EPF6024AQC240-6 - 24K Gates FLEX 6000 FPGA, 240-PQFP, Speed Grade 6 | Intel
MPN： EPF6024AQC240-6 ✗ 停產EPF6024AQC240-6 概覽
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells, all controlled by on-chip SRAM configuration memory. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 6000 family. FPGAs offer higher logic density and richer interconnect than older CPLDs, at the cost of requiring external configuration memory and a multi-step power-on sequence.
Key features of the EPF6024AQC240-6 include 24,000 typical gates, 1,960 logic elements, 196 LABs, 199 maximum user I/Os, JTAG-based IEEE 1149.1 boundary-scan test support, multi-voltage I/O (3.3 V with 5.0 V tolerance via pull-up), and a built-in configuration memory controller. Speed grade 6 indicates the slowest timing bin of the FLEX 6000 family, which trades maximum Fmax for the most favorable cost tier - appropriate for cost-sensitive industrial and embedded designs that do not need the highest clock rates.
Typical applications include glue logic in industrial control systems, custom peripheral expansion for legacy microprocessors, telecommunications line-card interface logic, prototyping bridges for ASIC designs, and bus-protocol converters (e.g., ISA-to-local bus, UART muxing, parallel-to-serial aggregation). The 240-pin PQFP footprint makes hand-rework and socketed prototyping easier than BGA alternatives.
When designing with the EPF6024AQC240-6, ensure your configuration PROM and clock-distribution network meet FLEX 6000 power-on sequencing requirements (VCCIO before VCCINT, then CONFDONE assertion). The 240-PQFP package has relatively long leads that aid inspection but limit high-speed signal lengths, so follow Altera application-note layout guidelines for clocks and global signals.
This page consolidates distributor stock, drop-in same-family alternatives from the FLEX 6000 portfolio, and practical design guidance not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EPF6024AQC240-6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF6024AQC240-6 （相同外形與佔位） — 差異在於 Operating Temperature, Speed Grade, Package, Mounting Type, Process Technology.
EPF6024AQC240-3
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-2
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-2N
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-1
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-4
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-6 最大額定值與電氣特性
| Product Family | FLEX 6000 |
| Device Logic Elements | 1960 |
| Typical Gate Count | 24000 |
| Logic Array Blocks (LABs) | 196 |
| Maximum User I/Os | 199 |
| 封裝 | 240-pin PQFP (BFQFP-240) |
| Speed Grade | 6 (slowest timing bin) |
| Process Technology | 0.42 um CMOS |
| Core Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 3.3 V (5.0 V tolerant via pull-up) |
| Maximum Internal Frequency | 166.67 MHz |
| Configuration Method | SRAM, serial/parallel |
| JTAG Support | IEEE 1149.1 boundary-scan |
| 工作溫度範圍 | 0C to +70C (commercial) |
| 安裝類型 | Surface Mount |
| Lead-Free / RoHS | unknown |
EPF6024AQC240-6 240-pin pqfp (bfqfp-240) 腳位配置指南
EPF6024AQC240-6（240-pin pqfp (bfqfp-240) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF6024AQC240-6.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF6024AQC240-6 適用於 6 應用s: Industrial Glue Logic Replacement, Legacy Microprocessor Peripheral Expansion, Telecommunications Line-Card Interface Logic, ASIC Prototyping Bridge, Bus Protocol Converters, Test and Measurement Instrumentation Logic.
Industrial Glue Logic Replacement
The EPF6024AQC240-6 fits industrial glue-logic replacement because its 24,000-gate capacity and 199 user I/Os comfortably absorb scattered 74-series TTL, HC, and FCT logic functions. With a maximum internal frequency of 166 MHz at speed grade 6 and a 0.42 um 3.3 V CMOS process, the device consolidates state machines, address decoders, and bus-interlock logic onto one IC. Industrial control cabinets benefit from the 240-PQFP footprint, which is hand-rework friendly during factory commissioning and supports socketed prototyping for quick firmware iteration.
推薦
Legacy Microprocessor Peripheral Expansion
The EPF6024AQC240-6 is widely used to expand the I/O and peripheral set of legacy microprocessors such as the 80186, 68k, or V40 family where fixed-function peripherals are unavailable. Its 196 LABs and 1,960 logic elements provide ample headroom for custom UARTs, timers, interrupt controllers, and bus-watchdog logic. The 240-PQFP package and 3.3 V core (with 5 V tolerant I/O via external pull-ups) drop directly into 5 V-era backplane designs, making the EPF6024AQC240-6 a natural modern substitute for dozens of legacy 74-series parts.
推薦
Telecommunications Line-Card Interface Logic
In telecom line cards the EPF6024AQC240-6 implements HDLC controllers, T1/E1 framer glue, timeslot assigners, and parallel-to-serial aggregation that bridge framers to network processors. Its 196 LABs absorb the parallel datapath logic, while 199 I/Os satisfy the multi-timeslot bus interface requirement. The 240-pin PQFP and 166 MHz internal frequency at speed grade 6 are sufficient for backplane speeds up to ~50 MHz, and the JTAG boundary-scan support simplifies in-system test on populated line cards.
