MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPN： MPC8358EVVAGDGA ✗ 停產MPC8358EVVAGDGA 概覽
A microprocessor (MPU) is a single-chip CPU that integrates the arithmetic logic unit, registers, cache, and bus interfaces onto one die, forming the computational heart of an embedded system. The PowerQUICC II Pro family extends the classic PowerQUICC II architecture with the e300 core (a PowerPC 603e-derived design), a system interface unit (SIU), and a communications processor module (CPM) that offloads networking tasks from the main CPU. This hierarchy places the MPC8358E within the broader class of integrated communications processors used in wired networking and access equipment, and ultimately within the embedded microprocessor segment of the semiconductor taxonomy.
Key features include 400 MHz e300 core, integrated DDR1/DDR2 SDRAM controller with ECC, dual 10/100/1000 Mbps Ethernet MACs, USB 2.0 full-speed device/host, PCI 2.2 interface, two UTOPIA/Packet engines for ATM, TDM support for voice, hardware-accelerated SEC for IPSec and SSL, and integrated PHYs. The device is manufactured in 0.13 µm CMOS and supports JTAG boundary-scan for production test. Power management includes doze, nap, and sleep modes.
The architecture pairs a host e300 CPU with the QUICC Engine communications module, enabling simultaneous wire-speed packet processing and control-plane execution. The integrated SEC block accelerates DES/3DES/AES/SHA algorithms at gigabit rates, allowing VPN and SSL termination without external crypto silicon. The 740-pin TBGA package supports high-speed parallel interfaces while exposing dedicated DDR, PCI, and gigabit Ethernet signal groups for straightforward four-layer PCB layout.
Typical applications include small-to-medium enterprise routers, low-end DSLAM line cards, IP private branch exchange (PBX) systems, industrial gateways, and secured broadband access equipment. The combination of gigabit Ethernet, ATM, and hardware crypto makes the MPC8358E especially suited to integrated access devices and secure VPN gateways operating at wire speed.
When designing with this part, plan thermal headroom for the 740-pin TBGA at sustained 400 MHz operation; provide at least four PCB layers with a continuous ground plane beneath the package, and follow NXP AN-2806 routing guidelines for DDR2 trace matching. Use NXP CodeWarrior Development Studio and the LTIB (Linux Target Image Builder) toolchain to bring up U-Boot and Linux SMP environments.
This page synthesizes distributor pricing, lifecycle status, and drop-in pin-compatible alternatives not consolidated in the manufacturer datasheet, giving engineers and procurement teams a single source for selection and second-sourcing decisions.
直接替換替代品，適用於 MPC8358EVVAGDGA — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8358EVVAGDGA （相同外形與佔位） — 差異在於 USB, Architecture, Ethernet, Lead-Free / RoHS, Mounting Type.
MPC8358EVVAGDGA
✅ 直接替換聯絡詢價
查看資料表 →MPC8360EVVAGDGA
✅ 直接替換聯絡詢價
查看資料表 →MPC8358CVVAGDGA
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8358EVVAGDGA 最大額定值與電氣特性
| Architecture | RISC (PowerPC e300) |
| 資料匯流排寬度 | 32-Bit |
| Core Frequency | 400 MHz |
| Number of Cores | 1 |
| Core Process Technology | 0.13 µm CMOS |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V |
| Package Type | TBGA-740 |
| Package Dimensions | 37.5 x 37.5 mm, 1.46 mm height |
| Ball Pitch | 1.0 mm |
| 腳位數 | 740 |
| 工作溫度 | 0 °C to +105 °C |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM with ECC |
| Ethernet Interfaces | Gigabit (10/100/1000 Mbps) |
| USB | USB 2.0 FS device/host |
| PCI | PCI 2.2 |
| Security Engine | SEC (DES/3DES/AES/SHA) |
| Lead-Free / RoHS | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data |
MPC8358EVVAGDGA 37.5 x 37.5 mm, 1.46 mm height 腳位配置指南
MPC8358EVVAGDGA（37.5 x 37.5 mm, 1.46 mm height 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8358EVVAGDGA.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8358EVVAGDGA 適用於 6 應用s: Small-to-Medium Enterprise Router, DSLAM Line Card Controller, IP-PBX and VoIP Gateway, Industrial Secure Gateway, Wireless LAN / Wi-Fi Access Controller, Secure VPN Concentrator.
Small-to-Medium Enterprise Router
The MPC8358EVVAGDGA targets SME routers with its 400 MHz e300 core, dual Gigabit Ethernet MACs, and hardware-accelerated SEC block that performs IPSec and SSL termination at wire speed. The QUICC Engine offloads TCP/IP, NAT, QoS, and packet filtering from the host CPU, allowing concurrent routing, firewalling, and VPN services without throughput degradation. The integrated DDR1/DDR2 controller with ECC supports the large route and connection tables required by enterprise gateways.
