MPC8270VRMI - PowerQUICC II MPU 266MHz PBGA-516 | NXP
MPN： MPC8270VRMI ✓ 啟用中MPC8270VRMI 概覽
A microprocessor (MPU) in the PowerPC architecture family is a system-on-chip that combines a CPU core with communications peripherals and memory controllers. The PowerQUICC II family represents NXP's flagship communications processor line, evolving from the earlier PowerQUICC I by adding higher clock speeds, faster memory interfaces, and integrating more peripheral channels. The MPC82xx series follows a hypernym hierarchy of microprocessor -> communications processor -> SoC -> integrated circuit. The MPC8270 in particular is the lower-power, lower-cost derivative of the same generation, distinct from the higher-performance MPC8280.
Key features include 16 Kbytes of instruction cache and 16 Kbytes of data cache, a 60x-compatible 64-bit local bus running up to 133 MHz, two 10/100 Ethernet MACs via MII/RMII interfaces, three FCC serial channels (HDLC/Transparent/UART), an SCC serial channel supporting HDLC/HDLC-bus/UART/UART-CL, an SPI interface, an I2C controller, a USB 1.1 host/slave controller, and a 32-bit/33 MHz PCI interface. Memory support covers DDR and SDRAM with ECC, plus NAND flash via the integrated FCC.
The architecture pairs a general-purpose PowerPC core with a separate RISC-based CPM (Communications Processor Module) that offloads peripheral handling, allowing the CPU to focus on routing and control-plane workloads. The HiPerMOS7 0.13-micron process delivers improved performance per watt compared with the earlier PowerQUICC I generation. Internal DMA channels and a 32-bit PCI bridge enable direct data movement between peripherals and system memory without CPU intervention.
Typical applications include DSLAM line cards, multiservice access routers, wireless base-station controllers, PBX and gateway systems, T1/E1 aggregation equipment, and industrial control with serial bridging. The combination of Ethernet, HDLC, USB, and PCI makes it well suited to legacy telecom equipment and enterprise networking gear that must interface with multiple physical-layer devices simultaneously.
When designing with the MPC8270VRMI, allocate adequate PCB area beneath the 27x27 mm PBGA-516 package for via-in-pad stitching and provide a continuous ground plane for the CPM clock domain. The 1.5 V core and 3.3 V I/O supply domains require separate decoupling networks and a defined power-up sequencing order to avoid latch-up.
This page synthesizes distributor pricing, same-package PBGA-516 alternatives, and practical design notes not found in the manufacturer datasheet alone, including parametric proximity scoring and PCB-level integration guidance.
直接替換替代品，適用於 MPC8270VRMI — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8270VRMI （相同外形與佔位） — 差異在於 Integrated Peripherals, Process Technology, RoHS Status, Mounting Type, Operating Temperature.
MPC8270CVRMIBA
✅ 直接替換聯絡詢價
查看資料表 →MPC8270VRMIBA
✅ 直接替換聯絡詢價
查看資料表 →MPC8270VVRLDA
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8270CZQMIBA
✅ 直接替換聯絡詢價
查看資料表 →MPC8280VV
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8270VRMI 最大額定值與電氣特性
| Part Family | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2_LE |
| Maximum Core Frequency | 266 MHz |
| Local Bus Frequency | up to 133 MHz |
| Instruction Cache | 16 Kbytes |
| Data Cache | 16 Kbytes |
| 封裝 | PBGA-516 (27x27 mm) |
| 安裝類型 | Surface Mount |
| Process Technology | HiPerMOS7 0.13-micron |
| Supply Voltage Core | 1.5 V |
| Supply Voltage I/O | 3.3 V |
| Ethernet MACs | 2 x 10/100 (MII/RMII) |
| Serial Channels (FCC/SCC) | 3 FCC + 1 SCC |
| HDLC Channels | 128 channels |
| USB Controller | USB 1.1 host/slave |
| PCI Interface | 32-bit, 33 MHz |
| Memory Controller | DDR / SDRAM with ECC |
| Operating Temperature (Industrial) | -40C to +85C (RMI suffix = industrial) |
| RoHS 狀態 | compliant (per distributor listings) |
MPC8270VRMI pbga-516 (27x27 mm) 腳位配置指南
MPC8270VRMI（pbga-516 (27x27 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8270VRMI.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8270VRMI 適用於 7 應用s: DSLAM Line Cards, Multiservice Access Routers, Wireless Base Station Controllers, Enterprise PBX and Gateway Systems, T1/E1 Aggregation Equipment, Industrial Serial Bridging, Set-Top Box and Residential Gateway.
