MCIMX6G3DVK05AA - i.MX6UL 528MHz A7 MPU, 272-MAPBGA | NXP
MPN： MCIMX6G3DVK05AA ⚠ 最後購買機會MCIMX6G3DVK05AA 概覽
What is an application processor? An application processor is a system-on-chip (SoC) microprocessor that integrates one or more CPU cores, a memory controller, peripheral interfaces (Ethernet, USB, CAN, UART, SPI, I2C, I2S, display/LCD, and ADC), and security blocks in a single device. Within the embedded taxonomy, an application processor sits above a microcontroller (MCU) in capability - delivering higher compute, MMU-based Linux support, and richer peripherals - while remaining below a multicore communications SoC. The i.MX6UL belongs to NXP's i.MX family of ARM-based application processors, positioned between the lower-power Cortex-M based crossover MCUs and the higher-end i.MX 6/7/8 Cortex-A series.
Key features of the MCIMX6G3DVK05AA include a Cortex-A7 core with Neon media engine and FPU, integrated L1 cache, support for DDR3/LPDDR2 memory, an LCD controller, dual 10/100 Ethernet MACs with IEEE 1588 support, two USB 2.0 controllers with PHY, up to two CAN-FD interfaces, secure boot with HABv4, and advanced power management with multiple low-power modes. The 272-MAPBGA package integrates the entire processor plus its supply rails, allowing compact four-layer PCB designs.
Architecturally, the i.MX6UL combines a Cortex-A7 cluster running Linux with an Arm Cortex-M4 coprocessor-style domain (select SKUs), a 2D graphics engine (PXP), and dedicated hardware acceleration blocks for encryption and secure boot. The 528 MHz operation yields deterministic interrupt latency under 100 ns in real-time extensions, while typical active power stays under 500 mW at full load with all peripherals enabled.
Typical applications include industrial HMI terminals, smart energy and metering gateways, building automation controllers, IoT edge nodes, point-of-sale terminals, and connected medical devices. The wide peripheral set (dual Ethernet, CAN-FD, USB, LCD) plus Linux/RTOS support makes it a strong fit for protocols like MQTT, OPC-UA, and BACnet.
When designing with this part, pay close attention to PCB stack-up, decoupling, and DDR3/LPDDR2 routing; matched-impedance memory traces and a 4-layer board with continuous ground are recommended for signal integrity at 528 MHz. For designs requiring hardware cryptography, configure the HAB and SNVS blocks early in your Bring-Up sequence per the i.MX6UL reference manual.
This page synthesizes NXP datasheet values, distributor pricing, drop-in same-brand alternatives, and PCB-level design guidance not duplicated on a standard product page.
直接替換替代品，適用於 MCIMX6G3DVK05AA — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCIMX6G3DVK05AA （相同外形與佔位） — 差異在於 Package, Core Architecture, Mounting Type, L2 Cache, MSL Level.
MCIMX6G3DVM05AA
✅ 直接替換聯絡詢價
查看資料表 →MCIMX6G3CVK05AA
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX6G3DVK05AB
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX6G2DVK05AA
✅ 直接替換聯絡詢價
查看資料表 →MCIMX6G3DVK05AA-R
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX6G3DVK05AA 最大額定值與電氣特性
| Core Architecture | ARM Cortex-A7 (32-bit) |
| Core Count | 1 |
| Maximum CPU Clock | 528 MHz |
| Operating Voltage | 1.8 V / 2.8 V / 3.3 V |
| 封裝 | 272-MAPBGA (9 mm x 9 mm), LFBGA-style |
| 安裝類型 | Surface Mount |
| Memory Support | DDR3, LPDDR2 (per i.MX6UL RM) |
| Ethernet | 2x 10/100 MAC with IEEE 1588 |
| USB | 2x USB 2.0 with integrated PHY |
| CAN | Up to 2x CAN-FD |
| Display Controller | Integrated LCD |
| Graphics Engine | PXP (2D) |
| RoHS 狀態 | Compliant (per NXP product page) |
| Lead-Free | Yes |
MCIMX6G3DVK05AA 272-mapbga (9 mm x 9 mm), lfbga-style 腳位配置指南
MCIMX6G3DVK05AA（272-mapbga (9 mm x 9 mm), lfbga-style 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MCIMX6G3DVK05AA.
