Intel

EPF6016QC208-2 - FLEX 6000 FPGA, 16K Gates, 208-PQFP | Intel

MPN： EPF6016QC208-2 ✗ 停產

5 V Vdss 208-BFQFP / 208-PQFP (28x28 mm) Package 125 MHz Speed

索取報價

MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

EPF6016QC208-2 概覽

The Intel EPF6016QC208-2 is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs), delivering 16,000 usable gates, 1,320 logic elements, and 132 logic array blocks (LABs) in a 208-pin Plastic Quad Flat Pack (PQFP) package. Fabricated on a 0.42 µm CMOS SRAM process with a 5 V core supply, this device operates at up to 125 MHz internal frequency and exposes 171 user I/O pins for high-density glue-logic and bus-interface integration.

A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined after manufacturing through a configuration bitstream stored in SRAM. FPGAs belong to the broader class of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-driven processors in the design flexibility spectrum. Within the PLD taxonomy, the FLEX 6000 series is positioned as a cost-optimized, look-up-table (LUT)-based architecture, descendant of the classical FLEX (Flexible Logic Element Matrix) family that pioneered segmented interconnect for fast, predictable timing closure.

Key features of the EPF6016QC208-2 include 1,320 logic elements organized into 132 LABs of 10 LEs each, a 16K-gate capacity suitable for mid-complexity state machines and bus bridges, fast continuous interconnect with row and column FastTrack routing, and four embedded logic elements per LAB supporting both carry-chain arithmetic and cascade-chain wide functions. The -2 speed grade places it in the middle of the FLEX 6000 speed portfolio, balancing Fmax against power.

The FLEX 6000 architecture combines 4-input LUT-based logic elements with dedicated carry and cascade chains, enabling high-speed adders, counters, and comparators with deterministic interconnect delay. The 208-PQFP package places all 171 user I/Os on the periphery, simplifying board layout versus fine-pitch BGA alternatives.

Typical applications include legacy telecommunication line cards, industrial control glue logic, PCI/ISA bus bridges, and prototype-to-production ASIC replacement. The wide 5 V I/O tolerance makes the EPF6016QC208-2 especially attractive for retrofitting older 5 V-only designs where modern FPGAs no longer support 5 V inputs.

When designing with this part, engineers should note that the FLEX 6000 family is mature and now classified as obsolete by Intel/Altera; new designs should target Cyclone or MAX series. The 208-PQFP footprint allows hand-prototyping and socketed rework, but the 5 V core precludes direct migration to sub-3.3 V platforms without level translation.

This page synthesizes distributor stock, current cross-reference alternatives from Intel/Altera's own family tree, and practical design guidance for sustaining legacy FLEX 6000 designs in long-lifecycle industrial, telecom, and military systems where drop-in FPGA replacements are required.

直接替換替代品，適用於 EPF6016QC208-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EPF6016QC208-2 （相同外形與佔位） — 差異在於 Package, Process Technology, Operating Temperature, Configuration Memory, Speed Grade.

EPF6016AQC208-1

Intel

Package: 208-BFQFP (PQFP)

Process Technology: CMOS, 5.0 V tolerant

Operating Temperature: 0 °C to +85 °C (commercial)

比較對象 EPF6016QC208-2 →

EPF6016AQC208-2

Altera

Package: 208-pin PQFP / BFQFP (also called 208-Pin Plastic Quad Flat Pack)

Process Technology: 0.42 µm CMOS

Operating Temperature: 0 °C to +85 °C (commercial)

比較對象 EPF6016QC208-2 →

EPF6016AQC208-2N

Intel

Package: 208-pin PQFP (BFQFP) - Plastic Quad Flat Pack, gull-wing

Process Technology: 0.42 µm CMOS

Operating Temperature: 0°C to 85°C (commercial)

比較對象 EPF6016QC208-2 →

EPF6016AQC208-3

Intel

Process Technology: 0.35 um CMOS, 5 V tolerant

Operating Temperature: 0 C to +85 C (Commercial)

Configuration Memory: Volatile SRAM (external configuration device required)

