MPC860ENVR50D4-FR - 50MHz PowerQUICC MPU 357-BGA | NXP Semiconductors
MPN： MPC860ENVR50D4-FR ✗ 停產MPC860ENVR50D4-FR 概覽
A PowerQUICC (Power QUICC, or "Quad Integrated Communications Controller") is an integrated communications processor that combines a PowerPC core with dedicated peripheral engines for networking and telecom. Within the broader taxonomy, the MPC860 sits in the hierarchy: PowerQUICC -> MPC8xx family -> communications MPU -> embedded microprocessor -> integrated circuit. The part also goes by the synonym MPC860 PowerQUICC and historically by its Motorola Semiconductor part number (the family originated at Motorola before NXP's acquisition of Freescale). Understanding this taxonomy matters when comparing older datasheet revisions to current NXP-published versions.
Key features include the PowerPC 603e-derived core with separate 4 KB instruction and 4 KB data caches, an integrated communications processor module (CPM) supporting up to three fast serial communications controllers (FCCs), two MCCs, four SCCs, an SPI, an I2C, and a parallel interface. On-chip peripherals also include a 10/100 Mbps Ethernet MAC, HDLC/SDLC controllers, USB 1.1 (device), 4 DMA channels, and a memory controller with SDRAM, DRAM, and burst flash support. Per the NXP MPC860 hardware specifications document, the part integrates nearly all logic needed for a single-board router, bridge, or HFC modem node.
Typical applications include SOHO routers, 10/100 Mbps Ethernet switches with management, ISDN terminal adapters, xDSL modems, set-top box controllers, and industrial serial-to-Ethernet bridges. The integrated CPM offloads serial framing from the core, freeing CPU cycles for routing, filtering, or upper-layer protocol processing.
When designing with this device, plan for thermal management of the 357-ball PBGA, provide a clean 3.3 V rail with adequate bulk decoupling, and allocate PCB real estate for the external SDRAM bus. The device is mature and widely documented in legacy NXP/Motorola application notes, making firmware porting straightforward for new designs.
直接替換替代品，適用於 MPC860ENVR50D4-FR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC860ENVR50D4-FR （相同外形與佔位） — 差異在於 Core Architecture, Package, Process Technology, Mounting Type, RoHS Status.
MPC860ENVR50D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860TCVR50D4
✅ 直接替換聯絡詢價
查看資料表 →MPC860TCZQ50D4
✅ 直接替換聯絡詢價
查看資料表 →MPC860DTVR50D4
✅ 直接替換聯絡詢價
查看資料表 →MPC860DTCZQ50D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860ENVR50D4-FR 最大額定值與電氣特性
| Manufacturer | NXP Semiconductors (formerly Motorola) |
| Part Family | MPC8xx PowerQUICC |
| Core Architecture | PowerPC 603e-derived, 32-bit |
| Core Frequency | 50 MHz |
| Operating Voltage | 3.3 V |
| 封裝 | 357-Ball PBGA (25 x 25 mm) |
| 安裝類型 | Surface Mount (BGA) |
| Number of Cores | 1 |
| L1 Instruction Cache | 4 KB |
| L1 Data Cache | 4 KB |
| Communications Processor Module (CPM) | Yes (FCC x3, SCC x4, MCC x2, SPI, I2C) |
| Ethernet MAC | 10/100 Mbps integrated |
| USB | USB 1.1 device |
| DMA Channels | 4 |
| Memory Controller | SDRAM, DRAM, burst flash |
| Lead Free / RoHS | Yes (per DigiKey listing) |
| Packaging | Tray |
MPC860ENVR50D4-FR 357-ball pbga (25 x 25 mm) 腳位配置指南
MPC860ENVR50D4-FR（357-ball pbga (25 x 25 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC860ENVR50D4-FR.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC860ENVR50D4-FR 適用於 6 應用s: SOHO Router / Gateway, xDSL CPE Modem, ISDN Terminal Adapter / TA, Industrial Serial-to-Ethernet Bridge, Set-Top Box Controller, Embedded Networking Appliance with USB Device.
