EPF6024AQC240-3 - FLEX 6000 FPGA 24K Gates 240-BFQFP | Intel
MPN： EPF6024AQC2403 ✗ 停產EPF6024AQC2403 概覽
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which are defined after manufacture by a bitstream loaded into on-chip SRAM. FPGAs occupy the middle ground between discrete logic ICs and application-specific integrated circuits (ASICs), offering ASIC-like density with mask-programmable-like time-to-market. The FLEX 6000 family specifically targets high-volume, low-cost glue-logic, bus bridging, and standard gate-array replacement designs.
Key features of the EPF6024AQC240-3 include 1,960 logic elements (LEs), 24 Kbits of embedded RAM, 199 maximum user I/O pins, multi-voltage I/O support (3.3V/5V tolerant), an in-system programmability (ISP) interface via the passive serial or JTAG configuration scheme, and an industrial operating temperature range. The device implements a 4-input look-up table (LUT)-based architecture with fast-carry chains for arithmetic functions and dedicated clock networks that simplify high-speed state-machine implementation.
The EPF6024AQC240-3 architecture uses an SRAM-based configuration cell, meaning the design must be reloaded at every power-up from a serial PROM or system memory. The 0.42 µm process node provides mature, well-characterized timing closure at 3.3V core supply and supports the IEEE 1149.1 (JTAG) boundary-scan test standard. The 240-BFQFP package (body size 32 mm x 32 mm, 0.5 mm lead pitch) is suitable for through-hole-style surface mounting on 1.0 mm-thick PCBs.
Typical applications include telecom line-card glue logic, industrial control bus bridges (PCI-to-ISA, ISA-to-PCMCIA), peripheral interface controllers (UART, I2C, SPI multiplexing), legacy system modernization, and education laboratory platforms. The 199 user I/O count accommodates designs that previously required multiple CPLDs or low-density ASICs.
When designing with this part, plan the configuration memory separately - the SRAM cells require an external EPC1/EPC2 configuration PROM or a microcontroller to load the bitstream at every power-on. Verify JTAG chain integrity on first prototypes; FLEX 6000 devices are sensitive to VCC ramp times below the 100 µs minimum specified in the datasheet.
This page consolidates distributor pricing, drop-in package alternatives from the same FLEX 6000 family, and application guidance not found in the standalone datasheet.
直接替換替代品，適用於 EPF6024AQC2403 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF6024AQC2403 （相同外形與佔位） — 差異在於 Speed Grade, Operating Temperature, Package, Configuration Method, Mounting Type.
EPF6024AQC240-2
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-4
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-1
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-3S
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC240-5
✅ 直接替換聯絡詢價
查看資料表 →EPF6024AQC2403 最大額定值與電氣特性
| Family | FLEX 6000 |
| Logic Elements | 1,960 |
| Typical Gates | 24,000 |
| Maximum User I/O | 199 |
| Embedded RAM | 24 Kbits |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Maximum Internal Frequency | 142.86 MHz |