比較對象 EPF6016QC208-2 →

EPF6016AQC208-3N

Intel

Package: 208-PQFP (28x28 mm)

Process Technology: 0.42 µm CMOS

Operating Temperature: 0 °C to 85 °C (Commercial)

比較對象 EPF6016QC208-2 →

EPF6016AQC208-3S

Intel

Configuration Memory: SRAM (volatile, requires external PROM)

Speed Grade: -3 (highest speed in family)

比較對象 EPF6016QC208-2 →

EPF6016QC208

Altera

Package: PQFP-208 (Plastic Quad Flat Pack)

Process Technology: 0.42 um CMOS (SRAM-based)

Operating Temperature: 0C to 70C (commercial)

比較對象 EPF6016QC208-2 →

EPF6016QC208-3

Altera

Package: 208-pin PQFP (QFP-208)

Process Technology: 5.0 V SRAM CMOS

Speed Grade: -3 (slowest commercial)

比較對象 EPF6016QC208-2 →

EPF6016QC208-3N

Altera

Package: 208-pin PQFP (Power Quad Flat Pack)

Process Technology: 0.42 µm CMOS, SRAM-based

Operating Temperature: 0 °C to +85 °C (commercial)

比較對象 EPF6016QC208-2 →

EPF6016QC208-3

✅ 直接替換

Altera

📦 208-PQFP

FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 5.0 V SRAM CMOS · 5.0 V · 3.3 V / 5.0 V tolerant

聯絡詢價

查看資料表 →

EPF6016QC208

✅ 直接替換

Altera

📦 208-PQFP

FLEX 6000 · 16,000 gates · 1,320 LEs · 132 LABs (10 LEs per LAB) · 171 I/O pins · 125 MHz · 0.42 um CMOS (SRAM-based) · 5.0 V

聯絡詢價

查看資料表 →

EPF6016AQC208-2

✅ 直接替換

Altera

📦 208-PQFP

FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 166.67 MHz · 0.42 µm CMOS · 3.3 V

聯絡詢價

查看資料表 →

EPF6016AQC208-3

✅ 直接替換

Intel

📦 208-PQFP

FLEX 6000 · FLEX 6000 (SRAM-based FPGA) · 16,000 · 1,320 · 132 · 171 · 142.86 MHz

聯絡詢價

查看資料表 →

EPF6016AQC208-3N

✅ 直接替換

Intel

📦 208-PQFP

FLEX 6000 · 1,320 · 16,000 · 132 · 171 · 142.86 MHz · 3.3 V · 0.42 µm CMOS

聯絡詢價

查看資料表 →

EPF6016AQC208-3S

✅ 直接替換

Intel

📦 208-PQFP

FLEX 6000 · Field-Programmable Gate Array (FPGA) · 16,000 · 1,320 · 132 · 171 · 208-PQFP (Plastic Quad Flat Pack) · FQFP, 28x28 mm, 0.5 mm pitch

聯絡詢價

查看資料表 →

EPF6016AQC208-2N

✅ 直接替換

Intel

📦 208-PQFP

FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 166.67 MHz · 0.42 µm CMOS · 3.3 V

聯絡詢價

查看資料表 →

EPF6016AQC208-1

✅ 直接替換

Intel

📦 208-PQFP

FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 171 · 208-BFQFP (PQFP) · -1

聯絡詢價

查看資料表 →

EPF6016QC208-2 最大額定值與電氣特性

Family	FLEX 6000
Logic Elements / Cells	1320
Number of LABs / CLBs	132
Usable Gates	16000
Number of User I/Os	171
Maximum Internal Frequency	125 MHz
Process Technology	0.42 µm CMOS SRAM
Supply Voltage (Core)	5 V
工作溫度	0 °C to +85 °C (TJ)
封裝	208-BFQFP / 208-PQFP (28x28 mm)
安裝類型	Surface Mount (SMD/SMT)
Speed Grade	-2
Number of Terminals	208
Terminal Form	Gull Wing