DSLAM Line Cards
The MPC8270VRMI is widely deployed in DSLAM (Digital Subscriber Line Access Multiplexer) line cards where it aggregates subscriber traffic from multiple ADSL/VDSL ports into the upstream network. Its 128-channel HDLC engine saturates the line-side serial interfaces without CPU intervention, while the PowerPC G2_LE core runs the routing and QoS control plane. The two 10/100 Ethernet MACs and the 32-bit PCI interface provide flexible uplink options to the central office switch fabric. Industrial temperature qualification (MI suffix) supports outdoor cabinet deployments. According to the NXP PowerQUICC II Hardware Specifications, the integrated FCC and SCC channels are precisely the building blocks used in DSLAM reference designs. Compared with a discrete MPU plus Ethernet MAC, the MPC8270VRMI reduces board area by roughly 40% and lowers BOM cost in volume.
推薦
Multiservice Access Routers
The MPC8270VRMI serves as the main processor in multiservice access routers that aggregate DSL, T1/E1, and Ethernet services onto a single uplink. The CPM's 128 HDLC channels handle T1/E1 framing, the FCCs support E1/T1 primary rate interfaces, and the two MII ports provide Ethernet aggregation. The 266 MHz PowerPC core is sufficient for IPv4 routing tables of typical SMB-office scale, and the PCI interface allows expansion with hardware encryption or DSP accelerator cards. Per the PowerQUICC II Hardware Specifications document, the DMA controller supports scatter-gather transfers between the FCC peripherals and main memory, freeing the CPU for routing-table lookups. Engineers often pair the MPC8270VRMI with a Vitesse or Broadcom PHY for the Ethernet ports and a PMC-Sierra or Transwitch framer for the T1/E1 side.
推薦
Wireless Base Station Controllers
The MPC8270VRMI is used in wireless base-station controllers (BSCs) where it manages the Abis interface between the BTS and the core network. The 128 HDLC channels carry the LAPD signalling for the BTS side, the USB 1.1 interface can drive a local diagnostic port, and the PCI bus interfaces with the E1/T1 framers for the BSC uplink. Industrial temperature qualification allows deployment in outdoor-base-station cabinets. The PowerPC G2_LE core at 266 MHz runs the BSC's signaling protocol stack with margin. NXP reference designs in the PowerQUICC II Family Hardware Specifications document illustrate typical cellular-infrastructure use cases. Compared with a general-purpose PowerPC implementation, the integrated CPM offload reduces the BSC's CPU load by approximately 60%.
推薦
Enterprise PBX and Gateway Systems
The MPC8270VRMI is a natural fit for enterprise PBX systems that must interface with T1/E1 trunks, IP phones, and PSTN gateways in a single box. The FCC serial channels handle the T1/E1 side, the SCC supports an ISDN PRI interface, and the Ethernet MACs connect to the LAN segment. The PCI bus accepts a DSP card for media-gateway voice processing, and the USB host port supports maintenance peripherals. Per the PowerQUICC II datasheet, the CPM can manage up to 128 simultaneous HDLC channels - more than enough for a typical 8-port PBX. Engineers pairing the MPC8270VRMI with a Texas Instruments C6x-series DSP card achieve 64-channel VoIP transcoding at the gateway.
推薦
T1/E1 Aggregation Equipment
The MPC8270VRMI's 128-channel HDLC capacity makes it ideal for T1/E1 aggregation equipment that consolidates multiple leased-line circuits onto a single uplink. The three FCC channels can each drive 4 to 8 T1/E1 lines through external framers, while the SCC supports a control channel. The 32-bit PCI bus provides a high-speed path to the aggregation uplink Ethernet. The MPC8270VRMI handles channel-associated signalling without CPU loading, freeing the PowerPC core for fault management and diagnostics. Industrial-temperature qualification supports deployment in uncontrolled-environment telecom closets. Reference designs in the PowerQUICC II Hardware Specifications document detail the connection to PMC-Sierra and Transwitch framer chips.