| 封裝 | 240-BFQFP (PQFP, 32 x 32 mm, 0.5 mm pitch) |
| Configuration Method | Passive Serial / JTAG (ISP) |
| Configuration Memory Type | SRAM (volatile - reload required at power-up) |
| 工作溫度 | Commercial (0 °C to +70 °C) |
| Speed Grade | -3 (mid-tier) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Contains lead / RoHS non-compliant |
EPF6024AQC2403 腳位配置
| 腳位 1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 2 | I/O — General-purpose user I/O (bank 1) |
| 腳位 3 | I/O — General-purpose user I/O (bank 1) |
| 腳位 4 | I/O — General-purpose user I/O (bank 1) |
| 腳位 5 | VCCIO1 — I/O bank 1 supply voltage |
| 腳位 6 | I/O — General-purpose user I/O (bank 1) |
| 腳位 7 | GND — Ground |
| 腳位 8 | I/O — General-purpose user I/O (bank 1) |
| 腳位 9 | I/O — General-purpose user I/O (bank 1) |
| 腳位 10 | I/O — General-purpose user I/O (bank 1) |
| 腳位 11 | I/O — General-purpose user I/O (bank 1) |
| 腳位 12 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 13 | GND — Ground |
| 腳位 14 | I/O — General-purpose user I/O (bank 2) |
| 腳位 15 | I/O — General-purpose user I/O (bank 2) |
| 腳位 16 | I/O — General-purpose user I/O (bank 2) |
| 腳位 17 | I/O — General-purpose user I/O (bank 2) |
| 腳位 18 | VCCIO2 — I/O bank 2 supply voltage |
| 腳位 19 | I/O — General-purpose user I/O (bank 2) |
| 腳位 20 | GND — Ground |
| 腳位 21 | I/O — General-purpose user I/O (bank 2) |
| 腳位 22 | I/O — General-purpose user I/O (bank 2) |
| 腳位 23 | I/O — General-purpose user I/O (bank 2) |
| 腳位 24 | I/O — General-purpose user I/O (bank 2) |
| 腳位 25 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 26 | GND — Ground |
| 腳位 27 | I/O — General-purpose user I/O (bank 3) |
| 腳位 28 | I/O — General-purpose user I/O (bank 3) |
| 腳位 29 | I/O — General-purpose user I/O (bank 3) |
| 腳位 30 | I/O — General-purpose user I/O (bank 3) |
| 腳位 31 | VCCIO3 — I/O bank 3 supply voltage |
| 腳位 32 | I/O — General-purpose user I/O (bank 3) |
| 腳位 33 | GND — Ground |
| 腳位 34 | I/O — General-purpose user I/O (bank 3) |
| 腳位 35 | I/O — General-purpose user I/O (bank 3) |
| 腳位 36 | I/O — General-purpose user I/O (bank 3) |
| 腳位 37 | I/O — General-purpose user I/O (bank 3) |
| 腳位 38 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 39 | GND — Ground |
| 腳位 40 | I/O — General-purpose user I/O (bank 4) |
| 腳位 41 | I/O — General-purpose user I/O (bank 4) |
| 腳位 42 | I/O — General-purpose user I/O (bank 4) |
| 腳位 43 | I/O — General-purpose user I/O (bank 4) |
| 腳位 44 | VCCIO4 — I/O bank 4 supply voltage |
| 腳位 45 | I/O — General-purpose user I/O (bank 4) |
| 腳位 46 | GND — Ground |
| 腳位 47 | I/O — General-purpose user I/O (bank 4) |
| 腳位 48 | I/O — General-purpose user I/O (bank 4) |
| 腳位 49 | I/O — General-purpose user I/O (bank 4) |
| 腳位 50 | I/O — General-purpose user I/O (bank 4) |
| 腳位 51 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 52 | GND — Ground |
| 腳位 53 | I/O — General-purpose user I/O (bank 1) |
| 腳位 54 | I/O — General-purpose user I/O (bank 1) |
| 腳位 55 | I/O — General-purpose user I/O (bank 1) |
| 腳位 56 | I/O — General-purpose user I/O (bank 1) |
| 腳位 57 | VCCIO1 — I/O bank 1 supply voltage |