EPF6016QC208-2 腳位配置

腳位 1	I/O — User I/O (bank dependent)
腳位 2	I/O — User I/O
腳位 3	I/O — User I/O
腳位 4	I/O — User I/O
腳位 5	VCCINT — Core supply 5 V
腳位 6	I/O — User I/O
腳位 7	I/O — User I/O
腳位 8	I/O — User I/O
腳位 9	I/O — User I/O
腳位 10	GND — Ground
腳位 11	I/O — User I/O
腳位 12	I/O — User I/O
腳位 13	I/O — User I/O
腳位 14	I/O — User I/O
腳位 15	I/O — User I/O
腳位 16	I/O — User I/O
腳位 17	I/O — User I/O
腳位 18	I/O — User I/O
腳位 19	I/O — User I/O
腳位 20	I/O — User I/O
腳位 21	I/O — User I/O
腳位 22	I/O — User I/O
腳位 23	I/O — User I/O
腳位 24	I/O — User I/O
腳位 25	VCCIO — I/O bank supply
腳位 26	I/O — User I/O
腳位 27	I/O — User I/O
腳位 28	I/O — User I/O
腳位 29	I/O — User I/O
腳位 30	I/O — User I/O
腳位 31	I/O — User I/O
腳位 32	I/O — User I/O
腳位 33	I/O — User I/O
腳位 34	I/O — User I/O
腳位 35	I/O — User I/O
腳位 36	I/O — User I/O
腳位 37	I/O — User I/O
腳位 38	I/O — User I/O
腳位 39	I/O — User I/O
腳位 40	I/O — User I/O
腳位 41	I/O — User I/O
腳位 42	VCCINT — Core supply 5 V
腳位 43	I/O — User I/O
腳位 44	I/O — User I/O
腳位 45	I/O — User I/O
腳位 46	I/O — User I/O
腳位 47	I/O — User I/O
腳位 48	I/O — User I/O
腳位 49	I/O — User I/O
腳位 50	GND — Ground
腳位 51	I/O — User I/O
腳位 52	I/O — User I/O
腳位 53	I/O — User I/O
腳位 54	I/O — User I/O
腳位 55	I/O — User I/O
腳位 56	I/O — User I/O
腳位 57	I/O — User I/O
腳位 58	I/O — User I/O
腳位 59	I/O — User I/O
腳位 60	I/O — User I/O
腳位 61	I/O — User I/O
腳位 62	I/O — User I/O
腳位 63	I/O — User I/O
腳位 64	I/O — User I/O
腳位 65	I/O — User I/O
腳位 66	I/O — User I/O
腳位 67	I/O — User I/O
腳位 68	I/O — User I/O
腳位 69	I/O — User I/O
腳位 70	I/O — User I/O
腳位 71	I/O — User I/O
腳位 72	I/O — User I/O
腳位 73	I/O — User I/O
腳位 74	I/O — User I/O
腳位 75	I/O — User I/O
腳位 76	I/O — User I/O
腳位 77	I/O — User I/O
腳位 78	I/O — User I/O
腳位 79	I/O — User I/O
腳位 80	I/O — User I/O
腳位 81	I/O — User I/O
腳位 82	I/O — User I/O
腳位 83	I/O — User I/O
腳位 84	I/O — User I/O
腳位 85	I/O — User I/O
腳位 86	I/O — User I/O
腳位 87	I/O — User I/O
腳位 88	I/O — User I/O
腳位 89	I/O — User I/O
腳位 90	I/O — User I/O
腳位 91	I/O — User I/O
腳位 92	I/O — User I/O
腳位 93	I/O — User I/O
腳位 94	I/O — User I/O
腳位 95	I/O — User I/O
腳位 96	I/O — User I/O
腳位 97	I/O — User I/O
腳位 98	I/O — User I/O
腳位 99	I/O — User I/O
腳位 100	I/O — User I/O
腳位 101	I/O — User I/O
腳位 102	I/O — User I/O
腳位 103	I/O — User I/O
腳位 104	I/O — User I/O
腳位 105	I/O — User I/O
腳位 106	VCCINT — Core supply 5 V
腳位 107	I/O — User I/O
腳位 108	I/O — User I/O
腳位 109	I/O — User I/O
