MIMX8QM5CVUFFAB - i.MX 8QuadMax 8-Core SoC | NXP | 1313-BGA
MPN： MIMX8QM5CVUFFAB ✓ 啟用中MIMX8QM5CVUFFAB 概覽
An SoC (System on Chip) consolidates CPU, GPU, memory interfaces, and peripheral controllers into a single integrated circuit, forming the complete computing heart of an embedded system. The i.MX 8QuadMax sits at the top of the NXP i.MX 8 family (alongside 8QuadPlus and 8DualMax), targeting high-performance automotive, industrial, and consumer platforms that need advanced graphics, vision processing, and deterministic real-time control in one device.
Key features include full-chip hardware virtualization with domain protection for secure multi-OS operation, independent graphics across four HD displays or one 4K screen, an integrated vision pipeline for ADAS-class perception, and an audio subsystem optimized for voice and speech recognition. The dual Cortex-A72 cores handle heavy application workloads, the quad Cortex-A53 cores provide power-efficient scaling, and the dual Cortex-M4F cores run real-time, safety-relevant tasks - a heterogeneous balance of throughput and efficiency.
The architecture supports Android, Linux, FreeRTOS, QNX, Green Hills, and Dornerworks XEN operating systems, and the family offers pin- and power-compatible packages for hardware design reuse. Typical applications include automotive digital cockpits, infotainment, ADAS vision systems, industrial HMI panels, and medical imaging equipment, where rich UI and real-time control must coexist.
Design consideration: the 1313-ball BGA demands a multi-layer PCB with thermal vias and strict power sequencing; the MSL 3 rating (168-hour floor life) requires controlled moisture handling before reflow.
直接替換替代品，適用於 MIMX8QM5CVUFFAB — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
MIMX8QM5AVUFFAB
✅ 直接替換📋 參考替代品（不在目錄中）
MIMX8QM6CVUFFAB
✅ 直接替換📋 參考替代品（不在目錄中）
MIMX8QM5CVUFFABR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MIMX8DM5CVUFFAB
⚡ 相同封裝 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MIMX8QM5DVUFFAB
⚡ 相同封裝 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MIMX8QM5CVUFFAB 最大額定值與電氣特性
| Core Architecture | 2x Arm Cortex-A72 + 4x Arm Cortex-A53 + 2x Arm Cortex-M4F |
| Total Cores | 8 |
| Product Family | i.MX 8QuadMax |
| Package Type | 1313-FBGA |
| Package Dimensions | 29 x 29 mm |
| Terminal Form | Ball (BGA) |
| Terminal Count | 1313 |
| 安裝類型 | Surface Mount |
| Temperature Grade | Automotive |
| Display Support | 4x independent HD screens or 1x 4K screen |
| Virtualization | Full-chip hardware virtualization and domain protection |
| Supported OS | Android, Linux, FreeRTOS, QNX, Green Hills, Dornerworks XEN |
| MSL Rating | MSL 3 - 168 hours |
| Packaging | Tray |
| 生命週期狀態 | Active |
MIMX8QM5CVUFFAB 29 x 29 mm 腳位配置指南
MIMX8QM5CVUFFAB（29 x 29 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MIMX8QM5CVUFFAB.
請參閱 資料表 以查看完整腳位配置。
典型應用
MIMX8QM5CVUFFAB 適用於 6 應用s: Automotive Digital Cockpit, ADAS Vision Processing, Industrial HMI Terminals, Medical Imaging Equipment, Voice-Enabled Smart Devices, In-Vehicle Networking Gateways.
Automotive Digital Cockpit
The MIMX8QM5CVUFFAB drives up to four independent HD displays or one 4K screen with hardware-accelerated graphics, matching the multi-screen requirements of modern digital cockpits. Its automotive temperature grade and full-chip virtualization allow instrument cluster, infotainment, and HUD domains to run on isolated OS instances on one SoC. The dual Cortex-M4F cores absorb real-time cluster tasks while the Cortex-A72 cluster renders rich UI, removing a separate cluster processor from the bill of materials.
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ADAS Vision Processing
The integrated vision pipeline of the i.MX 8QuadMax processes camera streams for surround-view and driver-monitoring functions. The dual Cortex-A72 cores execute perception algorithms while Cortex-M4F cores handle time-critical sensor fusion with deterministic latency. Because the SoC combines ISP-class input, GPU-accelerated inference support, and automotive temperature grading, it consolidates vision processing that would otherwise need a discrete vision accelerator, simplifying the camera-to-display latency chain in ADAS domains.
