LS1024ASE7ELA - QorIQ Layerscape Dual-Core ARM SoC 650MHz | NXP
MPN： LS1024ASE7ELA ✓ 啟用中LS1024ASE7ELA 概覽
An ARM Cortex-A9 is a 32-bit processor core implementing the ARMv7-A architecture with out-of-order execution, NEON SIMD, and hardware virtualization extensions. The LS1024A belongs to the Layerscape family of communications processors - a product hierarchy of MPU > microprocessor > communications SoC > system-on-chip - optimized for packet inspection, VPN/SSL acceleration, and QoS-aware routing at low power.
Key features include dual-core 650 MHz Cortex-A9 with NEON, integrated security engine for IPSec/SSL, DDR3 controller with ECC, three PCIe Gen2 controllers, two SATA 3 Gbps ports, two Gigabit Ethernet MACs, TDM/HFC interfaces for 8-channel VoIP with DECT baseband support, and hardware packet classification. The device operates from 0 to 70 C junction with typical SoC power of 3 to 6 W under full packet load.
The SoC uses a 32-bit architecture with tightly-coupled L1 caches and a shared L2 cache, plus dedicated engines offloading encryption (SEC 4.0), pattern matching, and table lookup from the CPU. This frees the Cortex-A9 cores for control-plane and routing tasks, which is why Layerscape parts are widely deployed in SMB gateways where BOM cost and software compatibility matter.
Typical applications include broadband home routers, VoIP/IAD gateways with DECT, IoT gateways, low-end network attached storage, and SMB security appliances. The combination of GbE plus PCIe plus SATA in a single 21x21 mm package eliminates external bridge chips and shrinks board footprint compared to discrete MPU + PHY designs.
When designing with the LS1024A, ensure the 625-ball FCPBGA has at least 4 PCB layers with continuous ground planes under the package, since DDR3 signal integrity depends on short, matched-length routing to LPDDR/DDR3 chips. The 0 to 70 C Ta rating precludes industrial or automotive deployment; for those ranges consider LS1024A industrial-grade siblings or Layerscape LS1012A/LS1043A successors.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design guidance not found in the manufacturer datasheet, giving procurement and engineering teams a single source for LS1024ASE7ELA evaluation.
直接替換替代品，適用於 LS1024ASE7ELA — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LS1024ASE7ELA （相同外形與佔位） — 差異在於 Core Architecture, Ethernet, Mounting Type, Number of Cores, Operating Temperature.
LS1024ASN7JLA
✅ 直接替換聯絡詢價
查看資料表 →LS1024ASE7KLA
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LS1024ASE7HLA
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LS1024ASE7ELA 最大額定值與電氣特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | QorIQ Layerscape LS1024A |
| Core Architecture | ARM Cortex-A9 (32-bit ARMv7-A) |
| Number of Cores | 2 (dual-core) |
| Core Frequency | 650 MHz |
| NEON SIMD Engine | Yes (per core) |
| L1 Cache | 32 KB I-cache + 32 KB D-cache per core |
| 工作溫度 | 0 C to +70 C (Ta, commercial) |
| 封裝 | 625-FCPBGA (21x21 mm) |
| 安裝類型 | Surface Mount (BGA) |
| DDR Memory Controller | DDR3 with ECC support |
| Ethernet | 2x Gigabit Ethernet MAC |
| PCIe | 3x PCIe Gen 2 controllers |
| SATA | 2x SATA 3 Gbps ports |
| Security Engine | SEC 4.0 (IPSec/SSL acceleration) |
| VoIP/DECT | 8-channel VoIP, DECT baseband support |
| MSL 等級 | 3 (per JEDEC J-STD-020 for FCPBGA) |
| RoHS 狀態 | Compliant |
LS1024ASE7ELA 625-fcpbga (21x21 mm) 腳位配置指南
LS1024ASE7ELA（625-fcpbga (21x21 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： LS1024ASE7ELA.