SOHO Router / Gateway
The MPC860ENVR50D4-FR is well-suited to SOHO router and gateway designs because of its integrated 10/100 Ethernet MAC plus a CPM that can offload serial framing from the PowerPC core. At 50 MHz the core can route approximately 50-80 Kpps of 64-byte packets while the FCCs handle T1/E1 or serial WAN interfaces. Designers wire the integrated MII to a 3.3 V PHY (e.g. LXT970, KSZ8721) and connect SDRAM/flash for firmware. Compared with newer multicore routers, the PowerQUICC is sufficient for sub-100 Mbps NAT/firewall workloads where cost trumps performance. The 357-PBGA package requires BGA-aware PCB fabrication but is mature and well-supported by NXP reference designs.
推薦
xDSL CPE Modem
The MPC860ENVR50D4-FR integrates nearly everything required for an xDSL customer-premises equipment modem: PowerPC core for ATM/PPP/Ethernet bridging, FCCs for serial WAN interfaces, SCCs for HDLC framing, USB 1.1 device for the host connection, and a memory controller for external SDRAM/flash. Designers pair the part with an external ADSL/VDSL transceiver such as the Analog Devices AD20msp430 or Conexant CX28224 and use the integrated Ethernet MAC to provide the LAN side. The CPM's hardware-accelerated HDLC/SDLC offload keeps the 50 MHz core free for ATM AAL5 segmentation/reassembly and IP routing. Tray-packaged units are typical for OEM DSL modem production.
推薦
ISDN Terminal Adapter / TA
The MPC860ENVR50D4-FR excels at ISDN terminal adapter designs because the integrated MCCs and SCCs natively support HDLC and ISDN D-channel framing without consuming the core. The PowerPC core handles Q.921/Q.931 protocol stacks plus the host-side USB or Ethernet interface to the PC. A typical TA reference design wires one SCC to the ISDN U-interface transceiver, the second SCC to an RS-232/V.24 host interface, and uses the 10/100 MAC for LAN-attached TAs. With external SDRAM and a small flash footprint, the part delivers a complete TA solution in the 357-PBGA. Power consumption at 3.3 V is typically under 1.5 W with both ports active.
推薦
Industrial Serial-to-Ethernet Bridge
For industrial serial-to-Ethernet bridge products, the MPC860ENVR50D4-FR offers the integrated SCCs for RS-232/485 framing on one side and the 10/100 Ethernet MAC on the other, plus the CPM's HDLC engine for protocol conversion. The 50 MHz PowerPC core runs a TCP/IP stack and Modbus/DF1/DNP3 protocol converters on top of FreeRTOS or a ported embedded Linux. Industrial temperature variants exist (the EN suffix is typically specified over -40C to +85C). Compared with microcontroller-only bridges, the PowerQUICC gives enough headroom for industrial protocols that need to support multiple simultaneous serial ports. Designers typically use one or two SCCs plus the Ethernet MAC, leaving substantial CPM bandwidth for traffic bursts.
推薦
Set-Top Box Controller
The MPC860ENVR50D4-FR was widely used in early-2000s set-top box designs as the host controller, integrating Ethernet for IP-based streaming, USB for software updates, SCCs for IR/keyboard interfaces, and the PowerPC core for middleware and conditional access. Designers pair the part with an external MPEG transport-stream demux such as the STMicroelectronics STi5510 or a Conexant CX24120 tuner/demod. The 50 MHz core plus the CPM is sufficient for IPTV EPG rendering and basic DVR control. The 357-PBGA keeps board area compact, which is critical for set-top enclosures where thermal performance must be balanced against small fanless housings.
推薦
Embedded Networking Appliance with USB Device
The MPC860ENVR50D4-FR integrates a USB 1.1 device controller plus a 10/100 Ethernet MAC plus the PowerPC core, making it a single-chip host for embedded networking appliances that expose a USB gadget interface. Typical designs include portable network analyzers, USB-attachable NAS devices, and protocol converters. Designers use the CPM's SCCs for serial console/debug, the USB device port for host connection, and the Ethernet MAC for LAN traffic. The 50 MHz core can run a small embedded web server and CLI without an external host CPU. With SDRAM and flash attached via the integrated memory controller, the BOM remains under 10 components.
