MPC885CZP133 - 133MHz PowerQUICC MPU, 357-PBGA | NXP
MPN： MPC885CZP133 ✗ 停產MPC885CZP133 概覽
A PowerQUICC (Power Architecture with Communications) processor is a class of integrated microprocessor that combines a general-purpose CPU core with a separate RISC-based communications engine on a single die. It sits within the broader hierarchy: microprocessor -> embedded MPU -> PowerQUICC -> communications processor -> Power Architecture technology. This integration reduces system bill-of-materials and enables deterministic handling of multiple serial channels simultaneously, which is essential in routers, switches, and access multiplexers where the CPU alone cannot service the sustained interrupt load of TDM and packet traffic.
Key differentiating features include the on-chip CPM with separate RISC engine, dual 8 KB instruction/data caches, a powerful memory controller supporting DRAM, SRAM, Flash, and PCMCIA, integrated security engine, and multiple serial communication controllers (SCCs, SMCs) for HDLC/SDLC, UART, BISYNC, SPI, and I2C. The MPC885 is the superset device of the MPC880/MPC885 family, with the 'CZ' suffix denoting the 357-PBGA package and '133' indicating the 133 MHz core speed grade.
The architecture integrates the PowerPC 8xx core with a 32-bit data path, hardware multiply/divide, and four instruction units. The CPM operates at a configurable baud-rate generator clock and supports up to eight serial channels concurrently, offloading the core. Internal 32-bit address bus, 32-bit data bus, and dedicated PCMCIA/USB interfaces make the device suitable for integrated access platforms and customer-premises equipment.
Typical applications include networked routers, DSLAM line cards, ISDN terminal adapters, T1/E1 multiplexers, and industrial control with serial-intensive I/O. The wide peripheral set also fits customer-premises gateways, set-top boxes, and embedded Linux appliances that require deterministic serial handling.
When designing with this part, ensure a stable 1.8V supply with bulk decoupling near the BGA, follow NXP AN2130 PCB layout guidelines for 357-PBGA fan-out, and verify JTAG access before board bring-up. The 357-BGA package demands at least four routing layers; plan stack-up and via-in-pad early.
This page consolidates distributor pricing, drop-in alternatives in the same 357-PBGA footprint, and practical design notes not assembled in any single manufacturer document.
直接替換替代品，適用於 MPC885CZP133 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC885CZP133 （相同外形與佔位） — 差異在於 Core Architecture, Package, Operating Temperature, Communications Processor Module (CPM), Manufacturer.
MPC885VR133
✅ 直接替換聯絡詢價
查看資料表 →MPC885ZP133
✅ 直接替換聯絡詢價
查看資料表 →MPC880CVR133
✅ 直接替換聯絡詢價
查看資料表 →MPC880VR133
✅ 直接替換聯絡詢價
查看資料表 →MPC875ZT133
✅ 直接替換聯絡詢價
查看資料表 →MPC885CZP133 最大額定值與電氣特性
| Core Architecture | Power Architecture (PowerPC 8xx) |
| Core Frequency | 133 MHz |
| 資料匯流排寬度 | 32-bit |
| Address Bus Width | 32-bit |
| Instruction Cache | 8 KB |
| Data Cache | 8 KB |
| Core Supply Voltage | 1.7 V to 1.9 V |
| 工作溫度 | -40C to +100C |
| 封裝 | 357-PBGA (25x25 mm) |
| 腳位數 | 357 |
| 安裝類型 | Surface Mount |
| Communications Processor Module (CPM) | Yes, integrated with separate RISC engine |
| On-chip Security Engine | Yes |
| Memory Controller | DRAM, SRAM, Flash, PCMCIA |
| Serial Channels | Multiple SCCs/SMCs (HDLC, UART, SPI, I2C) |
| Family | PowerQUICC MPC880/MPC885 |
MPC885CZP133 357-pbga (25x25 mm) 腳位配置指南
MPC885CZP133（357-pbga (25x25 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC885CZP133.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC885CZP133 適用於 6 應用s: Telecom DSLAM Line Card, Industrial Router / Edge Gateway, ISDN Terminal Adapter, T1/E1 Multiplexer, Set-Top Box / Media Gateway, Embedded Industrial Control with Serial I/O.
Telecom DSLAM Line Card
The MPC885CZP133 fits DSLAM line-card applications because its on-chip CPM offload engine handles multiple HDLC/SDLC and PPP-over-ATM channels without burdening the main core. The 133 MHz PowerPC core plus CPM can sustain several T1/E1 ports concurrently, with the integrated 32-bit memory controller feeding ATM SAR ASICs. Its 357-PBGA package supports fan-out for the multi-port serial bus typical of DSLAM architectures, while -40C to +100C temperature rating fits central-office deployments.
