
The EP4SGX360KF40C2N architecture combines ALMs (Adaptive Logic Modules), MLABs (Memory Logic Array Blocks), DSP blocks, and embedded transceivers in a 40 nm low-power copper process. Compared with the Stratix III generation, Stratix IV GX typically delivers higher logic density and improved transceiver performance while reducing dynamic power, making it suitable for ASIC prototyping and high-throughput data-path designs.
Typical applications include 40G/100G optical transport line cards, ASIC prototyping platforms, high-performance digital signal processing systems, radar and beamforming, military secure communications, and high-speed test and measurement equipment. The -C2 speed grade and industrial-grade temperature rating suit commercial and industrial deployments rather than extended-temperature military applications.
When designing with this device, ensure proper power-rail sequencing (1.0 V core, 1.1 V analog, 2.5 V/3.3 V I/O aux), use the Quartus Prime design software for synthesis and place-and-route, and respect the high-density FBGA ball pattern with PCB stack-up recommendations. Heatsinking may be required depending on transceiver utilization and toggle rate.
This page synthesizes distributor pricing, lifecycle context, and Stratix IV GX family information not found in the manufacturer datasheet alone, helping engineers evaluate the part for production and re-design use.
直接替換替代品，適用於 EP4SGX360KF40C2N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX360KF40C2N （相同外形與佔位） — 差異在於 Package, Speed Grade, Transceivers, Operating Temperature, Process Technology.
EP4SGX360KF40C2
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360HF35C2N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360HF35C2
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360FH29C2N
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SGX360FF35C2N
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SGX360FF35C2XN
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF40C2N 最大額定值與電氣特性
| Series | Stratix IV GX |
| Family | EP4SGX360 |
| Logic Elements (LEs) | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| User I/Os | 744 |
| Embedded Memory (bits) | 23,105,536 |
| DSP Blocks | Yes (9x9 / 12x12 / 18x18 / 36x36 multipliers) |
| DSP Block Max Frequency | 600 MHz |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| 封裝 | 1517-ball FC-FBGA (KF40) |
| 安裝類型 | Surface Mount |
| Speed Grade | C2 |
| 工作溫度 | 0C to +85C (commercial) |
| RoHS 狀態 | Compliant |
| Manufacturer | Intel (formerly Altera) |
EP4SGX360KF40C2N 1517-ball fc-fbga (kf40) 腳位配置指南
EP4SGX360KF40C2N（1517-ball fc-fbga (kf40) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX360KF40C2N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX360KF40C2N 適用於 7 應用s: 40G/100G Optical Transport Line Cards, ASIC Prototyping Platforms, High-Performance DSP Systems (Radar / Beamforming), High-Speed Test and Measurement Equipment, Industrial Imaging and Video Processing, Military Secure Communications, Medical Imaging Acceleration.
40G/100G Optical Transport Line Cards
The EP4SGX360KF40C2N's 353,600 logic elements and integrated multi-gigabit transceivers make it ideal for 40G/100G optical transport line cards in OTN (Optical Transport Network) and DWDM equipment. Its 23 Mbit embedded memory and 600 MHz DSP blocks handle FEC encoding/decoding, MAC framing, and packet processing in real time. Compared with an ASIC, the FPGA allows late-binding protocol updates for OTU4/100G Ethernet. Place the device on a high-layer-count PCB with controlled-impedance transceiver channels and use the Quartus Prime transceiver toolkit for SI tuning.
推薦
ASIC Prototyping Platforms
Engineers prototyping large ASIC designs use the EP4SGX360KF40C2N because its 353,600 logic elements can map complex SoC prototypes, and its abundant user I/Os (744) expose wide internal buses for logic-analyzer visibility. DSP blocks at 600 MHz enable accurate verification of DSP-heavy ASIC blocks. Place-and-route with Quartus Prime mirrors the ASIC flow closely, making it a faithful prototype vehicle. Use the KF40 1517-ball FBGA with a high-quality socket or solder-down for repeatable bring-up cycles.
推薦
High-Performance DSP Systems (Radar / Beamforming)
Radar, beamforming, and electronic-warfare systems rely on the EP4SGX360KF40C2N's 600 MHz DSP blocks for FFT, FIR, and matrix multiplication. The 353,600 LEs handle complex control and timing logic alongside DSP, while the 23 Mbit embedded buffer memory holds intermediate samples. The KF40 FC-FBGA package supports industrial-grade thermal performance for rack-mounted systems. Pair with DDR3/QDR II+ memory for high-bandwidth data capture and use the Transceiver Toolkit for ADC/DAC interface alignment.
推薦
High-Speed Test and Measurement Equipment
The EP4SGX360KF40C2N fits high-speed oscilloscopes, logic analyzers, and protocol testers that require deep capture memory and parallel processing. Its 744 user I/Os drive high-channel-count probe front-ends, while the DSP blocks compute real-time FFT and trigger logic. Industrial temperature (0C to +85C) and reliable FC-FBGA packaging suit lab and production-floor environments. Designers use Quartus Prime's SignalTap logic analyzer for in-system debug.
