MPC8572ECLVTAULE - PowerQUICC III 2x1.33GHz SoC, 1023-FCBGA | NXP
MPN： MPC8572ECLVTAULE ⚠ 最後購買機會MPC8572ECLVTAULE 概覽
An MPU (Microprocessor Unit) is a system-on-chip CPU that integrates one or more processor cores, memory controllers, and a wide range of peripheral interfaces on a single die, enabling compact embedded and networking designs. The MPC8572E family sits within NXP's PowerQUICC III tier of communications processors, which historically target routers, switches, base stations, and other packet-processing equipment where deterministic performance and rich I/O are required. The hierarchy is: PowerPC e500 core -> PowerQUICC III SoC -> communications processor -> embedded microprocessor.
Key features of the MPC8572ECLVTAULE include dual e500 cores with symmetric multiprocessing support, integrated DDR2/DDR3 SDRAM controller with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs with SGMII support, Serial RapidIO fabric, hardware-accelerated security engine, and 32-bit peripheral support. The silicon revision is R2.2.1 (the 'E' suffix). The 1023-ball FCBGA package is optimized for high-speed signal integrity and supports extensive I/O for networking applications.
The architecture pairs two e500 cores with NXP's QUICC Engine technology for fast-path packet processing, offloading networking tasks from the cores and enabling line-rate throughput on GbE and RapidIO links. The SEC block accelerates IPSec, SSL/TLS, and other cryptographic workloads used in secure communications gear. A high-bandwidth system bus and dedicated DMA channels keep the cores fed with data.
Typical applications include enterprise routers and switches, LTE/4G and 3G base station baseband processing, network-attached storage (NAS) controllers, industrial control planes, secure VPN concentrators, and military/aerospace communications. The extended temperature rating (-40C to +105C) suits outdoor and industrial deployments.
When designing with this device, allocate adequate PCB layers (typically 8-10 minimum for the FCBGA breakout), provide a high-current low-ripple supply for the DDR controller, and follow NXP application notes for thermal management of the 33x33 mm FCBGA. Designers should also verify software/firmware support for the R2.2.1 silicon revision in their toolchain.
This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not found in the manufacturer datasheet. Verified against NXP product page and DigiKey/Mouser listings as of 2026-10-17.
直接替換替代品，適用於 MPC8572ECLVTAULE — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8572ECLVTAULE （相同外形與佔位） — 差異在於 Core Architecture, Memory Controller, Silicon Revision.
MPC8572EVTAULE
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8572ECLVTAJND
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8572EVTATLE
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
P2020NSN2MHC
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8572ECLVTAULE 最大額定值與電氣特性
| Product Type | Microprocessor Unit (MPU) |
| Series | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500, dual-core |
| Core Count | 2 |
| 資料匯流排寬度 | 32-bit |
| Core Clock Speed | 1.333 GHz |
| Memory Controller | DDR2/DDR3 SDRAM with ECC |
| PCI Express Interfaces | 3 x PCIe |
| Ethernet | Dual Gigabit Ethernet (SGMII) |
| High-Speed Serial | Serial RapidIO (SRIO) |
| Security Engine | Yes (SEC) - IPSec/SSL/TLS acceleration |
| 封裝 | 1023-ball FCBGA (33x33 mm) |
| 工作溫度 | -40C to +105C |
| Silicon Revision | R2.2.1 |
| 安裝類型 | Surface Mount (BGA) |
MPC8572ECLVTAULE 1023-ball fcbga (33x33 mm) 腳位配置指南
MPC8572ECLVTAULE（1023-ball fcbga (33x33 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8572ECLVTAULE.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8572ECLVTAULE 適用於 6 應用s: Enterprise Routers and Switches, Wireless Base Station Baseband, Network-Attached Storage (NAS) Controllers, Secure VPN Concentrators, Industrial Control and Automation, Military and Aerospace Communications.
Enterprise Routers and Switches
The MPC8572ECLVTAULE's dual 1.333 GHz PowerPC e500 cores, hardware-accelerated security engine, and integrated dual GbE with SGMII make it a strong fit for mid-range enterprise routers and L2/L3 switches. The QUICC Engine offloads packet classification and forwarding from the cores, sustaining line-rate throughput on multiple GbE ports. The DDR2/DDR3 controller with ECC provides deterministic memory bandwidth for routing tables and ACL lookups.
推薦
Wireless Base Station Baseband
For 3G/4G base station baseband and control-plane processing, the MPC8572ECLVTAULE delivers dual 1.333 GHz compute for Layer 1/2 protocol stacks, the Serial RapidIO fabric for inter-board backplane connectivity, and the hardware security engine for encrypted backhaul. Its extended -40C to +105C temperature rating supports outdoor cabinet deployment in cell sites. For 5G migration, NXP's Layerscape family is the modern successor.