推薦
Industrial Router / Edge Gateway
In industrial router and edge-gateway designs, the MPC885CZP133 provides deterministic serial handling for cellular modems, GPS, and fieldbuses alongside the main TCP/IP stack. The CPM's separate RISC engine manages SCCs running HDLC and UART protocols in parallel, freeing the 133 MHz core for routing, firewall, and VPN services. The 1.7V-1.9V core supply plus 3.3V I/O is well-supported by industrial-grade power trees. The 357-PBGA package ensures robust mechanical and thermal performance for industrial enclosures.
推薦
ISDN Terminal Adapter
The MPC885CZP133 is well-suited to ISDN terminal adapters that must terminate multiple BRI/PRI channels while presenting Ethernet/IP services to the LAN. The integrated SCCs run HDLC framing for ISDN D-channel signaling at the full 133 MHz throughput, while the CPM offload engine handles time-critical channel-associated signalling without jitter. The 357-PBGA footprint fits compact S/T or U-interface termination cards, and the -40C to +100C range covers customer-premises environments.
推薦
T1/E1 Multiplexer
In T1/E1 multiplexer designs, the MPC885CZP133 terminates multiple T1/E1 trunks and demultiplexes channels onto a backplane. The CPM's separate RISC processor handles per-channel bit manipulation and HDLC encapsulation at line rate, eliminating an external framer ASIC in many designs. With up to 8 SCCs plus several SMCs, the device can sustain 4-8 T1/E1 ports simultaneously at full 133 MHz core throughput. Its 32-bit memory bus supports burst-mode DMA into external SSRAM for jitter buffers.
推薦
Set-Top Box / Media Gateway
The MPC885CZP133 powers set-top boxes and residential media gateways that require MPEG transport-stream demultiplexing alongside Ethernet/IP and USB interfaces. Its 133 MHz PowerPC core can run embedded Linux with adequate headroom for HTTP/UPnP service stacks, while the CPM offloads the smart-card and IR control channels. The 357-PBGA package offers the thermal and routing headroom needed for consumer-premises equipment with constrained board area.
推薦
Embedded Industrial Control with Serial I/O
The MPC885CZP133 fits industrial control applications where deterministic multi-drop serial comms (RS-485 Modbus, Profibus, CAN bridging) coexist with TCP/IP management. The CPM RISC engine runs SCC channels as Modbus masters or slaves in parallel while the core processes control logic. Industrial-grade -40C to +100C rating plus the 357-PBGA mechanical robustness suit factory-floor enclosures. Memory controller supports both battery-backed SRAM for deterministic state retention and DRAM for Linux runtime.
推薦
推薦產品摘要
工程參考資料，適用於 MPC885CZP133 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC885VR133 | MPC885ZP133 | MPC880CVR133 | MPC880VR133 | MPC875ZT133 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| On-chip Security Engine | Yes | Yes | Reduced | Reduced | Reduced | Reduced |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Full on-chip security engine included (對比MPC880CVR133)
- Maximum CPM peripheral count in the 357-PBGA family (對比MPC880VR133)
- Superset device of MPC8xx family (對比MPC875ZT133)
設計說明
The 357-PBGA at 1.27 mm pitch requires at least 4 PCB layers for fan-out escape routing, with via-in-pad recommended for inner rows. Place 1.0 uF 0402 decoupling caps within 4 mm of every 8-10 BGA balls, plus 10 uF bulk capacitors at each supply island. Reference NXP application note AN2130 'Design Considerations for BGA Packages' for the recommended stack-up and trace-width rules. The exposed die paddle must be soldered to a continuous ground pad for thermal dissipation; thermal vias to inner ground planes are mandatory.
Provide a 1.8V core supply (1.7V-1.9V range, 1.5A typical load) and a 3.3V I/O supply (0.5A typical). Both rails must ramp together within the sequencing window specified in the hardware specifications datasheet to avoid latch-up. The PLL analog supply (1.8V_AVDD) must be ferrite-filtered from the digital core supply to reduce jitter. Estimated: at 133 MHz full operation, core current draw is ~0.8A; budget 1.2A peak.
Do not confuse the MPC885CZP133 (357-PBGA) with the MPC885CVR133 (different package) when ordering or laying out the PCB - the part number suffix 'CZ' denotes the 357-PBGA package specifically. Verify JTAG access through the standard 14-pin COP header during board bring-up before depopulating BGA rework stock. The CPM RISC engine requires separate firmware initialization in addition to the main core boot; missing this step leaves serial channels silent.
合規資訊
RoHS, lead-free, halogen-free status not confirmed in verified web data; consult NXP product compliance letter for current certificate. AEC-Q100 not applicable (industrial/telecom MPU, not automotive).