推薦
ASIC Prototyping Bridge
The EPF6024AQC240-6 is commonly deployed as a low-cost ASIC prototype vehicle, implementing the full ASIC RTL before tape-out so that engineers can validate firmware and system integration in parallel with mask preparation. Its 1,960 logic cells provide sufficient capacity for sub-30K-gate ASIC designs, and the Quartus II toolchain allows the same RTL to be retargeted to a Cyclone IV once the design graduates. The 240-PQFP package on a development board supports bring-up without the BGA X-ray and rework tooling required by higher-density parts.
推薦
Bus Protocol Converters
The EPF6024AQC240-6 is well-suited to bus-protocol conversion tasks such as ISA-to-local-bus bridges, I2C-to-parallel aggregation, or custom peripheral muxing on embedded motherboards. Its 199 user I/Os absorb wide parallel buses, while 196 LABs hold the state machine that arbitrates protocol transitions. With speed grade 6 and a 166 MHz ceiling, the device easily handles 25-33 MHz peripheral buses that typify embedded designs, and the 3.3 V core with 5 V tolerant I/O permits direct interfacing to legacy 5 V peripherals via pull-ups.
推薦
Test and Measurement Instrumentation Logic
The EPF6024AQC240-6 is used inside test-and-measurement gear for custom stimulus generators, comparator banks, and timing-sequencer logic where the 199 I/Os are routed directly to front-panel connectors. Its 166 MHz internal frequency (speed grade 6) is more than adequate for 10-50 MHz stimulus rates typical of benchtop instruments, and the 196 LABs hold multi-channel state machines in one part. The 240-PQFP package simplifies socketed rework during firmware iteration, reducing maintenance cost for long-life test equipment.
推薦
推薦產品摘要
工程參考資料，適用於 EPF6024AQC240-6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF6024AQC240-3 | EPF6024AQC240-3N | EPF6024AQC240-2 | EPF6024AQC240-2N | EPF6024AQC240-1 | EPF6024AQC240-4 |
|---|---|---|---|---|---|---|---|
| Package | PQFP-240 | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | 6 (slowest) | 3 (faster) | 3 (faster, lead-free) | 2 (faster) | 2 (faster, lead-free) | 1 (fastest) | 4 (between -3 and -6) |
| Lead-Free N Suffix | No (non-N) | No | Yes | No | Yes | No | No |
| Typical Gate Count | 24000 | 24000 | 24000 | 24000 | 24000 | 24000 | 24000 |
| Logic Elements | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 |
| Maximum User I/Os | 199 | 199 | 199 | 199 | 199 | 199 | 199 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete (better availability) | Obsolete (lead-free stock) | Obsolete | Obsolete (lead-free) | Obsolete | Obsolete |
| Indicative 1-Piece Price (USD) | 28.50 | 32.00 | 34.50 | 36.00 | 38.00 | 42.00 | 30.00 |
主要差異化特點
- Lowest-cost 24K-gate FLEX 6000 speed grade (對比EPF6024AQC240-3)
- Same-footprint speed-grade migration path (對比EPF6024AQC240-1)
- 199 user I/Os in PQFP - hand-rework friendly (對比EPF6024AQC208-3 (PQFP-208, 169 I/Os))
設計說明
The FLEX 6000 family requires a specific power-on sequence: VCCIO must reach its stable level before or simultaneously with VCCINT. Per the FLEX 6000 handbook, supplying VCCINT before VCCIO can latch-up the I/O buffers. Place 0.1 uF ceramic decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair, plus a single bulk 47-100 uF tantalum or polymer cap near the device. Estimated: at 199 active I/Os toggling at 25 MHz, dynamic current per I/O is ~5 mA, giving roughly 1 A additional supply demand beyond quiescent; confirm with Quartus PowerPlay analysis for the actual design.
Route all dedicated clock inputs (CLK0-CLK3) using 50 ohm controlled-impedance traces of matched length, and isolate them from any high-speed switching signals by at least 3 trace widths. The 240-pin PQFP package has relatively long lead inductance (~5 nH per pin) compared to BGA, so decoupling effectiveness degrades above 50 MHz. Place the configuration PROM within 50 mm of the FLEX 6000 device to keep the DCLK and DATA0 signals clean and avoid reflection-induced configuration failures.
Do not assume any speed grade is interchangeable without re-running Quartus timing analysis: changing from grade -6 to grade -1 requires recompiling the bitstream to update the timing model. Attempting to use a -1 bitstream in a -6 part (or vice versa) will produce silent timing failures even though the device appears functional. Also, do not omit the external pull-up on nCONFIG and nSTATUS - without it the device will not enter user mode after configuration. Always source the configuration PROM and the FPGA from the same power-rail supervisor to ensure synchronized reset.
Estimated: the 240-pin PQFP has a typical theta_JA of approximately 35-40 C/W on a 4-layer JEDEC test board. At 1.0 W total dissipation (typical for 24K-gate designs at moderate utilization) the junction temperature rise is ~35-40 C above ambient; ensure ambient plus this rise stays below the 125 C maximum junction spec. Increase copper area on inner ground/power planes and add thermal vias under the exposed die-attach pad to reduce theta_JA. For continuous high-utilization designs, consider a small clip-on heatsink on the PQFP top surface.
合規資訊
RoHS/lead-free status not explicitly documented in publicly indexed datasheet; -6 suffix is not lead-free, while -xN suffix variants are lead-free per Altera naming convention. AEC-Q100 not applicable - this is a commercial-grade FPGA.