請參閱 資料表 以查看完整腳位配置。
典型應用
LS1024ASE7ELA 適用於 6 應用s: Broadband Home Gateway Router, VoIP IAD Gateway with DECT, IoT Edge Gateway and Aggregation Hub, Low-End Network Attached Storage (NAS), SMB Unified Threat Management (UTM) Appliance, Smart Home and Building Automation Hub.
Broadband Home Gateway Router
The LS1024ASE7ELA is purpose-built for broadband home gateways where dual-core ARM Cortex-A9 at 650 MHz, integrated GbE, PCIe, and packet-processing engines deliver routing throughput without external accelerators. The SoC's SEC 4.0 engine offloads IPSec/SSL so VPN tunnels can be sustained at line rate, while DDR3 with ECC protects against single-bit memory errors in always-on consumer deployments. The 625-FCPBGA package (21x21 mm) collapses what previously required an MPU + PHY + encryption chip into one die, reducing BOM and PCB area. With the 0 to 70 C commercial temperature grade, it fits indoor cabinet thermal envelopes across global markets.
推薦
VoIP IAD Gateway with DECT
The LS1024ASE7ELA uniquely integrates an 8-channel VoIP DSP and DECT baseband controller alongside the dual Cortex-A9 cores, replacing a discrete VoIP/DECT chipset in integrated access devices (IADs). The hardware offloads G.711/G.729 voice codecs and DECT slot synchronization from the CPU, freeing the application processor for SIP stack and call routing. Two Gigabit Ethernet MACs feed WAN and LAN segments, while SATA 3 Gbps supports local call recording or voicemail storage. The SoC's QoS hardware classifies voice packets ahead of best-effort data, eliminating jitter that would otherwise degrade call quality on congested uplinks.
推薦
IoT Edge Gateway and Aggregation Hub
For IoT edge gateways aggregating BLE/Zigbee/Wi-Fi sub-gateway traffic into the cloud, the LS1024ASE7ELA's three PCIe Gen 2 lanes host multiple wireless modules simultaneously while the dual Cortex-A9 cores handle MQTT, TLS termination, and local analytics. The SEC 4.0 engine accelerates TLS handshakes for thousands of concurrent sensor streams, and DDR3 with ECC keeps memory-resident rule tables consistent under thermal stress. SATA 3 Gbps enables local buffering of sensor bursts before cloud upload, while the GbE uplinks serve as redundant WAN paths. The 21x21 mm FCPBGA is small enough for wall-mount and DIN-rail enclosure formats common in industrial IoT.
推薦
Low-End Network Attached Storage (NAS)
The LS1024ASE7ELA suits entry-level 2-bay NAS appliances where dual SATA 3 Gbps ports connect directly to HDD bays without a separate RAID controller, and the GbE MAC supports link aggregation to a residential router. The SEC 4.0 engine accelerates SMB3 encryption so file transfers don't bottleneck on software crypto, and DDR3 with ECC is essential for ZFS or Btrfs data integrity in always-on file servers. The dual Cortex-A9 cores split between the NAS file-system daemon (Samba/NFS) and the web management UI without contention. Commercial 0 to 70 C operation fits the home/soho thermal envelope.
推薦
SMB Unified Threat Management (UTM) Appliance
For SMB UTM appliances combining firewall, IPSec VPN, and intrusion prevention, the LS1024ASE7ELA's SEC 4.0 engine and pattern-matching hardware accelerators sustain multi-gigabit threat inspection without software fall-through. The dual Cortex-A9 cores at 650 MHz host the Linux control plane, while dedicated engines offload crypto and DPI workloads. Three PCIe Gen 2 lanes expand into additional crypto accelerators or 10 GbE uplinks for branch-office aggregation. The commercial 0 to 70 C window targets climate-controlled server closets and wiring rooms typical of SMB deployments.