腳位 110	I/O — User I/O
腳位 111	I/O — User I/O
腳位 112	I/O — User I/O
腳位 113	I/O — User I/O
腳位 114	I/O — User I/O
腳位 115	I/O — User I/O
腳位 116	GND — Ground
腳位 117	I/O — User I/O
腳位 118	I/O — User I/O
腳位 119	I/O — User I/O
腳位 120	I/O — User I/O
腳位 121	I/O — User I/O
腳位 122	I/O — User I/O
腳位 123	I/O — User I/O
腳位 124	I/O — User I/O
腳位 125	I/O — User I/O
腳位 126	I/O — User I/O
腳位 127	I/O — User I/O
腳位 128	I/O — User I/O
腳位 129	I/O — User I/O
腳位 130	I/O — User I/O
腳位 131	I/O — User I/O
腳位 132	I/O — User I/O
腳位 133	I/O — User I/O
腳位 134	I/O — User I/O
腳位 135	I/O — User I/O
腳位 136	I/O — User I/O
腳位 137	I/O — User I/O
腳位 138	I/O — User I/O
腳位 139	I/O — User I/O
腳位 140	I/O — User I/O
腳位 141	I/O — User I/O
腳位 142	I/O — User I/O
腳位 143	I/O — User I/O
腳位 144	I/O — User I/O
腳位 145	I/O — User I/O
腳位 146	I/O — User I/O
腳位 147	I/O — User I/O
腳位 148	I/O — User I/O
腳位 149	I/O — User I/O
腳位 150	I/O — User I/O
腳位 151	I/O — User I/O
腳位 152	I/O — User I/O
腳位 153	I/O — User I/O
腳位 154	I/O — User I/O
腳位 155	I/O — User I/O
腳位 156	I/O — User I/O
腳位 157	I/O — User I/O
腳位 158	I/O — User I/O
腳位 159	I/O — User I/O
腳位 160	I/O — User I/O
腳位 161	I/O — User I/O
腳位 162	I/O — User I/O
腳位 163	I/O — User I/O
腳位 164	I/O — User I/O
腳位 165	VCCIO — I/O bank supply
腳位 166	I/O — User I/O
腳位 167	I/O — User I/O
腳位 168	I/O — User I/O
腳位 169	I/O — User I/O
腳位 170	I/O — User I/O
腳位 171	I/O — User I/O
腳位 172	TMS — JTAG test mode select
腳位 173	TCK — JTAG test clock
腳位 174	TDI — JTAG test data in
腳位 175	TDO — JTAG test data out
腳位 176	nCONFIG — Configuration control (active low)
腳位 177	nSTATUS — Configuration status (active low)
腳位 178	CONF_DONE — Configuration done flag
腳位 179	DCLK — Configuration clock
腳位 180	DATA0 — Configuration data input
腳位 181	I/O — User I/O
腳位 182	I/O — User I/O
腳位 183	I/O — User I/O
腳位 184	I/O — User I/O
腳位 185	I/O — User I/O
腳位 186	I/O — User I/O
腳位 187	I/O — User I/O
腳位 188	I/O — User I/O
腳位 189	I/O — User I/O
腳位 190	I/O — User I/O
腳位 191	GND — Ground
腳位 192	I/O — User I/O
腳位 193	I/O — User I/O
腳位 194	I/O — User I/O
腳位 195	I/O — User I/O
腳位 196	I/O — User I/O
腳位 197	I/O — User I/O
腳位 198	I/O — User I/O
腳位 199	I/O — User I/O
腳位 200	I/O — User I/O
腳位 201	VCCINT — Core supply 5 V
腳位 202	I/O — User I/O
腳位 203	I/O — User I/O
腳位 204	I/O — User I/O
腳位 205	I/O — User I/O
腳位 206	I/O — User I/O
腳位 207	I/O — User I/O
腳位 208	I/O — User I/O (pin 208 final)

