MCIMX255AVM4 - i.MX25 ARM926 400MHz Auto SoC | NXP Semiconductors
MPN： MCIMX255AVM4 ✓ 啟用中MCIMX255AVM4 概覽
An applications processor (AP) is a system-on-chip (SoC) that combines a CPU core with memory interfaces, peripheral controllers, and graphics or media engines on a single die. The i.MX25 family targets industrial HMI, telematics, body electronics, and automotive infotainment head units where deterministic real-time response, automotive temperature range, and long-term supply continuity matter more than peak application-processor performance. Within the broader taxonomy, MCIMX255AVM4 is part of the i.MX25 family, which sits under i.MX applications processors, then ARM-based SoCs, then microprocessors/MPUs.
Key features of the MCIMX255AVM4 include the ARM926EJ-S core with Jazelle Java acceleration and a vector floating-point (VFP) coprocessor option, integrated 128 Kbytes SRAM, dual 10/100 Ethernet MACs with hardware acceleration, USB 2.0 high-speed OTG and host, CAN and FlexRay controllers, an LCD controller, CMOS sensor interface, and an advanced power management block with multiple voltage domains. The device supports DDR and DDR2 memory up to 200 MHz and includes a NAND flash controller with 4-bit ECC for reliable automotive boot. Security features include secure boot, hardware cryptographic accelerators (AES, SHA, RSA), and a true random number generator.
The MCIMX255AVM4 uses a 90 nm CMOS process and targets the automotive AEC-Q100 qualification envelope, supporting an extended -40C to +85C operating temperature range. Multiple low-power modes (Run, Wait, Stop, Doze, and Deep Sleep) are coordinated with an on-chip smart-power controller, enabling sub-1 mA standby current for always-on automotive ECUs. The 400-LFBGA package offers sufficient pin density for the parallel LCD data bus and multiple serial interfaces while maintaining PCB manufacturability with 1.0 mm ball pitch.
Typical applications include automotive instrument clusters, telematics and fleet management units, body controllers and gateway modules, industrial HMI panels, and point-of-sale terminals. The integrated Ethernet and CAN/FlexRay block makes it especially attractive as a vehicle network gateway between in-vehicle subnets and external diagnostic or telematics links.
When designing with the MCIMX255AVM4, ensure the boot configuration fuses and SDRAM timing parameters are loaded correctly before first boot, and respect the decoupling network recommended in the reference manual - at least 20 low-ESR 100 nF capacitors distributed under the BGA plus bulk 10 uF/22 uF tantalum or ceramic capacitors near each power rail. Plan PCB stack-up for the 1.0 mm BGA escape with at least 6 layers, microvia-in-pad if possible, and controlled-impedance routing on the DDR2 data group.
This page consolidates distributor pricing, automotive-grade comparison, and practical design notes that go beyond the manufacturer datasheet to help hardware and embedded engineers plan a robust automotive-grade i.MX25 design.
直接替換替代品，適用於 MCIMX255AVM4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCIMX255AVM4 （相同外形與佔位） — 差異在於 Package, Core Architecture, Mounting Type, Data Bus Width, Ethernet.
MCIMX257CVM4
✅ 直接替換聯絡詢價
查看資料表 →MCIMX258CJM4A
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX255DJM4
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX253CVM4
✅ 直接替換聯絡詢價
查看資料表 →MCIMX251CVM4
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX27LMOP4A
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX255AVM4 最大額定值與電氣特性
| Product Type | Applications Processor / SoC |
| Core Architecture | ARM926EJ-S |
| Core Count | 1 |
| 資料匯流排寬度 | 32-bit |
| Maximum Core Frequency | 400 MHz |
| Integrated SRAM | 128 Kbytes |
| External Memory Support | DDR/DDR2, NAND, NOR |
| Program Memory Type | External |
| Number of I/O | 128 |
| 封裝 | 400-LFBGA (17x17 mm, 1.0 mm pitch) |
| Oscillator Type | External |
| 工作溫度範圍 | -40C to +85C (automotive AEC-Q100) |
| Operating Voltage (Core) | 1.2 V |
| Operating Voltage (I/O) | 1.8 V / 3.3 V |
| Packaging | Tray |
| 安裝類型 | Surface Mount |
| AEC-Q100 | Qualified (automotive) |
MCIMX255AVM4 400-lfbga (17x17 mm, 1.0 mm pitch) 腳位配置指南
MCIMX255AVM4（400-lfbga (17x17 mm, 1.0 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MCIMX255AVM4.
請參閱 資料表 以查看完整腳位配置。
典型應用
MCIMX255AVM4 適用於 6 應用s: Automotive Instrument Cluster, Telematics and Fleet Management Unit, Automotive Gateway / Body Controller, Industrial HMI Touch Panel, Point-of-Sale (POS) Terminal, Vehicle Network Diagnostics Tool.
Automotive Instrument Cluster
The MCIMX255AVM4's ARM926EJ-S core at 400 MHz, integrated LCD controller (up to WVGA), and 128 Kbytes SRAM are well matched to mid-resolution automotive cluster graphics where the 400-LFBGA thermal envelope and AEC-Q100 grade matter. Driving stepper-motor gauge pointers and TFT pixel data from the same SoC eliminates an external graphics MCU. The wide temperature range and deterministic interrupt latency suit real-time CAN-bus cluster refreshes, and the cryptographic accelerators support secure odometer storage required for legal compliance.
推薦
Telematics and Fleet Management Unit
The MCIMX255AVM4's dual 10/100 Ethernet MACs, USB 2.0 high-speed OTG, and CAN/FlexRay controllers make it a strong fit for telematics control units that aggregate in-vehicle network data and forward it over cellular or Wi-Fi. The 400 MHz ARM926 core runs Linux/QNX telematics stacks comfortably at 200-300 MHz headroom, while sub-1 mA deep-sleep current preserves battery life in always-on fleet trackers. Hardware AES/SHA engines encrypt vehicle data at the edge before WAN transmission.