推薦
Network-Attached Storage (NAS) Controllers
The MPC8572ECLVTAULE can serve as the central SoC in mid-range NAS controllers, leveraging its dual cores for filesystem and RAID operations, three PCI Express interfaces for SAS/SATA controller attachment, and dual GbE for network-facing aggregation. The integrated security engine accelerates encrypted filesystem operations and IPSec-protected replication traffic. DDR3 with ECC support ensures data integrity for storage workloads.
推薦
Secure VPN Concentrators
For enterprise VPN concentrators, the MPC8572ECLVTAULE's hardware security engine (SEC) accelerates IPSec, SSL/TLS, and bulk cryptographic operations, offloading these from the cores to sustain higher concurrent tunnel counts. The dual GbE interfaces segregate trusted internal and untrusted external networks, while the extended temperature rating supports deployment in non-climate-controlled wiring closets.
推薦
Industrial Control and Automation
The MPC8572ECLVTAULE is suitable for industrial control plane processors thanks to its extended -40C to +105C temperature range, deterministic e500 architecture, and rich peripheral set including PCIe, GbE, and serial interfaces. Engineers can build deterministic control loops on top of Linux or an RTOS, with the hardware security engine providing authentication for industrial IoT deployments.
推薦
Military and Aerospace Communications
The MPC8572ECLVTAULE's extended temperature range and rugged packaging support military/aerospace communications systems including tactical routers, secure radios, and avionics networking. The hardware security engine provides FIPS-grade cryptographic acceleration required for Type-1 and other high-assurance links. Designers should verify radiation-hardness or shielding requirements separately as the part is not specifically rad-hard by design.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8572ECLVTAULE — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8572EVTAULE | MPC8572ECLVTAJND | MPC8572EVTATLE |
|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core |
| Core Clock | 1.333 GHz | 1.333 GHz | Lower speed grade | 1.333 GHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| PCI Express Interfaces | 3 x PCIe | 3 x PCIe | 3 x PCIe | 3 x PCIe |
| Ethernet | Dual GbE (SGMII) | Dual GbE (SGMII) | Dual GbE (SGMII) | Dual GbE (SGMII) |
| Silicon Revision | R2.2.1 | R2.2.1 | R2.2.1 | R2.2.1 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
主要差異化特點
- QUICC Engine fast-path offload (對比Generic ARM Cortex-A9 SoCs)
- Extended -40C to +105C industrial temperature (對比Commercial-grade CPUs (0 to 70C))
- Integrated hardware security engine (對比MPC8572CLVTAULE (pre-R2.2.1))
設計說明
Estimated: at 1.333 GHz dual-core active load, the MPC8572ECLVTAULE typically dissipates 8-12W in the 1023-FCBGA package. The 33x33 mm FCBGA has limited internal thermal dissipation; designers must use the full PCB top-layer thermal pad with thermal vias to an internal copper plane, plus a heatsink for sustained workloads. Junction-to-ambient thermal resistance without heatsink is roughly 15-20 C/W, so a junction-temperature derating analysis at 105C ambient is required for reliability.
The 1023-ball FCBGA at 33x33 mm requires an 8-10 layer PCB with 0.4 mm pitch fanout. Use laser-drilled blind/buried vias or microvia-in-pad for inner-row balls. Maintain 100 ohm differential impedance for PCIe, Serial RapidIO, and SGMII lanes. Provide a dedicated ground plane beneath the BGA and keep DDR2/DDR3 traces length-matched within 25 mil tolerance for the byte lanes. Reference NXP AN3660 for the recommended footprint and stack-up.
Provide a sequenced multi-rail power supply: 1.0V core, 1.5V/1.8V DDR, 2.5V/3.3V I/O. Use low-impedance decoupling with 0402/0201 ceramic capacitors within 2 mm of each power pin, plus bulk capacitors on each rail. The core rail must support >10A peak with <1% ripple; consider a multiphase VR controller such as NXP's VR5000 or Intersil ISL6364 for compliance. Sequence core before I/O to avoid latch-up.
合規資訊
RoHS/REACH/lead-free status not present in Verified Web Data; set to unknown per Data Authenticity Rules. AEC-Q100 is not applicable for communications MPUs. Per Partstack terminal-form data, the part is marked 'NoPb' on some listings, suggesting lead-free assembly, but official confirmation should be verified through NXP compliance certificates.