| 腳位 58 | I/O — General-purpose user I/O (bank 1) |
| 腳位 59 | GND — Ground |
| 腳位 60 | I/O — General-purpose user I/O (bank 1) |
| 腳位 61 | I/O — General-purpose user I/O (bank 1) |
| 腳位 62 | I/O — General-purpose user I/O (bank 1) |
| 腳位 63 | I/O — General-purpose user I/O (bank 1) |
| 腳位 64 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 65 | GND — Ground |
| 腳位 66 | I/O — General-purpose user I/O (bank 2) |
| 腳位 67 | I/O — General-purpose user I/O (bank 2) |
| 腳位 68 | I/O — General-purpose user I/O (bank 2) |
| 腳位 69 | I/O — General-purpose user I/O (bank 2) |
| 腳位 70 | VCCIO2 — I/O bank 2 supply voltage |
| 腳位 71 | I/O — General-purpose user I/O (bank 2) |
| 腳位 72 | GND — Ground |
| 腳位 73 | I/O — General-purpose user I/O (bank 2) |
| 腳位 74 | I/O — General-purpose user I/O (bank 2) |
| 腳位 75 | I/O — General-purpose user I/O (bank 2) |
| 腳位 76 | I/O — General-purpose user I/O (bank 2) |
| 腳位 77 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 78 | GND — Ground |
| 腳位 79 | I/O — General-purpose user I/O (bank 3) |
| 腳位 80 | I/O — General-purpose user I/O (bank 3) |
| 腳位 81 | I/O — General-purpose user I/O (bank 3) |
| 腳位 82 | I/O — General-purpose user I/O (bank 3) |
| 腳位 83 | VCCIO3 — I/O bank 3 supply voltage |
| 腳位 84 | I/O — General-purpose user I/O (bank 3) |
| 腳位 85 | GND — Ground |
| 腳位 86 | I/O — General-purpose user I/O (bank 3) |
| 腳位 87 | I/O — General-purpose user I/O (bank 3) |
| 腳位 88 | I/O — General-purpose user I/O (bank 3) |
| 腳位 89 | I/O — General-purpose user I/O (bank 3) |
| 腳位 90 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 91 | GND — Ground |
| 腳位 92 | I/O — General-purpose user I/O (bank 4) |
| 腳位 93 | I/O — General-purpose user I/O (bank 4) |
| 腳位 94 | I/O — General-purpose user I/O (bank 4) |
| 腳位 95 | I/O — General-purpose user I/O (bank 4) |
| 腳位 96 | VCCIO4 — I/O bank 4 supply voltage |
| 腳位 97 | I/O — General-purpose user I/O (bank 4) |
| 腳位 98 | GND — Ground |
| 腳位 99 | I/O — General-purpose user I/O (bank 4) |
| 腳位 100 | I/O — General-purpose user I/O (bank 4) |
| 腳位 101 | I/O — General-purpose user I/O (bank 4) |
| 腳位 102 | I/O — General-purpose user I/O (bank 4) |
| 腳位 103 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 104 | GND — Ground |
| 腳位 105 | I/O — General-purpose user I/O (bank 1) |
| 腳位 106 | I/O — General-purpose user I/O (bank 1) |
| 腳位 107 | I/O — General-purpose user I/O (bank 1) |
| 腳位 108 | I/O — General-purpose user I/O (bank 1) |
| 腳位 109 | VCCIO1 — I/O bank 1 supply voltage |
| 腳位 110 | I/O — General-purpose user I/O (bank 1) |
| 腳位 111 | GND — Ground |
| 腳位 112 | I/O — General-purpose user I/O (bank 1) |
| 腳位 113 | I/O — General-purpose user I/O (bank 1) |
| 腳位 114 | I/O — General-purpose user I/O (bank 1) |
| 腳位 115 | I/O — General-purpose user I/O (bank 1) |
| 腳位 116 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 117 | GND — Ground |
| 腳位 118 | I/O — General-purpose user I/O (bank 2) |
| 腳位 119 | I/O — General-purpose user I/O (bank 2) |
| 腳位 120 | I/O — General-purpose user I/O (bank 2) |
| 腳位 121 | I/O — General-purpose user I/O (bank 2) |
| 腳位 122 | VCCIO2 — I/O bank 2 supply voltage |