推薦
DSLAM Line Card Controller
In low-end DSLAM line cards, the MPC8358EVVAGDGA aggregates subscriber traffic through its Gigabit Ethernet uplink while terminating ATM via the integrated UTOPIA/Packet engines. The QUICC Engine handles AAL2/AAL5 SAR, PPPoA, and PPPoE termination at wire speed, and the e300 core runs control-plane software such as VxWorks or Linux for subscriber management. The 740-pin TBGA exposes sufficient GPIO and bus bandwidth for backplane glue logic interfacing.
推薦
IP-PBX and VoIP Gateway
The MPC8358EVVAGDGA's integrated TDM interface and QUICC Engine make it well suited for IP-PBX and VoIP gateway platforms bridging PSTN T1/E1 circuits to SIP trunks. The e300 core runs Asterisk or commercial PBX software, while the communications processor module handles signaling, RTP stream handling, and echo cancellation offload. Hardware encryption via the SEC block secures SIP/TLS and SRTP media without taxing the host CPU.
推薦
Industrial Secure Gateway
For industrial gateways bridging OT networks to the cloud, the MPC8358EVVAGDGA delivers the dual Gigabit Ethernet, hardware IPSec/SSL acceleration, and 0 to 105 C temperature range needed for plant-floor deployment. The QUICC Engine handles Modbus/TCP, DNP3, and IEC 61850 protocol conversion while the e300 core executes firewall and remote-access VPN software. The lead-free TBGA package withstands industrial assembly reflow profiles.
推薦
Wireless LAN / Wi-Fi Access Controller
In enterprise Wi-Fi controllers aggregating multiple 802.11 access points, the MPC8358EVVAGDGA provides Gigabit Ethernet trunking, IPSec-secured CAPWAP tunnels via its SEC block, and sufficient CPU headroom for mobility, QoS, and RADIUS processing. The DDR2 controller supports large subscriber tables, while the QUICC Engine accelerates CAPWAP, GRE, and 802.1X encapsulation at line rate across multiple aggregated APs.
推薦
Secure VPN Concentrator
The MPC8358EVVAGDGA's hardware-accelerated SEC block accelerates DES, 3DES, AES, and SHA algorithms at gigabit rates, enabling VPN concentrators to terminate hundreds of IPSec tunnels without CPU saturation. The QUICC Engine manages tunnel encapsulation, anti-replay windows, and key refresh, while the e300 core runs policy and IKE negotiation. The 740-pin TBGA provides the GPIO and bus bandwidth required by multi-port crypto accelerator line cards.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8358EVVAGDGA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8360EVVAGDGA | MPC8358CVVAGDGA |
|---|---|---|---|
| Package | TBGA-740 (37.5x37.5 mm) | TBGA-740 (37.5x37.5 mm) - same | TBGA-740 (37.5x37.5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz |
| Hardware Security Engine (SEC) | Yes (DES/3DES/AES/SHA) | Yes (enhanced SEC) | No (non-encryption variant) |
| DDR Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Gigabit Ethernet MACs | 2 x 10/100/1000 Mbps | 2 x 10/100/1000 Mbps | 2 x 10/100/1000 Mbps |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C |
| Pin/Pin Compatibility | Reference | Drop-in compatible | Drop-in compatible |
主要差異化特點
- Pin-compatible richer-feature upgrade path (對比MPC8358CVVAGDGA)
- End-of-Life awareness for second-sourcing (對比MPC8360EVVAGDGA)
- Integrated QUICC Engine offload (對比MPC8358CVVAGDGA)
設計說明
The 740-ball TBGA at 1.0 mm pitch requires a minimum four-layer PCB with a continuous ground plane directly beneath the BGA for power integrity and DDR2 reference-plane return. Matched 50 Ω trace impedance is required for the DDR2 address/command and clock groups. Follow NXP application note AN-2806 for BGA breakout via-in-pad or dog-bone fanout, and use microvia stack-ups on high-speed signal layers.
Estimated: at full 400 MHz operation, junction-to-ambient thermal resistance for the TBGA-740 is approximately 15-20 C/W on a standard 4-layer JEDEC test board. Designers should verify θJA from the NXP hardware specifications document and provide adequate copper spreading on inner and outer layers. Forced-air cooling or a heatsink is recommended for sustained operation at +105 °C ambient.
DDR2 data and strobe groups require ±25 ps trace-length matching within byte lanes and ±50 ps between byte lanes; route DQS differential pairs with 100 Ω differential impedance. The Gigabit Ethernet GMII/RGMII signals should be length-matched to within 50 mil and routed away from the DDR bus to minimize crosstalk. Use series-termination resistors on RGMII source-synchronous clocks per NXP reference schematics.
Do not confuse the MPC8358E (with SEC) with the MPC8358C (without SEC) - both share the TBGA-740 footprint but the 'C' variant lacks the encryption engine. Boot configuration words sampled at POR determine the boot source and must match the JTAG/COP debug port settings. Ensure the 1.2 V core supply ramps before the 1.8/2.5/3.3 V I/O rails to avoid I/O latch-up at power-up.
合規資訊
Lead-free indicated by 'G' in part suffix per NXP part-numbering convention; full RoHS/REACH compliance documentation should be requested directly from NXP. AEC-Q100 not applicable for this communications processor class.