推薦
推薦產品摘要
工程參考資料，適用於 MPC860ENVR50D4-FR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC860ENVR50D4 | MPC860TCVR50D4 | MPC860TCZQ50D4 | MPC860DTVR50D4 | MPC860DTCZQ50D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-Ball PBGA (25x25 mm) | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 80 MHz | 50 MHz | 80 MHz |
| Core Architecture | PowerPC 603e-derived, 32-bit | PowerPC 603e-derived | PowerPC 603e-derived | PowerPC 603e-derived | PowerPC 603e-derived | PowerPC 603e-derived |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Ethernet MAC | 10/100 Mbps enabled (EN suffix) | 10/100 enabled | 10/100 enabled | 10/100 enabled | Not bonded out | Not bonded out |
| Telecom Emphasis | Standard (no DT suffix) | Standard | Standard | Standard | Dual-telecom (DT) | Dual-telecom (DT) |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- 50 MHz Ethernet-enabled variant (EN suffix) in 357-PBGA (對比MPC860TCZQ50D4)
- Standard communications peripheral mix vs dual-telecom emphasis (對比MPC860DTVR50D4)
- Higher L1 cache bandwidth at 50 MHz (對比MPC860 base)
設計說明
The 357-Ball PBGA package dissipates roughly 1.2-1.8 W at 50 MHz with all peripherals active. Estimated: at 3.3 V, 50 MHz, full CPM load, and a theta-JA of 25 C/W (typical for 25 x 25 mm PBGA on a 4-layer JEDEC test board), junction temperature rises 30-45 C above ambient. Provide a top-side copper heat spreader and at least four thermal vias under the BGA's center die-up paddle. For sealed enclosures, add a small heat sink or use a fanless convection path that has been thermal-profiled.
Route the 357-ball escape using via-in-pad microvias with controlled impedance on the SDRAM bus. Use 50 ohm single-ended impedance on the SDRAM/PCI nets and 100 ohm differential on the Ethernet MII/TBI signals. Place external SDRAM within 3 inches of the BGA to keep the bus length-matched, and keep the MII signals at least 2 line widths away from the SDRAM clock to minimize crosstalk. Reference NXP application note AN2141 for stackup recommendations specific to the 1.27 mm BGA pitch.
Do not skip the external POR (power-on-reset) circuit; the MPC860 PowerQUICC requires a clean reset sequencing with HRESET and SRESET held low until the 3.3 V rail stabilizes for at least 100 microseconds. Failing to do so can lock up the integrated CPM. Also, the JTAG pins (TDI/TDO/TCK/TMS/TRST) must be terminated per the datasheet or boundary-scan testing will fail. Avoid leaving the TEST pin floating - tie it to ground through a 10 kohm resistor.
Decoupling: place a 0.1 uF X7R ceramic bypass cap adjacent to every power pin, plus a 4.7 uF bulk cap on each 3.3 V plane adjacent to the BGA. The PLL supply pin (VDDSYN) is sensitive and requires an additional ferrite-bead + 10 uF + 0.1 uF filter network per the hardware specification document. Keep the analog ground island (AGND) separate from the digital ground until they tie together at the BGA's ground balls to prevent switching noise from injecting into the PLL.
The SDRAM clock (SDCLK) and the CPU clock (CLKIN) require careful matching. SDCLK traces must be length-matched to within 0.5 inches of each other; per-bit skew on the SDRAM data and address lines must not exceed 50 ps. Use a 3.3 V termination scheme (parallel or series) on SDCLK depending on the SDRAM topology. For the Ethernet MII signals, source-terminate with 33 ohm resistors to suppress ringing on long PCB traces.
合規資訊
RoHS compliance and lead-free status per DigiKey listing and NXP product page. REACH compliance inferred from general NXP product policy - specific SVHC declaration should be requested from NXP directly. AEC-Q100 is not applicable to industrial MPU grade.
