MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPN： MPC8360EVVAGDGA ⚠ 最後購買機會MPC8360EVVAGDGA 概覽
A communications SoC (System-on-Chip) is an integrated circuit that combines a microprocessor core, on-chip peripherals, memory controllers, and protocol-specific hardware accelerators (such as security engines and Ethernet MACs) onto a single silicon die, reducing board area and BOM cost compared to a discrete MPU plus external bridges. The MPC8360E PowerQUICC II Pro family is a next-generation extension of the PowerQUICC II line targeting routers, DSLAMs, media gateways, and industrial control platforms where one chip must terminate multiple telecom/ datacom protocols simultaneously.
Key features include the e300 core running at 400 MHz, integrated DDR1/DDR2 SDRAM controller with ECC, 32-bit PCI 2.2 interface, 32-bit/36-bit SEC (security engine) for IPSec/SSL offload, one tri-speed 10/100/1000 Mb/s Ethernet MAC, USB 2.0 host/device, TDM/H.110 interface, ATM SAR support, and a local bus controller. Operating voltage is 1.2 V core with 3.3 V I/O. The 0 to 105C ambient operating range suits commercial and industrial environments.
The MPC8360EVVAGDGA architecture separates the e300 core from the CPM (Communication Processor Module) co-processor that handles DMA and protocol termination in hardware, offloading packet processing from the main CPU. This dual-engine structure lets one chip sustain line-rate encryption (SEC) plus GbE bridging without saturating the core, which is the key reason PowerQUICC II Pro devices remain in service in long-life networking and industrial platforms.
Typical applications include SOHO routers, xDSL line cards, integrated access devices, media gateways, industrial control routers, and secure appliance controllers. Compared to MPC8358E devices the MPC8360E adds PCI-X and additional USB PHYs; compared to MPC8360EZU variants the EVVAGDGA retains all features with the specific 740-TBGA (37.5x37.5 mm) outline specified for this order code.
When designing with this part, allocate adequate PCB footprint for the 37.5x37.5 mm TBGA, keep DDR traces length-matched within the controller's published skew budget, and review the Rev 2.x hardware specification document for JTAG, reset, and PLL filtering guidance.
This page synthesizes distributor stock data, same-package MPC8360 variants, and practical hardware design notes not aggregated in any single manufacturer PDF.
直接替換替代品，適用於 MPC8360EVVAGDGA — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8360EVVAGDGA （相同外形與佔位） — 差異在於 Ethernet, PCI Interface, Series, USB, Mounting Type.
MPC8360EZUAGDGA
✅ 直接替換聯絡詢價
查看資料表 →MPC8360EVVAGDG
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8360EZUAGDG
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8360VVAGDGA
✅ 直接替換聯絡詢價
查看資料表 →MPC8360ZUAJDGA
✅ 直接替換聯絡詢價
查看資料表 →MPC8360EVVAGDGA 最大額定值與電氣特性
| Core | Power Architecture e300 (enhanced MPC603e) |
| Number of Cores | 1 |
| 資料匯流排寬度 | 32-bit |
| 最大時脈頻率 | 400 MHz |
| Operating Core Voltage | 1.2 V |
| I/O Voltage | 3.3 V |
| Memory Controller | DDR1/DDR2 SDRAM with ECC |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| Security Engine | SEC (IPSEC/SSL/SRNG) |
| USB | USB 2.0 |
| TDM / H.110 | Yes |
| ATM Support | Yes (ATM SAR, AAL) |
| 工作溫度範圍 | 0C to +105C (TA) |
| 封裝 | 740-TBGA (37.5 x 37.5 mm) |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Series | PowerQUICC II Pro (MPC8360E family) |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| 安裝類型 | Surface Mount (TBGA ball grid) |
| Packaging | Tray |
| ECCN | 5A002.a.1 |
MPC8360EVVAGDGA 腳位配置
| 腳位 A1 | VSS — Ground reference (multiple VSS balls, ball ID per BGA map) |
| 腳位 B1 | VDD — Core 1.2 V supply (multiple VDD balls, ball ID per BGA map) |
典型應用
MPC8360EVVAGDGA 適用於 6 應用s: Integrated Access Device / SOHO Router, xDSL Line Card / DSLAM, Secure Industrial Gateway, Media Gateway / VoIP Platform, Network-Attached Storage Controller, Secure Appliance / VPN Concentrator.
Integrated Access Device / SOHO Router
The MPC8360EVVAGDGA fits SOHO and branch-office integrated access devices because it terminates multiple WAN protocols on a single die. The e300 core runs routing and management daemons at 400 MHz while the CPM offloads ATM SAR, TDM, and Ethernet DMA. The integrated SEC engine performs line-rate IPSec/SSL for VPN tunnels, and the DDR1/DDR2 controller feeds packet buffers. A typical board uses one MPC8360EVVAGDGA, a 256 MB DDR2, a small NOR boot flash, and a 4-port Ethernet switch - replacing what would otherwise be a CPU plus three or four bridge ASICs.
推薦
xDSL Line Card / DSLAM
Inside a DSLAM line card the MPC8360EVVAGDGA terminates ATM or PTM traffic from the DSL PHY, performs traffic shaping and policing in the CPM, then hands packets upstream over PCI or GbE. The 400 MHz e300 core has sufficient headroom for QoS queues and OAM processing, while the SEC engine accelerates the IPSec required by remote-management tunnels. The 740-TBGA is footprint-compatible with the broader MPC8360E family, allowing line-card variants (with different feature gating) to share one PCB layout across SKUs.
