EP4SGX360KF40C4N - Stratix IV GX FPGA 353.6K LE | Intel
MPN： EP4SGX360KF40C4N ✗ 停產EP4SGX360KF40C4N 概覽
An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and routing resources that can be reconfigured by the designer after manufacture. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors, delivering hardware-level parallelism with software-like design flexibility. Stratix IV GX sits in the high-end tier of programmable logic, alongside PowerPC and soft-core processor IP, and forms part of the broader semiconductor hierarchy: IC > programmable logic > FPGA > high-end serial-enabled FPGA.
Key differentiating features include 8.5 Gbps embedded transceivers, hard PCI Express Gen1/Gen2 IP cores, hard memory controllers for DDR3/QDRII+, and dedicated DSP blocks (total roughly 1,040 18x18 multipliers) that accelerate wide datapath arithmetic. The 40 nm process minimizes dynamic power compared to 65 nm predecessors, and partial reconfiguration support enables live logic swap for fault-tolerant or multi-mode systems.
Typical applications include high-speed serial interface bridging (e.g., 10G Ethernet MACs, PCIe Gen2 endpoints, SRIO), digital video broadcast and 3G/HD-SDI switching, radar baseband processing, ASIC prototyping, and military/aerospace signal processing where the combination of high logic density and embedded transceivers reduces board area and BOM cost.
When designing with the EP4SGX360KF40C4N, careful power-rail sequencing and high-density BGA fanout are critical; use Intel's Quartus Prime design suite for synthesis, place-and-route, and timing closure. Verify signal-integrity margins on the transceiver channels and respect the 1.0 V core voltage requirement.
直接替換替代品，適用於 EP4SGX360KF40C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX360KF40C4N （相同外形與佔位） — 差異在於 Package, Speed Grade, Transceivers, Operating Temperature, Process Technology.
EP4SGX360KF40C4
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF40C3N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF40C3
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF40C2N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF40C2
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查看資料表 →EP4SGX360KF40C4N 最大額定值與電氣特性
| Series | Stratix IV GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 353,600 |
| Number of LABs/CLBs | 14,144 |
| Total RAM Bits | 23,105,536 |
| Number of I/O | 744 |
| 封裝 | 1517-BBGA, FCBGA (40 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0°C to +85°C (Commercial) |
| Speed Grade | C4 (commercial, -4 bin) |
| Process Technology | TSMC 40 nm |
| Transceivers | Up to 8.5 Gbps embedded |
| Supply Voltage Core | 0.9 V to 1.0 V |
| RoHS 狀態 | Compliant |
| Lifecycle | Not Recommended for New Designs (NRND) |
EP4SGX360KF40C4N 1517-bbga, fcbga (40 mm) 腳位配置指南
EP4SGX360KF40C4N（1517-bbga, fcbga (40 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX360KF40C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX360KF40C4N 適用於 6 應用s: 10G Ethernet Bridging and Switching, PCI Express Gen2 Endpoint and Root Complex, Digital Video Broadcast and 3G/HD-SDI Switching, Military/Aerospace Signal Processing, ASIC Prototyping and Emulation, Wireless Baseband and CPRI Front-Haul.
10G Ethernet Bridging and Switching
The EP4SGX360KF40C4N's 353,600 logic elements and embedded 8.5 Gbps transceivers make it ideal for 10G Ethernet MAC, XAUI-to-XAUI bridging, and L2/L3 switching applications. The high LE count absorbs full packet-processing pipelines, CRC engines, and lookup tables without external TCAMs, while the transceiver array delivers XAUI, RXAUI, and KR backplanes. Compared to ASIC alternatives, this FPGA reduces NRE cost and accelerates time-to-market for low-volume enterprise switches. Power consumption at full transceiver utilization typically sits between 8-15 W depending on transceiver count and toggle rate.
推薦
PCI Express Gen2 Endpoint and Root Complex
With hard PCIe Gen1/Gen2 IP cores and 8.5 Gbps transceivers, the EP4SGX360KF40C4N implements single-lane, x4, and x8 PCIe endpoints and root complexes for add-in cards, backplanes, and embedded compute modules. The 744 user I/Os provide ample general-purpose I/O for parallel sensor buses and sideband signals. Quartus Prime's hard IP block reduces soft-logic overhead by ~20K LE versus fully soft PCIe implementations, leaving more logic for application data paths.
推薦
Digital Video Broadcast and 3G/HD-SDI Switching
Broadcast studios and video routers leverage the EP4SGX360KF40C4N's logic density for multi-channel SDI de-embedders, frame synchronizers, and 3G/HD-SDI crosspoint switches. The transceivers support SDI rates up to 2.97 Gbps natively, and the 23 Mbit embedded RAM buffers multiple video frames on-chip. Built-in CPRI/OBSAI support extends the same hardware to wireless baseband front-haul, giving OEMs one silicon platform for both broadcast and telecom video.
推薦
Military/Aerospace Signal Processing
Defense and aerospace systems use the EP4SGX360KF40C4N for radar baseband, electronic-warfare DSP, and secure communications because the high logic density consolidates many DSP blocks (18x18 multipliers) and embedded RAM for FFT-based processing. Wide parallel datapath implementations exceed DSP-only processor performance by 10x-100x at the same clock. The commercial C4 speed grade operates 0-85°C, but for flight-qualified builds, designers derate to industrial temperature variants. Long-term support and configuration bitstream management are key for aerospace lifecycles exceeding 15 years.