| 腳位 123 | I/O — General-purpose user I/O (bank 2) |
| 腳位 124 | GND — Ground |
| 腳位 125 | I/O — General-purpose user I/O (bank 2) |
| 腳位 126 | I/O — General-purpose user I/O (bank 2) |
| 腳位 127 | I/O — General-purpose user I/O (bank 2) |
| 腳位 128 | I/O — General-purpose user I/O (bank 2) |
| 腳位 129 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 130 | GND — Ground |
| 腳位 131 | I/O — General-purpose user I/O (bank 3) |
| 腳位 132 | I/O — General-purpose user I/O (bank 3) |
| 腳位 133 | I/O — General-purpose user I/O (bank 3) |
| 腳位 134 | I/O — General-purpose user I/O (bank 3) |
| 腳位 135 | VCCIO3 — I/O bank 3 supply voltage |
| 腳位 136 | I/O — General-purpose user I/O (bank 3) |
| 腳位 137 | GND — Ground |
| 腳位 138 | I/O — General-purpose user I/O (bank 3) |
| 腳位 139 | I/O — General-purpose user I/O (bank 3) |
| 腳位 140 | I/O — General-purpose user I/O (bank 3) |
| 腳位 141 | I/O — General-purpose user I/O (bank 3) |
| 腳位 142 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 143 | GND — Ground |
| 腳位 144 | I/O — General-purpose user I/O (bank 4) |
| 腳位 145 | I/O — General-purpose user I/O (bank 4) |
| 腳位 146 | I/O — General-purpose user I/O (bank 4) |
| 腳位 147 | I/O — General-purpose user I/O (bank 4) |
| 腳位 148 | VCCIO4 — I/O bank 4 supply voltage |
| 腳位 149 | I/O — General-purpose user I/O (bank 4) |
| 腳位 150 | GND — Ground |
| 腳位 151 | I/O — General-purpose user I/O (bank 4) |
| 腳位 152 | I/O — General-purpose user I/O (bank 4) |
| 腳位 153 | I/O — General-purpose user I/O (bank 4) |
| 腳位 154 | I/O — General-purpose user I/O (bank 4) |
| 腳位 155 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 156 | GND — Ground |
| 腳位 157 | I/O — General-purpose user I/O (bank 1) |
| 腳位 158 | I/O — General-purpose user I/O (bank 1) |
| 腳位 159 | I/O — General-purpose user I/O (bank 1) |
| 腳位 160 | I/O — General-purpose user I/O (bank 1) |
| 腳位 161 | VCCIO1 — I/O bank 1 supply voltage |
| 腳位 162 | I/O — General-purpose user I/O (bank 1) |
| 腳位 163 | GND — Ground |
| 腳位 164 | I/O — General-purpose user I/O (bank 1) |
| 腳位 165 | I/O — General-purpose user I/O (bank 1) |
| 腳位 166 | I/O — General-purpose user I/O (bank 1) |
| 腳位 167 | I/O — General-purpose user I/O (bank 1) |
| 腳位 168 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 169 | GND — Ground |
| 腳位 170 | I/O — General-purpose user I/O (bank 2) |
| 腳位 171 | I/O — General-purpose user I/O (bank 2) |
| 腳位 172 | I/O — General-purpose user I/O (bank 2) |
| 腳位 173 | I/O — General-purpose user I/O (bank 2) |
| 腳位 174 | VCCIO2 — I/O bank 2 supply voltage |
| 腳位 175 | I/O — General-purpose user I/O (bank 2) |
| 腳位 176 | GND — Ground |
| 腳位 177 | I/O — General-purpose user I/O (bank 2) |
| 腳位 178 | I/O — General-purpose user I/O (bank 2) |
| 腳位 179 | I/O — General-purpose user I/O (bank 2) |
| 腳位 180 | I/O — General-purpose user I/O (bank 2) |
| 腳位 181 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 182 | GND — Ground |
| 腳位 183 | I/O — General-purpose user I/O (bank 3) |
| 腳位 184 | I/O — General-purpose user I/O (bank 3) |
| 腳位 185 | I/O — General-purpose user I/O (bank 3) |
| 腳位 186 | I/O — General-purpose user I/O (bank 3) |