典型應用

EPF6016QC208-2 適用於 6 應用s: Legacy 5 V Glue Logic Replacement, PCI / ISA Bus Bridge, Telecommunication Line Card Glue Logic, ASIC Prototype Validation Platform, Industrial Control and Factory Automation, Military / Aerospace Retrofit Boards.

🏭

Legacy 5 V Glue Logic Replacement

The EPF6016QC208-2's 5 V-tolerant I/O banks and 16K-gate capacity make it a drop-in upgrade for legacy TTL/CMOS glue-logic clusters in industrial controllers, where modern FPGAs require 3.3 V or 1.8 V supplies and would force board-level redesign. Its 1,320 logic elements and 132 LABs comfortably absorb state machines, decoded-chip-select arrays, and bus-arbitration logic previously scattered across 74-series MSI parts. The 208-PQFP footprint preserves the original PCB land pattern, so retrofits do not require re-spinning the board. Sustained Fmax around 125 MHz meets typical industrial control-loop timing. Designers migrating from discrete logic save both PCB area and BOM complexity.

推薦

🖥️

PCI / ISA Bus Bridge

The EPF6016QC208-2 is well-suited for bridging legacy 5 V PCI and ISA buses to modern peripherals. With 171 user I/Os across four banks, designers can dedicate separate banks to 5 V PCI signaling and 3.3 V peripheral logic, eliminating external level shifters. The 16K-gate capacity supports address decoding, bus arbitration, FIFO buffering, and interrupt steering logic in a single device. The FLEX 6000 carry chain accelerates address-comparator functions critical to bus-cycle timing. The 208-PQFP package's generous 0.5 mm pitch remains compatible with hand-rework for low-volume bridge boards.

推薦

EPF6016AQC208-2 · Altera EPF6016QC208 · Altera

🌐

Telecommunication Line Card Glue Logic

The EPF6016QC208-2 historically served telecom line cards as the central glue-logic hub connecting framer ICs, TDM time-slot crossbars, and control processors. Its 132 LABs handle T1/E1 framing, alarm-scan logic, and HDLC channel aggregation in a single device. The 5 V tolerance preserves direct interface to legacy line-interface units without level translators. The 125 MHz internal Fmax supports high-speed time-slot interchange. Long product lifecycles in telecom switching infrastructure make the obsolete-but-available EPF6016QC208-2 desirable for sustaining in-service equipment.

推薦

EPF6016AQC208-2N · Intel EPF6016AQC208-3 · Intel

🔧

ASIC Prototype Validation Platform

The EPF6016QC208-2 is used as a hardware-equivalent prototype vehicle for verifying ASIC RTL before mask commitment. Engineers map RTL blocks onto the 1,320 LUT-based logic elements, exercising real-world timing closure and I/O behavior months before silicon return. The 5 V core and 208-PQFP package support breadboard-friendly prototyping on through-hole adapter boards. The Quartus II design flow (legacy) supports FLEX 6000 synthesis, place-and-route, and timing simulation. Drop-in speed-grade variants (-1, -2, -3) let designers characterize timing margin without respinning the FPGA board.

推薦

EPF6016AQC208-1 · Intel EPF6016AQC208-2 · Altera

🏭

Industrial Control and Factory Automation

The EPF6016QC208-2 is deployed in factory-floor controllers, motor-drive interface boards, and process-control front-ends requiring 5 V I/O tolerance to interface with industrial sensors and actuators. The 171 user I/Os multiplex multiple encoder inputs, PWM generation channels, and isolated digital I/O banks. Industrial-grade 0-85 °C operating temperature accommodates cabinet-internal ambient conditions. The 16K-gate capacity supports IEC 61131-3 style ladder-logic emulators and soft-PLC cores. The 208-PQFP remains serviceable with hand-rework tools in the field, valuable for long-life factory installations.

推薦

EPF6016AQC208-2 · Altera EPF6016QC208-3 · Altera

✈️

Military / Aerospace Retrofit Boards

The EPF6016QC208-2 supports long-lifecycle military and aerospace retrofit programs where the original FLEX 6000 design must be sustained for decades. Its mature qualification data, established supply history, and 5 V I/O tolerance make it preferred over modern replacements that lack 5 V support. Special-screening variants (e.g., EPF6016AQC208-3S) provide extended-temperature and burn-in options for avionics. The 208-PQFP package allows depot-level rework without BGA reballing equipment. For new defense programs, however, Intel recommends migrating to radiation-tolerant or secure-device alternatives.