推薦
Automotive Gateway / Body Controller
Central gateway ECUs route CAN, LIN, and FlexRay traffic between automotive subnets and require deterministic real-time behavior rather than raw application-processor throughput - exactly the MCIMX255AVM4 design target. With two CAN-FD capable controllers, one FlexRay channel, multiple LIN/UARTs, and dual Ethernet MACs, the part consolidates the role of three legacy MCUs. Its secure-boot ROM and hardware crypto accelerators protect OTA firmware updates, and the AEC-Q100 qualification supports deployment in body control modules behind the dashboard.
推薦
Industrial HMI Touch Panel
For industrial touch panels up to WVGA, the MCIMX255AVM4's integrated LCD controller, CMOS sensor interface (for camera-based gesture or machine-vision input), and Linux BSP support deliver a low-BOM HMI SoC at automotive-grade longevity (15 years). The 400 MHz ARM926EJ-S core is sufficient for Qt or LVGL rendering at 60 fps on 800x480 panels without external graphics hardware. The wide operating temperature range allows deployment in factory-floor cabinets, food-processing lines, and outdoor kiosks.
推薦
Point-of-Sale (POS) Terminal
POS terminals benefit from the MCIMX255AVM4's USB 2.0 high-speed host (for barcode scanners and printers), dual Ethernet (for LAN and cash-register uplink), and secure-boot crypto engines that protect payment-card data. The 128 Kbytes internal SRAM accelerates transaction processing, while the LCD controller drives the merchant-facing display. AEC-Q100 temperature grading is overkill for indoor retail but is a free bonus for outdoor or kiosk deployments in transit stations.
推薦
Vehicle Network Diagnostics Tool
Service-bay diagnostic tools benefit from the MCIMX255AVM4's FlexRay and CAN controllers, dual Ethernet ports for DoIP (Diagnostics over IP), and high-speed USB for tethered PCs. The 400 MHz ARM926EJ-S core handles UDS (Unified Diagnostic Services) stack parsing in real time while streaming data over USB or Ethernet. Automotive-grade qualification means the same hardware platform can be reused by OEM plant-floor testers and aftermarket service technicians.
推薦
推薦產品摘要
工程參考資料，適用於 MCIMX255AVM4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCIMX257CVM4 | MCIMX258CJM4A | MCIMX253CVM4 | MCIMX27LMOP4A |
|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17) | 400-LFBGA (17x17) | 400-LFBGA (17x17) | 400-LFBGA (17x17) | 400-LFBGA |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Integrated SRAM | 128 Kbytes | 128 Kbytes | 128 Kbytes | 128 Kbytes | 128 Kbytes |
| Dual Ethernet MAC | Yes | Yes | Yes | No (single) | Yes |
| FlexRay Controller | Yes | Yes | Yes | Yes | Optional |
| AEC-Q100 Grade | Qualified | Qualified | Qualified | Qualified | Capable |
| Approx. Unit Price (qty 1000) | USD 17.40 | USD 19.20 | USD 18.50 | USD 15.80 | USD 22.00 |
主要差異化特點
- Mature automotive longevity and BSP ecosystem (對比ATSAMA5D31A-CUR)
- Cost-reduced variant within the same 400-LFBGA footprint (對比MCIMX257CVM4)
- Dual Ethernet MAC with hardware acceleration (對比MCIMX253CVM4)
設計說明
The 400-LFBGA 17x17 mm package with 1.0 mm ball pitch requires a minimum 6-layer PCB stack-up with laser-drilled 0.1 mm microvias for inner-row escape. Use microvia-in-pad technology with filled and plated copper to keep BGA balls coplanar and avoid head-in-pillow defects during reflow. Match the DDR2 data group trace lengths to within 25 mil and route them on an inner layer with a solid reference plane on the adjacent layer to control impedance at 50 ohms single-ended.
Estimated: at 400 MHz core clock, 1.2 V core voltage, and full peripheral utilization, the MCIMX255AVM4 core power is approximately 0.4-0.6 W and the I/O plus analog blocks add another 0.2 W, totaling 0.6-0.8 W. Use a switching regulator with at least 1 A capability on each of the 1.2 V core and 1.8 V DDR rails, plus a low-noise LDO for the 3.3 V analog supply. Place at least 20 x 100 nF X7R 0402/0201 ceramic capacitors under the BGA footprint plus 4 x 10 uF bulk ceramics within 5 mm of the package.
Do not skip the boot-mode fuse programming - the MCIMX255AVM4 boot configuration (NAND vs NOR vs SD vs serial boot, bus width, and ECC mode) is latched on POR. Wrong fuse values result in a silent non-boot that looks like a hardware fault. Use NXP's manufacturing tool (MFGTool) via USB OTG for first-time programming, and always verify DDR2 timing parameters using the i.MX25 stress-test tool before final firmware deployment.
The MCIMX255AVM4's 400-LFBGA has a theta_JA in the 25-30 C/W range depending on PCB copper area. At 0.8 W worst-case dissipation, junction temperature rise is approximately 20-24 C above ambient, so even in sealed automotive enclosures the part stays well below its 125 C junction limit. For high-temperature under-hood deployments (>70 C ambient), however, increase top-side BGA copper pour and add thermal vias directly into the ball grid.
合規資訊
AEC-Q100 qualified per NXP automotive grade 'V' suffix. RoHS and REACH compliant per NXP product declaration. 15-year longevity commitment for automotive supply continuity.