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Industrial HMI Terminals
Industrial human-machine interface panels benefit from the SoC's multi-display graphics, responsive Android/Linux stacks, and dual Cortex-M4F cores for deterministic PLC-adjacent control loops. The four Cortex-A53 cores sustain multi-application UI workloads at lower dynamic power than A72-only designs, reducing heatsinking in sealed panel enclosures. Hardware domain protection allows a vendor HMI application and a customer's runtime to coexist securely, and the long-lifecycle i.MX family suits multi-year industrial deployments.
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Medical Imaging Equipment
Ultrasound and point-of-care imaging consoles use the MIMX8QM5CVUFFAB for 4K display output, GPU-accelerated rendering of scan data, and a responsive touch UI under Linux or QNX. The dual Cortex-M4F cores manage probe interface timing and motor control with real-time determinism, while hardware virtualization separates clinical application software from connectivity stacks. Its heterogeneous performance-per-watt profile reduces fan noise and enclosure size in bedside and portable imaging form factors.
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Voice-Enabled Smart Devices
The i.MX 8QuadMax audio processing subsystem is optimized for voice and speech recognition, supporting far-field microphone arrays and on-device wake-word processing. Running Android or Linux on the A72/A53 clusters with recognition workloads accelerated by the SoC's DSP-class resources, designers avoid cloud round-trips for latency-critical interactions. The dual M4F cores continuously sample the mic array at low power, keeping the system responsive between wake events in smart speakers, kiosks, and conference systems.
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In-Vehicle Networking Gateways
As a gateway processor, the SoC aggregates CAN-FD, Ethernet, and LIN traffic while running security stacks and OTA update managers under QNX or Linux. Its virtualization isolates the safety-critical network forwarding domain from open application domains, and the M4F cores service low-latency CAN interrupt handling independently of the application OS. Combined with NXP transceivers, the part anchors zonal gateway designs for next-generation vehicle E/E architectures.
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推薦產品摘要
工程參考資料，適用於 MIMX8QM5CVUFFAB — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MIMX8QM5AVUFFAB | MIMX8QM6CVUFFAB | MIMX8DM5CVUFFAB | MIMX8QM5DVUFFAB |
|---|---|---|---|---|---|
| Package | 1313-FBGA (29x29 mm) | 1313-FBGA (29x29 mm) - same | 1313-FBGA (29x29 mm) - same | 1313-FBGA (29x29 mm) - same | 1313-FBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Cores | 2x A72 + 4x A53 + 2x M4F | 2x A72 + 4x A53 + 2x M4F | 2x A72 + 4x A53 + 2x M4F | 8DualMax - reduced core count | 2x A72 + 4x A53 + 2x M4F |
| Temperature Grade | Automotive | Automotive | Automotive | Automotive | Automotive |
| Hardware Virtualization | Yes, full-chip with domain protection | Yes | Yes | Yes | Yes |
主要差異化特點
- Highest performance grade in the pin-compatible family (對比MIMX8QM5AVUFFAB)
- Eight heterogeneous cores vs reduced-core variants (對比MIMX8DM5CVUFFAB)
- Automotive temperature grade with hardware virtualization (對比Consumer application processors (cross-brand))
設計說明
The 29x29 mm, 1313-ball FBGA concentrates high dynamic power from the Cortex-A72 cluster. Provide a dense array of thermal vias (0.3 mm drill, ~1 mm pitch) under the package center connecting to internal copper planes and an external heatsink surface. Estimate junction temperature with the IMX8DQMAX datasheet thermal metrics for your specific airflow condition before finalizing enclosure design.
A 1313-ball BGA at 29x29 mm demands at least 8-10 PCB layers with dedicated DDR routing layers, microvia-in-pad structures, and reference planes for signal integrity. Follow the NXP i.MX 8QuadMax hardware design guide for LPDDR trace length matching and ballmap escape routing. Plan the stackup before layout begins - retrofitting layers later is not feasible.
The i.MX 8QuadMax requires strict power rail sequencing across core, SOC, DDR, and I/O domains. Use a dedicated PMIC with sequencing outputs and monitor PGOOD signals. Decouple each major rail per the datasheet decoupling table, placing bulk capacitance near the balls and high-frequency ceramics within 2 mm. Verify rail-up order in hardware before first OS boot to avoid latch-up.
MSL 3 (168-hour floor life) means boards must be reflowed within 168 hours of the moisture barrier bag being opened, or the parts must be baked per J-STD handling practice. Many first-article failures on large automotive BGAs trace to moisture-induced delamination during reflow. Track exposure time and log bake cycles in production.
合規資訊
RoHS and lead-free status inferred from current NXP automotive product line; confirm exact Environmental Quality data on the NXP product page. Temperature grade is automotive per distributor data; formal AEC-Q100 qualification level is [DATA_NEEDED: AEC-Q100 level].