推薦

EPF6016AQC208-3S · Intel EPF6016AQC208-3N · Intel

推薦產品摘要

EPF6016AQC208-2 Altera 用於： Legacy 5 V Glue Logic Replacement, PCI / ISA Bus Bridge, ASIC Prototype Validation Platform, Industrial Control and Factory Automation EPF6016QC208-3 Altera 用於： Legacy 5 V Glue Logic Replacement, Industrial Control and Factory Automation EPF6016QC208 Altera 用於： PCI / ISA Bus Bridge EPF6016AQC208-2N Intel 用於： Telecommunication Line Card Glue Logic EPF6016AQC208-3 Intel 用於： Telecommunication Line Card Glue Logic EPF6016AQC208-1 Intel 用於： ASIC Prototype Validation Platform EPF6016AQC208-3S Intel 用於： Military / Aerospace Retrofit Boards EPF6016AQC208-3N Intel 用於： Military / Aerospace Retrofit Boards

What is the EPF6016QC208-2?

The EPF6016QC208-2 is an obsolete Intel/Altera FLEX 6000 family FPGA with 1,320 logic elements, 132 LABs, 16K usable gates, and 171 user I/Os in a 208-pin PQFP package, fabricated on a 0.42 µm 5 V CMOS SRAM process. It is intended for sustaining legacy 5 V-tolerant glue-logic designs where modern low-voltage FPGAs are not pin-compatible substitutes.

How many logic elements and LABs does the EPF6016QC208-2 have?

The EPF6016QC208-2 contains 1,320 logic elements (LEs) organized into 132 logic array blocks (LABs) of 10 LEs per LAB. Each LE uses a 4-input look-up table (LUT) with dedicated carry-chain and cascade-chain paths for high-speed arithmetic and wide-function implementation, per the FLEX 6000 datasheet architecture description.

Is the EPF6016QC208-2 still in production?

No, the EPF6016QC208-2 is classified as obsolete (EOL) by Intel/Altera, with no new wafer production. Remaining supply comes solely from authorized distributor inventory and aftermarket brokers; lead times may extend when existing stock is depleted. For new designs, Intel recommends the Cyclone series.

Where can I buy the EPF6016QC208-2?

Authorized distributors such as DigiKey, Mouser, Win Source, and Octopart-listed resellers (Xecor, Vyrian, Veswin) carry limited EPF6016QC208-2 stock. Pricing fluctuates with remaining inventory levels. Always verify authenticity via lot trace documentation for obsolete FPGA purchases.

What is the price of the EPF6016QC208-2?

As of 2026-09-11, EPF6016QC208-2 unit pricing starts around 18.50 USD at qty 1 and decreases to approximately 10.85 USD at qty 1000, based on aggregated DigiKey/Mouser distributor data. Obsolete FPGAs typically see price inflation as stock dwindles; obtain a current quote before committing to a design.

What is the lead time for the EPF6016QC208-2?

Lead time for the obsolete EPF6016QC208-2 ranges from immediate-ship (in-stock distributor lots) to 12-16 weeks for broker-resourced parts. Because the part is end-of-life, expect longer waits and minimum-order-quantity requirements; consider qualifying a same-package replacement in parallel.

What is the difference between EPF6016QC208-2 and EPF6016QC208-3?

The EPF6016QC208-2 is the -2 speed grade of the FLEX 6000 family, while the EPF6016QC208-3 is the -3 (slower) speed grade offering lower power at reduced Fmax. Both share the same 208-PQFP package, identical 1,320 LE / 132 LAB resources, and pin-for-pin compatibility, making them drop-in selectable per design timing budget.

Is the EPF6016AQC208-2 a drop-in replacement for EPF6016QC208-2?

Yes, the EPF6016AQC208-2 (FLEX 6000A revision) is a drop-in replacement for EPF6016QC208-2 in the same 208-PQFP package. Both share identical pinout, 1,320 LEs, and 132 LABs; the 'A' suffix denotes a die-shrink improvement offering higher internal Fmax and lower power at the same -2 speed grade.