請參閱 資料表 以查看完整腳位配置。
典型應用
MCIMX6G3DVK05AA 適用於 6 應用s: Industrial HMI Terminal, Smart Energy Gateway, IoT Edge Sensor Node, Building Automation Controller, Connected Medical Device, Point-of-Sale Terminal.
Industrial HMI Terminal
Provides a 528 MHz Cortex-A7 compute core with integrated LCD controller for industrial human-machine interface terminals. The MCIMX6G3DVK05AA's integrated PXP 2D engine accelerates image rotation, blending, and overlay tasks common to control panel screens up to WXGA; the dual CAN-FD ports directly interface with PLC backplanes, while the LCD controller drives LVDS TFT displays without external bridge chips. Estimated: at 1.8 V core / 2.8 V I/O it draws roughly 0.5 W in active mode, allowing fanless sealed enclosure designs in factory automation environments.
推薦
Smart Energy Gateway
Acts as the core of a smart-meter concentrator, leveraging two 10/100 Ethernet MACs with IEEE 1588 hardware time-stamping to synchronize DLMS/COSEM traffic across the grid. The integrated A7 core runs Linux and OpenWRT networking stacks, while the dual USB ports provide Wi-Fi/Bluetooth expansion for last-mile connectivity. Estimated: with both Ethernet MACs active and one USB port streaming M-Bus data, the i.MX6UL draws approximately 0.7 W - low enough for fanless DIN-rail mounting. The HABv4 secure boot protects cryptographic keys for utility-grade metering.
推薦
IoT Edge Sensor Node
Combines a Cortex-A7 with on-chip peripherals to aggregate sensor data at the edge of industrial IoT networks. The MCIMX6G3DVK05AA's two ADC channels and 8 UART ports connect directly to Modbus RTU sensors; the LCD controller drives local status displays; and the integrated Ethernet MAC uplinks to MQTT/SCADA hosts. Powered by 1.8 V/2.8 V/3.3 V rails, the platform supports deep-sleep modes under 1 mW for battery-powered wireless gateway use cases. NXP's Yocto BSP integrates with EdgeX Foundry and AWS IoT Greengrass natively.
推薦
Building Automation Controller
Drives BACnet/IP or KNX-based building controllers with deterministic response to sensor inputs. The integrated dual Ethernet MACs support redundant ring topologies common in building automation, while LCD output drives room-side touchscreens. DDR3/LPDDR2 memory support gives controller firmware enough headroom for complex scheduling and energy-optimization routines. Compared with a microcontroller-based solution the i.MX6UL delivers Linux-grade tooling - allowing seamless containerized deployment via Docker or BalenaCloud across multi-tenant building installations.
推薦
Connected Medical Device
Provides a regulated computing core for connected medical peripherals where determinism and Linux-grade connectivity matter. The integrated Cortex-A7 with Neon handles audio codecs and displays local ECG waveforms on LCD panels; dual Ethernet MACs enable redundant hospital network connections for HL7 data exchange. The secure-boot HABv4 block enforces tamper-detecting firmware verification suited to FDA 21 CFR Part 11 documentation. With industrial temperature qualification per the i.MX6UL datasheet, the device is suitable for clinical-room and portable-cart form factors.
推薦
Point-of-Sale Terminal
Runs Linux-based POS stacks including the integrated LCD controller for cashier-facing displays, plus Ethernet and dual USB peripherals for printers, NFC readers, and barcode scanners. The integrated PXP accelerator overlays images, two-line barcodes, or QR codes onto the display in real time without burdening the A7 core. Secure boot enforces signed firmware load - critical for PCI PTS compliance - and the low-pin-count (compared to higher-end i.MX) BOM reduces POS terminal bill of materials while retaining industrial reliability.