推薦
ASIC Prototyping and Emulation
With 353,600 logic elements and abundant transceivers, the EP4SGX360KF40C4N is widely deployed as an ASIC prototyping platform, partitioning multi-million-gate ASIC designs across multiple FPGAs via Time Division Multiplexing (TDM) or pin-multiplexing. Quartus Prime supports standard synthesis flows (Verilog, VHDL, SystemVerilog) and ASIC-equivalent timing libraries. Compared to commercial emulator farms, single-FPGA prototyping offers low-cost bring-up at the expense of full-chip real-time performance.
推薦
Wireless Baseband and CPRI Front-Haul
The EP4SGX360KF40C4N's transceiver array and 23 Mbit on-chip memory enable CPRI/OBSAI front-haul aggregation between baseband units (BBU) and remote radio heads (RRH) in 4G/5G networks. The high logic capacity handles multi-sector baseband DSP, turbo decoding, and IQ sample buffering. Hard memory controllers interface directly to DDR3/QDRII+ external memory for sample storage. Per-sector power dissipation typically stays below 4 W, well within Altera's 40 nm power envelope.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SGX360KF40C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX360KF40C4 | EP4SGX360KF40C3N | EP4SGX360KF40C3 | EP4SGX360KF40C2N | EP4SGX360KF40C2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (KF40) | 1517-BBGA, FCBGA (KF40) - same | 1517-BBGA, FCBGA (KF40) - same | 1517-BBGA, FCBGA (KF40) - same | 1517-BBGA, FCBGA (KF40) - same | 1517-BBGA, FCBGA (KF40) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Number of LABs/CLBs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| Number of I/O | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | C4 (fastest) | C4 | C3 | C3 | C2 (slower) | C2 (slower) |
| Pb-Free ('N' suffix) | Yes | No (non-Pb-free variant) | Yes | No | Yes | No |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
主要差異化特點
- Fastest -4 speed grade of the KF40 family (對比EP4SGX360KF40C3N)
- Pb-free / RoHS compliant assembly (對比EP4SGX360KF40C4 (non-N))
- Highest-density Stratix IV GX with KF40 pinout (對比EP4SGX230KF40C2N)
設計說明
The 1517-ball FCBGA package has theta_JA of approximately 8-12 C/W with a properly designed thermal via array under the die. Stratix IV GX devices at full transceiver utilization (24+ lanes @ 8.5 Gbps) can dissipate 15-25 W. Use at least 4 layers of 1-oz copper, a thermal via farm of 0.3 mm pitch directly under the package thermal pad, and a heatsink with thermal interface material. Monitor junction temperature via the built-in die-temperature sensing diode for telemetry.
Stratix IV GX requires multiple supply rails: 0.9 V or 1.0 V VCCINT (core, speed-grade dependent), 2.5 V or 3.0 V VCCPD (pre-driver), 1.2 V/1.5 V/1.8 V VCCIO (per-bank I/O), and dedicated VCC_GXB for transceivers (1.0 V/1.2 V). Power-on sequencing must follow Intel's POR (Power-On Reset) guidelines: VCCINT first, then VCCPD, then VCCIO, then VCC_GXB, with monotonic rise. Use a multi-rail controller like the LTC3554 or ISL9444 with sequenced enable pins.
The KF40 FCBGA 1517-ball package requires HDI PCB technology (microvias, 0.1 mm pitch escape routing). For high-speed transceiver channels, maintain 100-ohm differential impedance with no more than two vias per TX/RX pair, and follow Intel's transceiver channel-loss budget (typically <8 dB at 5 GHz Nyquist). Use a minimum 12-layer stack-up with continuous GND/PWR planes adjacent to every signal layer. Implement length-matching on all DDR3/QDRII+ interfaces within ±25 ps.
Stratix IV GX transceivers support up to 8.5 Gbps. For backplane applications, use pre-emphasis and equalization settings from the ALTGX IP core. Critical signals: TX serial data, RX serial data, REFCLK (must be 100/125 MHz with <300 fs RMS jitter for 6.25 Gbps and above). Keep REFCLK routes away from switching power supply edges and protected with a GND guard trace. Verify eye-mask margin in the lab with a BERT at 1E-12 BER.
Common pitfalls when designing with the EP4SGX360KF40C4N include: (1) omitting the POR delay or config-from-flash supervisor circuit, leading to boot failures after power glitches; (2) incorrect pin assignment for MSEL[4:0] config mode pins causing JTAG/AS/PS mode confusion; (3) underestimating transceiver reference-clock jitter when using non-dedicated PLLs; (4) using LVCMOS 3.3 V on banks configured for 2.5 V VCCIO; (5) ignoring Quartus Prime fitter warnings about unrouted nets in the high-utilization regions.
合規資訊
RoHS and REACH compliant per distributor listings. Pb-free assembly confirmed by 'N' suffix. Halogen-free per Intel product specification. AEC-Q100 not applicable (FPGA is not automotive-qualified). Intel continues to support Stratix IV GX for existing customers; new designs should target Stratix V GX, Arria 10, or Agilex 7.