Where do I download the EPF6016QC208-2 datasheet?

The official EPF6016QC208-2 datasheet is hosted on Intel's programmable logic literature archive. Search 'FLEX 6000 datasheet' on intel.com or use the legacy Altera URL https://www.altera.com/literature/ds/dsf6000.pdf to retrieve the device family data sheet covering pinout, electrical specs, and configuration guidelines.

What is the pinout of the EPF6016QC208-2?

The EPF6016QC208-2 uses a 208-pin PQFP (28x28 mm body) package with pin-1 marking at the top-left dot. The pin assignment includes 171 user I/O, dedicated JTAG pins (TMS, TCK, TDI, TDO), configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK), VCCINT (5 V core), and VCCIO bank supplies, per the FLEX 6000 datasheet pin tables.

Can the EPF6016QC208-2 be replaced by a Cyclone FPGA?

No, the Cyclone series is not pin-compatible with the EPF6016QC208-2 — Cyclone uses 1.5 V core and TQFP/BGA packages with completely different pin assignments. Cyclone is a footprint redesign, not a drop-in replacement. For drop-in 208-PQFP compatibility, stay within the FLEX 6000 / FLEX 6000A families.

How many user I/O pins does the EPF6016QC208-2 expose?

The EPF6016QC208-2 exposes 171 user I/O pins across four I/O banks, supporting 5 V LVTTL/LVCMOS and 3.3 V PCI-compliant interfaces. Each I/O cell contains a tri-state buffer, input register, and output enable/register, allowing flexible per-pin direction and registered I/O for synchronous designs.

What applications is the EPF6016QC208-2 used in?

The EPF6016QC208-2 is used in legacy 5 V-tolerant glue logic, PCI/ISA bus bridges, telecommunication line cards, industrial control boards, military/aerospace retrofit, and ASIC prototype validation. Its 5 V tolerance makes it especially valuable for sustaining older systems where modern FPGAs require level-shifting interfaces.

What is the maximum operating frequency of the EPF6016QC208-2?

The EPF6016QC208-2 (speed grade -2) supports a maximum internal frequency up to 125 MHz, sufficient for mid-complexity state machines, FIFO controllers, and bus-interface logic. Actual Fmax varies with routing density, fan-out, and I/O standard selection — consult the FLEX 6000 timing model for design-specific closure.

Is the EPF6016QC208-2 RoHS compliant?

RoHS compliance status for the EPF6016QC208-2 is not consistently documented in public sources because the part predates formal RoHS transition programs in many cases; verify the lead-finish code on the device marking. For new RoHS-compliant designs in the same footprint, consider the EPF6016AQC208-2 (FLEX 6000A revision).

工程參考資料，適用於 EPF6016QC208-2 — 比較、設計指引及合規資訊。

選型指南

Choose the EPF6016QC208-2 when you need an established FLEX 6000 FPGA with -2 mid-tier speed grade for general 5 V glue logic. If your timing margins are tight and power budget allows, prefer the EPF6016AQC208-2 (FLEX 6000A revision, higher Fmax, same package, recompile-only migration). If thermal headroom is the limiting factor, drop down to EPF6016QC208-3 for lower dynamic current at modest Fmax cost. For new RoHS-aligned production runs, choose the EPF6016AQC208-2N (lead-free FLEX 6000A). For military / aerospace programs needing special screening, the EPF6016AQC208-3S variant provides burn-in and extended-temperature options. All listed alternatives share the same 208-PQFP footprint, so PCB land pattern decisions are identical across the family.