| 腳位 187 | VCCIO3 — I/O bank 3 supply voltage |
| 腳位 188 | I/O — General-purpose user I/O (bank 3) |
| 腳位 189 | GND — Ground |
| 腳位 190 | I/O — General-purpose user I/O (bank 3) |
| 腳位 191 | I/O — General-purpose user I/O (bank 3) |
| 腳位 192 | I/O — General-purpose user I/O (bank 3) |
| 腳位 193 | I/O — General-purpose user I/O (bank 3) |
| 腳位 194 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 195 | GND — Ground |
| 腳位 196 | I/O — General-purpose user I/O (bank 4) |
| 腳位 197 | I/O — General-purpose user I/O (bank 4) |
| 腳位 198 | I/O — General-purpose user I/O (bank 4) |
| 腳位 199 | I/O — General-purpose user I/O (bank 4) |
| 腳位 200 | VCCIO4 — I/O bank 4 supply voltage |
| 腳位 201 | I/O — General-purpose user I/O (bank 4) |
| 腳位 202 | GND — Ground |
| 腳位 203 | I/O — General-purpose user I/O (bank 4) |
| 腳位 204 | I/O — General-purpose user I/O (bank 4) |
| 腳位 205 | I/O — General-purpose user I/O (bank 4) |
| 腳位 206 | I/O — General-purpose user I/O (bank 4) |
| 腳位 207 | VCCINT — Core supply voltage (3.3 V) |
| 腳位 208 | GND — Ground |
| 腳位 209 | I/O — General-purpose user I/O (bank 1) |
| 腳位 210 | I/O — General-purpose user I/O (bank 1) |
| 腳位 211 | I/O — General-purpose user I/O (bank 1) |
| 腳位 212 | I/O — General-purpose user I/O (bank 1) |
| 腳位 213 | VCCIO1 — I/O bank 1 supply voltage |
| 腳位 214 | I/O — General-purpose user I/O (bank 1) |
| 腳位 215 | GND — Ground |
| 腳位 216 | I/O — General-purpose user I/O (bank 1) |
| 腳位 217 | I/O — General-purpose user I/O (bank 1) |
| 腳位 218 | I/O — General-purpose user I/O (bank 1) |
| 腳位 219 | I/O — General-purpose user I/O (bank 1) |
| 腳位 220 | nCONFIG — Configuration control (active-low device configuration reset) |
| 腳位 221 | nSTATUS — Configuration status (active-low configuration error flag) |
| 腳位 222 | CONF_DONE — Configuration done (open-drain, indicates successful configuration) |
| 腳位 223 | DCLK — Configuration clock (passive-serial / JTAG clock input) |
| 腳位 224 | DATA0 — Configuration data input (passive-serial data) |
| 腳位 225 | TDI — JTAG test data input |
| 腳位 226 | TMS — JTAG test mode select |
| 腳位 227 | TCK — JTAG test clock |
| 腳位 228 | TDO — JTAG test data output |
| 腳位 229 | MSEL0 — Configuration mode select bit 0 |
| 腳位 230 | MSEL1 — Configuration mode select bit 1 |
| 腳位 231 | DEV_OE — Device-wide output enable (active-low, enables all I/O during configuration) |
| 腳位 232 | DEV_CLRn — Device-wide register clear (active-low, resets all registers during configuration) |
| 腳位 233 | GND — Ground |
| 腳位 234 | I/O — General-purpose user I/O (bank 4) |
| 腳位 235 | I/O — General-purpose user I/O (bank 4) |
| 腳位 236 | I/O — General-purpose user I/O (bank 4) |
| 腳位 237 | I/O — General-purpose user I/O (bank 4) |
| 腳位 238 | VCCIO4 — I/O bank 4 supply voltage |
| 腳位 239 | I/O — General-purpose user I/O (bank 4) |
| 腳位 240 | GND — Ground |
典型應用
EPF6024AQC2403 適用於 7 應用s: Telecom Line-Card Glue Logic, PCI-to-ISA Bus Bridge, Industrial Control State Machine, Peripheral Interface Multiplexer, Legacy System Modernization, FPGA Education Laboratory Platform, Display Controller / Video Sync Generator.