推薦
Industrial Imaging and Video Processing
Multi-camera industrial inspection and broadcast video systems use the EP4SGX360KF40C2N to pipeline high-resolution sensor data through real-time image-processing pipelines. The 23 Mbit embedded memory holds line/frame buffers, while 600 MHz DSP blocks accelerate convolution, color-space conversion, and compression (e.g., JPEG2000, H.264 intra). The 744 I/Os support multiple Camera Link, MIPI, or sub-LVDS sensor interfaces. Pair with DDR3 for large frame storage and use HDMI/DisplayPort output IP cores.
推薦
Military Secure Communications
Software-defined radio (SDR) and secure tactical communications systems rely on the EP4SGX360KF40C2N for waveform processing, encryption accelerators, and high-speed serial links. The 353,600 LEs host multi-band RF signal chains, while the integrated transceivers handle RF-to-digital conversion at multi-gigabit rates. The C2 speed grade and FC-FBGA packaging suit ruggedized chassis designs. Although the device is commercial-grade (0C to +85C), extended-temperature Stratix IV variants exist for harsher environments.
推薦
Medical Imaging Acceleration
CT, MRI, and ultrasound imaging systems use the EP4SGX360KF40C2N to accelerate back-projection, beamforming, and image reconstruction. The 600 MHz DSP blocks perform parallel MAC operations on streaming data, while 23 Mbit embedded memory holds intermediate projections. With 744 user I/Os, the device interfaces to multiple high-speed ADCs and DDR3 sample buffers. Designers use Quartus Prime's DSP Builder for MATLAB/Simulink integration, accelerating algorithm development and verification.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SGX360KF40C2N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX360KF40C2 | EP4SGX360HF35C2N | EP4SGX360HF35C2 | EP4SGX360FH29C2N | EP4SGX360FF35C2N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FC-FBGA (KF40) | 1517-ball FC-FBGA (KF40) - same | 1152-ball FC-FBGA (HF35) | 1152-ball FC-FBGA (HF35) | 1517-ball FC-FBGA (FH29) | 1152-ball FC-FBGA (FF35) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| Speed Grade | C2 | C2 | C2 | C2 | C2 | C2 |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Lifecycle Status | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy |
| RoHS | Compliant | Non-compliant (SnPb) | Compliant | Non-compliant (SnPb) | Compliant | Compliant |
主要差異化特點
- Highest logic density in Stratix IV GX KF40 package family (對比EP4SGX230KF40C2N)
- 1517-ball FC-FBGA with 744 user I/Os (對比EP4SGX360HF35C2N)
- Drop-in compatibility within Stratix IV GX family (對比EP4SGX360KF40C2 (non-lead-free))
設計說明
The EP4SGX360KF40C2N requires multi-rail power sequencing: 0.9 V core, 1.1 V analog PLL, 1.0 V transceiver, and 2.5 V/3.3 V I/O auxiliary rails. Use the Intel Enpirion power management family (e.g., EM2130) or equivalent PMICs with controlled ramp rates to avoid latch-up. Estimated: total power consumption with mid-utilization (50% LEs, 50% toggle rate) approaches 10-15 W, rising with transceiver utilization. Decouple each rail with 0.1 uF + 10 uF ceramic capacitors placed within 3mm of each package ball.
The 1517-ball FC-FBGA package has a high junction-to-ambient thermal resistance. At full utilization with transceivers active, junction temperature can exceed 85C without airflow or heatsinking. Estimated: with 10 W dissipation and the standard FC-FBGA thermal pad, junction-to-ambient is approximately 12-15 C/W. Design a top-side heatsink with thermal interface material, and ensure the PCB has adequate ground planes and thermal vias under the central thermal ball array.
The 1517-ball FC-FBGA uses a 1.0 mm or 0.8 mm ball pitch depending on the specific Stratix IV variant. Use a high-layer-count PCB (at least 12 layers) with stacked microvia construction for breakout. Maintain 100-ohm differential impedance for transceiver channels and 50-ohm single-ended for general-purpose I/O. Use Intel's pin connection guidelines and Signal Integrity (SI) tools to validate your stack-up. Place decoupling capacitors on the back side of the PCB directly under the package shadow.
Common pitfalls: (1) failing to configure all unused I/O pins as tri-stated inputs with weak pull-ups to prevent floating inputs and excess current; (2) ignoring transceiver reference clock jitter requirements (use low-jitter crystal oscillators); (3) under-provisioning DDR3 VTT termination causing signal-integrity failures; (4) neglecting the AS configuration scheme (use EPCQ256 or compatible flash); (5) skipping JTAG boundary-scan testing, which is essential for high-density BGAs. Always run the Quartus Prime power analyzer and pin planner before tape-out.
合規資訊
RoHS compliant per manufacturer product page. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Last-time-buy status per Intel product change notification.