與替代品比較

參數	本產品	EPF6016QC208-3	EPF6016QC208	EPF6016AQC208-2	EPF6016AQC208-3	EPF6016AQC208-3N
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	208-PQFP (28x28 mm)	208-PQFP - same	208-PQFP - same	208-PQFP - same	208-PQFP - same	208-PQFP - same
Logic Elements	1320	1320	1320	1320	1320	1320
Number of LABs	132	132	132	132	132	132
Usable Gates	16000	16000	16000	16000	16000	16000
User I/O Count	171	171	171	171	171	171
Core Voltage	5 V	5 V	5 V	5 V	5 V	5 V
Speed Grade	-2 (mid)	-3 (slower)	unspecified	-2 (FLEX 6000A)	-3 (FLEX 6000A)	-3 (FLEX 6000A, lead-free)
Architecture Revision	FLEX 6000 (original)	FLEX 6000 (original)	FLEX 6000 (original)	FLEX 6000A (improved)	FLEX 6000A (improved)	FLEX 6000A (improved)

主要差異化特點

FLEX 6000A architecture upgrade path with no footprint change (對比EPF6016AQC208-2)
Lower-power speed grade option for thermal-constrained retrofits (對比EPF6016QC208-3)
RoHS-aligned lead-free variant with full footprint compatibility (對比EPF6016AQC208-2N)

設計說明

The EPF6016QC208-2 requires a stable 5 V ±5% VCCINT supply and per-bank VCCIO (3.3 V or 5 V depending on I/O standard). Place 100 µF bulk + 0.1 µF ceramic decoupling within 5 mm of every supply pin; the 208-PQFP exposes multiple VCCINT and VCCIO pins distributed around the package periphery to minimize supply loop inductance. Sequence power-up such that VCCINT reaches 4.5 V before JTAG or configuration logic accesses the device.

Estimated: at typical FLEX 6000 quiescent current around 5 mA plus dynamic I/O switching, junction temperature rise stays below 10 °C in the 208-PQFP when the PCB provides at least 4 square inches of unbroken ground plane beneath the package. The plastic PQFP has theta_JA around 35-40 C/W. For industrial 0-85 °C ambient operation this headroom is adequate; for extended-temperature applications consider the FLEX 6000A revision with lower power.

The 208-PQFP uses 0.5 mm pitch gull-wing leads with a 28x28 mm body. Allocate a 30x30 mm land pattern area with 0.27 mm wide pads and 0.4 mm gaps; use a 4-layer PCB with one dedicated ground plane for clean signal return paths. JTAG pins (TMS/TCK/TDI/TDO) require 10 kΩ pull-ups to VCCIO for boundary-scan reliability.

Do not migrate FLEX 6000 bitstreams to FLEX 6000A parts without recompiling in Quartus II — the architecture revision requires fresh place-and-route. Configuration modes (PS, AS, JTAG) must be selected via MSEL pins per the FLEX 6000 datasheet; incorrect MSEL strapping leaves the device in an indeterminate state. Always include the EPC2 or EPC16 configuration device on the board or a JTAG header for in-system programming.

Series-terminate high-speed outputs (clock, bus drivers) with 33 Ω resistors placed within 5 mm of the FPGA pin to dampen reflections on traces longer than 50 mm. The 5 V LVTTL I/O has typical edge rates around 2-3 ns; without termination, parallel-terminated buses above 20 MHz may show ringing. Use the Quartus II Timing Analyzer to verify setup/hold across PVT corners before committing layout.

合規資訊

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

無鉛

無鹵

Unknown

衝突礦產

Unknown

EPF6016QC208-2 is an obsolete FLEX 6000 family part predating formal RoHS transition. RoHS/REACH status not consistently documented in distributor datasheets; consult Intel's PCN archive or the device marking for specific lead-finish code. AEC-Q100 is not applicable — FPGAs are typically not AEC-Q100 qualified; for automotive designs consult Intel Cyclone family.

資料驗證日期： 2026-09-11 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Distributor, Octopart, Distributor, Internal Db, Internal Db, Manufacturer Datasheet

EPF6016QC208-2 - FLEX 6000 FPGA, 16K Gates, 208-PQFP | Intel

EPF6016QC208-2 概覽

此系列的變體

EPF6016QC208-3

EPF6016QC208

EPF6016AQC208-2

EPF6016AQC208-3

EPF6016AQC208-3N

EPF6016AQC208-3S

EPF6016AQC208-2N

EPF6016AQC208-1

建議替代品（同類別與封裝）

EPF6016QC208-2 腳位配置

典型應用

推薦產品摘要

選型指南

與替代品比較

主要差異化特點

設計說明

合規資訊

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