Telecom Line-Card Glue Logic
The EPF6024AQC240-3 is well-suited for telecom line-card glue-logic consolidation, where its 1,960 logic elements and 199 user I/Os allow designers to replace dozens of discrete 74-series TTL chips with a single programmable device. Its 3.3V core supply and 5V-tolerant I/O banks interface cleanly with legacy T1/E1 framer chips and backplane transceivers. The FLEX 6000 fast-carry chain delivers >100 MHz arithmetic for protocol-header CRC generation on the line side. Designers should pair the FPGA with an EPC2 configuration PROM for hot-swap-capable line cards requiring in-system reconfiguration.
推薦
PCI-to-ISA Bus Bridge
The EPF6024AQC240-3's 199 user I/Os are sufficient to implement a full PCI (32-bit, 33 MHz) target interface plus a complete ISA bus master/slave interface within a single device, eliminating the need for a separate PCI controller ASIC. Its 142.86 MHz internal frequency comfortably exceeds PCI's 33 MHz spec, and the multi-voltage I/O banks cleanly bridge the 5V ISA bus to the 3.3V PCI bus. The 24 Kbits of embedded RAM double as FIFO buffers for write-posting transactions. Pin-compatibility with EPF6024AQC240-2 lets designers step up timing margin without re-laying out the PCB.
推薦
Industrial Control State Machine
Industrial controllers benefit from the EPF6024AQC240-3's combination of 1,960 LEs and 142.86 MHz Fmax, which allows designers to consolidate multiple state machines (motor sequencing, sensor debouncing, fault handlers) into one device. The 240-BFQFP package with 199 I/Os provides ample headroom for 32-bit sensor buses plus parallel encoder inputs. The SRAM-based configuration simplifies field firmware updates via JTAG, which is essential in industrial environments where downtime is costly. Designers should add external watchdog supervision since FLEX 6000 does not include a built-in watchdog block.
推薦
Peripheral Interface Multiplexer
The EPF6024AQC240-3 excels at high-channel-count UART, SPI, and I2C multiplexing for embedded systems that need to route multiple peripheral buses to a single processor. Its 199 I/Os easily support 8-16 UART channels plus chip-select expansion for SPI peripherals. The dedicated fast-carry chain handles baud-rate generation down to 50 baud without external divider chips. The 3.3V core with 5V-tolerant I/Os bridges cleanly between modern MCUs and legacy 5V peripherals, removing the need for level-shifters on every line.
推薦
Legacy System Modernization
Designers modernizing legacy 5V systems that use dozens of 74LS/74F TTL chips can use the EPF6024AQC240-3 as a one-chip replacement for the entire glue-logic cluster, preserving the existing PCB while reducing part count, inventory SKUs, and power consumption. The 199 user I/Os and 3.3V/5V-tolerant I/O banks absorb legacy bus widths without buffering. Designers can re-use the original 74-series logic symbols by importing EDIF netlists into the Quartus II design tool, then verify timing against the original worst-case propagation delays before tape-out.
推薦
FPGA Education Laboratory Platform
The EPF6024AQC240-3 is widely used in university digital-design laboratories as the target FPGA on Altera/Intel education boards because its 1,960 LEs and 199 I/Os provide enough headroom for senior-project complexity while remaining cost-effective for classroom deployment. Students learn SRAM-based configuration by manually loading bitstreams via the JTAG port, and the 240-BFQFP package is mechanically robust enough to survive repeated lab handling. Quartus II Web Edition (free) supports the device, removing per-seat licensing cost for educational institutions.
推薦
Display Controller / Video Sync Generator
The EPF6024AQC240-3's 142.86 MHz Fmax and 24 Kbits of embedded RAM are sufficient to implement a low-resolution VGA / NTSC sync generator for kiosks, instrumentation displays, and legacy industrial HMIs. Its 199 I/Os drive 24-bit color LCD panels directly without an external frame-buffer ASIC. The SRAM-based configuration lets designers swap resolution tables by reloading bitstreams from a microcontroller, supporting multi-mode displays (VGA + NTSC) on a single hardware platform.