推薦
Smart Home and Building Automation Hub
The LS1024ASE7ELA enables smart home/building automation hubs that bridge KNX, Zigbee, Z-Wave, and Wi-Fi sub-systems into a unified cloud API. The dual Cortex-A9 cores handle concurrent wireless protocol stacks while the integrated GbE uplinks connect to the building's Ethernet backbone. PCIe lanes host multiple wireless co-processors (Wi-Fi 5/6 NICs, 802.15.4 radios), and SATA allows local event logging or video buffer storage for doorbell integrations. DDR3 with ECC protects configuration databases that must survive years of uptime, and the commercial 0 to 70 C temperature supports in-wall and ceiling-mount enclosure placements.
推薦
推薦產品摘要
工程參考資料，適用於 LS1024ASE7ELA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LS1024ASN7JLA | LS1024ASE7KLA | LS1024ASE7HLA |
|---|---|---|---|---|
| Package | 625-FCPBGA (21x21 mm) | 625-FCPBGA (21x21 mm) - same | 625-FCPBGA (21x21 mm) - same | 625-FCPBGA (21x21 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Architecture | Dual ARM Cortex-A9 650 MHz | Dual ARM Cortex-A9 650 MHz | Dual ARM Cortex-A9 650 MHz | Dual ARM Cortex-A9 650 MHz |
| Operating Temperature | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) |
| VoIP/DECT Channels | 8 channels | 8 channels | 8 channels | 8 channels |
| Gigabit Ethernet | 2x GbE MAC | 2x GbE MAC | 2x GbE MAC | 2x GbE MAC |
| PCIe Lanes | 3x PCIe Gen 2 | 3x PCIe Gen 2 | 3x PCIe Gen 2 | 3x PCIe Gen 2 |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant |
主要差異化特點
- Integrated 8-channel VoIP/DECT engine (對比LS1020AXE7KQB)
- Industrial-temperature drop-in sibling (對比LS1024ASN7JLA)
- SEC 4.0 hardware crypto engine (對比Generic Cortex-A9 SoC)
設計說明
The 625-FCPBGA at 21x21 mm requires a minimum 4-layer PCB with continuous ground plane directly under the package. DDR3 traces must be length-matched within 25 mil to the controller balls and routed on an inner stripline layer with reference ground planes above and below. Estimated: BGA escape vias at 0.4 mm pitch demand 0.2 mm laser-drilled microvias with filled-and-capped plating per IPC-6012 Class 3 for reliable assembly.
The LS1024ASE7ELA dissipates 3 to 6 W typical under full packet load. Without a heatsink, junction temperature rise above ambient must be estimated from board layout - a 4-layer FR-4 board with no copper pour typically gives theta_JA around 15 to 20 C/W. For reliable 70 C ambient operation, attach a 15x15 mm copper pad heatsink or 4 thermal vias under the die-expose pad to keep Tj below 105 C.
Power sequencing requires VDD (core) to ramp before VDDIO (DDR3 I/O) per the NXP LS1024A reference manual. Use a PMIC with sequence control such as the NXP PF0100 or equivalent. Decoupling: place 0.1 uF X7R 0402 capacitors within 2 mm of every power pin, plus bulk 22 uF tantalum or polymer caps on each supply rail. Inrush current during DDR3 initialization can peak at 4 A - size upstream regulator accordingly.
PCIe Gen 2 signals require 85 ohm differential impedance with intra-pair skew below 5 ps. Use an embedded microstrip on the layer adjacent to the ground plane. SATA 3 Gbps needs 100 ohm differential with similar skew control. GbE RGMII traces should be length-matched within 50 mil on source-synchronous clock and data lines to avoid setup/hold violations at 125 MHz DDR.
合規資訊
RoHS compliant per NXP product page. Halogen-free status not explicitly confirmed in distributor listings; request NXP material declaration if required. Not AEC-Q100 qualified - this is a commercial communications SoC, not automotive. REACH compliance status per NXP product declaration.