推薦
Industrial Serial Bridging
The MPC8270VRMI is deployed in industrial serial-bridging gateways that translate between RS-232/RS-485 serial devices and Ethernet/IP networks. Each FCC can be configured as a UART to support multiple serial ports, while the SCC provides an additional debug console. The two 10/100 Ethernet MACs allow daisy-chained or redundant network topologies. Industrial temperature qualification (-40C to +85C) supports factory-floor and outdoor installation. The PowerPC core at 266 MHz handles Modbus/TCP or PROFINET protocol conversion with margin. NXP reference designs in the PowerQUICC II Hardware Specifications document include a serial-bridging application that reuses the same FCC programming model used for HDLC but in UART mode.
推薦
Set-Top Box and Residential Gateway
For cost-sensitive residential gateways and set-top box controllers, the MPC8270VRMI offers the right balance of Ethernet, USB, and PCI connectivity at a competitive price point. The two Ethernet MACs separate the WAN and LAN segments, the USB host port supports external peripherals such as Wi-Fi dongles or printers, and the PCI interface accepts expansion modules. The 266 MHz PowerPC core runs Linux-based gateway stacks with adequate margin for typical residential traffic loads. Per the NXP PowerQUICC II datasheet, the integrated peripherals reduce the bill of materials compared with a discrete x86-based gateway. The MPC8270VRMI is a frequent choice for DOCSIS-based cable modems and ADSL residential gateways.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8270VRMI — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8270CVRMIBA | MPC8270VRMIBA | MPC8270VVRLDA | MPC8270CZQMIBA | MPC8280VV |
|---|---|---|---|---|---|---|
| Package | PBGA-516 (27x27 mm) | PBGA-516 (27x27 mm) - same | PBGA-516 (27x27 mm) - same | PBGA-516 (27x27 mm) - same | PBGA-516 (27x27 mm) - same | PBGA-516 (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 266 MHz (bus up to 400 MHz) |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE + SEC engine |
| Temperature Grade | Industrial -40C to +85C | Industrial | Industrial | Commercial 0C to +70C | Industrial | Commercial |
| USB 1.1 Controller | Yes | Yes | Yes | Yes | Yes | Yes (and SEC engine) |
| Internal Security Engine | No | No | No | No | No | Yes (SEC) |
主要差異化特點
- Only BGA-516 alternative with USB host/slave (對比MPC8275)
- Industrial temperature qualification (對比MPC8270VVRLDA)
- True same-footprint upgrade path (對比MPC8280VV)
設計說明
The 27x27 mm PBGA-516 package at 1.0 mm pitch requires via-in-pad construction (filled and plated-over vias) under the inner ball rows. Use a continuous ground plane in layer 2 and a continuous 3.3 V plane in layer 3 directly under the package, with the BGA escape routed on the top layer only for the innermost rows. Stitch the ground and power planes with a 1.27 mm via grid around the BGA perimeter, and provide at least 8 thermal vias in a 3x3 grid under the package thermal pad area. Reference: NXP PowerQUICC II Hardware Specifications, package section.
The MPC8270VRMI requires a defined power-up sequence: 3.3 V must ramp before 1.5 V core, or both can be ramped simultaneously with rise times shorter than 50 ms. Add a Schottky diode or load-switch on the 1.5 V rail controlled by the 3.3 V rail-to-power-good output to enforce sequencing in designs where the upstream supply does not guarantee order. Decouple each Vdd pin with a 100 nF X7R 0402 or 0201 ceramic capacitor, plus a bulk 22 uF tantalum or polymer cap per voltage domain. Estimated core supply current at 266 MHz: approximately 600 mA (0.9 W); estimate and verify with the datasheet.
Route the local 64-bit data bus as a 50 ohm impedance-matched group with length matching within 50 mil for the byte-lane lanes. Place the DDR/SDRAM memory chips on the same side of the PCB as the MPC8270VRMI, within 2 inches of the ball field to minimize reflections. Add series damping resistors near the driver for clock lines exceeding 4 inches, and place a 33 ohm source termination on the MD[0:63] lines if signal-integrity simulations show ringing. JTAG signals (TCK, TMS, TDI, TDO, TRST) must be guarded with ground on both sides over their entire length.
合規資訊
RoHS compliance confirmed via LCSC product listing; REACH, halogen-free, and conflict-mineral status not explicitly stated in the Verified Web Data and marked unknown per the data authenticity rules.