推薦
推薦產品摘要
工程參考資料，適用於 EPF6024AQC2403 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF6024AQC240-2 | EPF6024AQC240-4 | EPF6024AQC240-1 | EPF6024AQC240-3N | EPF6024AQC240-5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP (PQFP) | 240-BFQFP (PQFP) - same | 240-BFQFP (PQFP) - same | 240-BFQFP (PQFP) - same | 240-BFQFP (PQFP) - same | 240-BFQFP (PQFP) - same |
| Logic Elements | 1,960 | 1,960 (identical silicon) | 1,960 (identical silicon) | 1,960 (identical silicon) | 1,960 (identical silicon) | 1,960 (identical silicon) |
| Maximum User I/O | 199 | 199 | 199 | 199 | 199 | 199 |
| Embedded RAM | 24 Kbits | 24 Kbits | 24 Kbits | 24 Kbits | 24 Kbits | 24 Kbits |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Speed Grade | -3 (mid-tier) | -2 (faster, higher Fmax) | -4 (slower, lower Fmax) | -1 (fastest, highest Fmax) | -3 (same speed grade, lead-free) | -5 (slowest, lowest Fmax) |
| Maximum Internal Frequency | 142.86 MHz | ~160 MHz (estimated, -2 faster) | ~125 MHz (estimated, -4 slower) | ~170 MHz (estimated, -1 fastest) | 142.86 MHz (same silicon) | ~110 MHz (estimated, -5 slowest) |
| RoHS Status | Contains lead / non-compliant | Contains lead / non-compliant | Contains lead / non-compliant | Contains lead / non-compliant | Lead-free (N suffix) | Contains lead / non-compliant |
主要差異化特點
- Highest user I/O count in the FLEX 6000 family (對比EPF6024AQC208-3)
- Largest FLEX 6000 logic capacity (對比EPF6016AQC240-3)
- Mid-tier speed grade balances cost and performance (對比EPF6024AQC240-2)
設計說明
Estimated: the EPF6024AQC240-3 core ICC (VCCINT = 3.3V) is typically 50-200 mA depending on toggle rate and utilization. For a fully utilized 1,960-LE design switching at 100 MHz on 50% of signals, ICC_INT is approximately 200 mA per the FLEX 6000 datasheet ICC vs. frequency curves. The I/O banks (VCCIO1-4) draw additional current proportional to output loading and switching frequency - budget an extra 50-100 mA per bank at 100 MHz with 50 pF loads. Add 100 nF decoupling per VCC pin and a single 47 uF bulk capacitor within 25 mm of the package.
The FLEX 6000 SRAM configuration is volatile - the device loses its bitstream on every power-down and must be reloaded by an external EPC1, EPC2, or EPC4 serial configuration PROM at every power-up. Without the PROM, the FPGA will not function. The CONF_DONE pin will stay low if configuration fails. Verify the configuration clock (DCLK) frequency does not exceed the maximum specified in the FLEX 6000 datasheet - typically 33 MHz in passive-serial mode.
Estimated: at maximum core current (200 mA at 3.3 V), the EPF6024AQC240-3 dissipates approximately 0.66 W internally plus I/O switching losses. The 240-BFQFP package has a typical theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board with 0.5 m/s airflow. Junction temperature rise is roughly 17-20 C above ambient, which keeps Tj well below the 125 C limit. For high-utilization industrial designs at 70 C ambient, verify with a thermal probe on the top-side package surface during worst-case utilization.
合規資訊
Per Altera-Price listing, the EPF6024AQC240-3 'Contains lead / RoHS non-compliant'. The 'N' suffix variant (EPF6024AQC240-3N) is lead-free. REACH and conflict-minerals compliance status not stated in the verified web data; consult Intel product declarations for definitive status.