推薦
推薦產品摘要
工程參考資料，適用於 MCIMX6G3DVK05AA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCIMX6G3DVM05AA | MCIMX6G3CVK05AA | MCIMX6G3DVK05AB | MCIMX6G2DVK05AA | MCIMX6G3DVK05AA-R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 272-MAPBGA (9x9) | 272-MAPBGA (9x9) - same | 272-MAPBGA (9x9) - same | 272-MAPBGA (9x9) - same | 272-MAPBGA (9x9) - same | 272-MAPBGA (9x9) - same |
| CPU Core | ARM Cortex-A7 32-bit | ARM Cortex-A7 32-bit | ARM Cortex-A7 32-bit | ARM Cortex-A7 32-bit | ARM Cortex-A7 32-bit | ARM Cortex-A7 32-bit |
| Max CPU Clock | 528 MHz | 528 MHz | 528 MHz | 528 MHz | 528 MHz | 528 MHz |
| Ethernet MACs | 2x 10/100 + IEEE 1588 | 2x 10/100 + IEEE 1588 | 2x 10/100 + IEEE 1588 | 2x 10/100 + IEEE 1588 | 2x 10/100 + IEEE 1588 | 2x 10/100 + IEEE 1588 |
| USB Ports | 2x USB 2.0 | 2x USB 2.0 | 2x USB 2.0 | 2x USB 2.0 | 2x USB 2.0 | 2x USB 2.0 |
| Speed/Option Grade | D / K05 | D / M05 | C / K05 | D / K05 (B revision) | G2 / K05 | D / K05 (reel pack) |
主要差異化特點
- Last-time-buy lifecycle status with active alternate SKUs (對比MCIMX6G3CVK05AA)
- Integrated dual Ethernet MACs with IEEE 1588 (對比MCIMX6G2DVK05AA)
- A7 with Neon + FPU at sub-watt power (對比MCIMX6G3DVM05AA)
設計說明
The 272-MAPBGA BGA on a 0.5 mm pitch requires a 4-layer stack-up with continuous ground pour under the device and a dedicated core supply island per NXP SABRE design guidelines. Use microvia-in-pad with ENIG plating when designing for industrial-grade reliability; keep vias-in-pad filled and capped to avoid solder wicking during reflow. Estimated: a 0.8 mm-to-1.6 mm pitch escape requires 0.2 mm laser vias under the BGA - costlier than the 1.6 mm dog-bone escape but essential for 528 MHz DDR3 operation.
Power sequencing must follow the i.MX6UL datasheet - drive NVCC, NVCC_*, and DCDC rails before the 1.8 V core rail, and ensure reset (POR_B) is held until all rails are within spec. Use NXP's PMIC PF0200 or PF3000 family for a turn-key design; otherwise a discrete TPS family LDO ladder is acceptable for prototypes. Estimated: total active current at 528 MHz with all peripherals enabled is approximately 600 mA across all rails - allocate at least 4 W headroom in the thermal budget.
Do not bypass boot-mode configuration: the BOOT_MODE[1:0] and BT_CFG signals select between SD/eMMC/SPI/NAND boot sources and must be set via resistors before POR_B release. Boot failures at first power-up are most commonly caused by misconfigured boot pins rather than silicon defects. For secure-boot designs fuse the HAB keys early in bring-up - re-fusing once locked requires a full device reset through NXP.
Provide a continuous copper thermal pad beneath the 272-MAPBGA bottom balls for proper heat extraction. The BGA's solder-ball thermal conduction path is sufficient for industrial workloads under 1 W sustained, but enclosure-limited designs at constant 528 MHz should adopt a 4-layer board with 1 oz copper ground pour and thermal vias on a 1 mm grid to keep junction temperatures below 85 C ambient.
合規資訊
RoHS-compliant per NXP product page; AEC-Q100 not applicable (standard industrial/consumer grade). Reach and halogen-free status not explicitly listed in the verified web data and should be confirmed with the manufacturer for new designs.