推薦
Secure Industrial Gateway
For industrial sites that require a hardened gateway between field buses (Modbus, Profibus, CAN) and the enterprise network, the MPC8360EVVAGDGA is attractive because the SEC engine provides hardware VPN, the e300 core runs the SCADA/server stack, and the on-chip Ethernet + TDM simplify dual-network attachment. Industrial-grade mezzanine cards typically expose isolated serial ports to the MPC8360's UARTs and route encrypted traffic over the GbE MAC. The 0 to 105C operating range suits most cabinet environments.
推薦
Media Gateway / VoIP Platform
VoIP and unified-communications media gateways use the MPC8360EVVAGDGA's TDM/H.110 interface to bridge legacy PSTN T1/E1 trunks to IP, while the e300 core runs SIP/RTP stacks. The CPM's multi-channel DMA and ATM SAR offload time-critical DSP packet handling. DDR2 memory supplies buffer space for jitter buffers and voice recordings. A four-port BRI gateway can be built around one MPC8360EVVAGDGA plus quad TDM framer devices on the local bus.
推薦
Network-Attached Storage Controller
Although positioned as a communications SoC, the MPC8360EVVAGDGA is also used in entry-level NAS controllers where the PCI-X bus attaches SATA or RAID HBAs and the e300 core runs the storage stack. DDR2 provides cache memory, the SEC engine handles encrypted-volume offload (CBC-AES), and the GbE MAC serves the network side. Designers favor the part for long-life industrial/embedded NAS appliances where other QorIQ parts are overspec.
推薦
Secure Appliance / VPN Concentrator
Small-form-factor VPN concentrators and secure appliances leverage the MPC8360EVVAGDGA's SEC engine to sustain line-rate AES-256/SHA-1 IPSec tunnels on the GbE port. The e300 core handles IKE key exchange and policy management, while the DDR2 controller supplies the policy and SA-cache tables. Because the SEC offload is hardware, total tunnel count scales with packet size rather than CPU frequency, which is a key advantage over soft-crypto implementations.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8360EVVAGDGA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8360EZUAGDGA | MPC8360EVVAGDG | MPC8360EZUAGDG | MPC8360VVAGDGA | MPC8360ZUAJDGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) |
| Core | e300 @ 400 MHz | e300 @ 400 MHz | e300 @ 400 MHz | e300 @ 400 MHz | e300 @ 400 MHz | e300 @ 400 MHz |
| Security Engine | SEC (full crypto + RNG) | SEC (full crypto + RNG) | SEC (full crypto + RNG) | SEC (full crypto + RNG) | Reduced / disabled | SEC enabled |
| USB | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 |
| Feature Gating Suffix Code | EVV | EZU | EVV | EZU | VV | ZUAJ |
| Lead Free / RoHS | Lead Free (NO-PB) | Lead Free | Lead Free | Lead Free | Lead Free | Lead Free |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C (junction grade) |
主要差異化特點
- Full SEC crypto engine with RNG/SRNG and IPSec/SSL offload (對比MPC8360VVAGDGA)
- Wider feature gating with USB 2.0, PCI-X, ATM SAR, and 1 GbE all enabled (對比MPC8358E)
- Same 740-TBGA outline enabling layout reuse across the entire family (對比QorIQ MPC8536E (TeMAP/TBGA package, different outline))
設計說明
The 740-TBGA at 37.5 x 37.5 mm requires a 6-layer (or 8-layer) PCB with dedicated ground and power planes under the BGA field. Match DDR traces to within the controller's published skew budget (typically +/- 25 ps), keep reference-plane transitions to a minimum, and place VTT termination dividers within 100 ps of the byte lane. The lead-free (NO-PB) ball finish requires SAC305 or equivalent lead-free reflow profiles (peak 245-260C).
The e300 core at 400 MHz draws substantial current on the 1.2 V rail; a multi-phase switching regulator with at least 20 A peak capability is recommended, plus 470 uF bulk + 22 uF ceramic + 100 nF high-frequency bypass per the manufacturer's decap recommendations. The 3.3 V I/O rail must be sequenced to the 1.2 V rail; refer to the hardware specification for the supported power-up order. PLL analog supply requires RC filtering within 10 mm of the AVSS pin.
Estimated: at 1.2 V core and 400 MHz with SEC + GbE + USB active, the part can dissipate 4-6 W. With a TBGA-attached thermal pad (or no thermal pad, depending on bond-revision), junction-to-ambient theta_JA is approximately 12-18 C/W on a 6-layer JEDEC test board; at 0C ambient this leaves considerable headroom, but at 105C ambient the margin shrinks. Provide at least 4 thermal vias-in-pad under the central BGA cluster if the silicon offers a thermal pad in your revision.
Watch for silicon revision notes: Rev 1 silicon has known errata in early USB and ECC masks; the Hardware Specification published for Rev 2.x lists workarounds. Always read the errata for your bonded revision before committing to boot code. Confirm the trailing 'A' in the order code matches the tray packaging; missing 'A' suffix variants exist with different packing quantities.
合規資訊
Lead Free (NO-PB) per Mouser listing. Halogen Free per Globalspec cross-reference aggregator. RoHS compliance claimed at family level; specific certificate [DATA_NEEDED: RoHS document number for MPC8360EVVAGDGA]. Not AEC-Q100 qualified - this is a commercial/industrial communications processor, not automotive-grade.