MT47H128M16RT-25EIT:C - 2Gb DDR2 SDRAM, 128Mx16, 400 MHz | Micron
MPN： MT47H128M16RT-25EIT:C ✗ 停產MT47H128M16RT-25EIT:C 概覽
A DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) is a volatile memory IC that transfers data on both clock edges, doubling peak throughput versus single-data-rate SDRAM at the same clock frequency. DDR2 builds on DDR with lower voltage (1.8V vs 2.5V), higher prefetch (4n-bit vs 2n-bit), on-die termination, and stricter signal integrity requirements, making it a member of the SDRAM family inside the broader DRAM > Memory IC > Semiconductor taxonomy.
Key features include a 4n-bit prefetch architecture, differential data strobe (DQS/DQS#), SSTL_18-compatible 1.8V I/O, VDD and VDDQ both at 1.8V +/-0.1V, and an 8-bank internal organization for concurrent operations. The 84-ball FBGA footprint is JEDEC-standard and pin-compatible across density variants in the MT47H family. The -25E speed grade specifies a tRCD/tRP of 13.125 ns and a tCK minimum of 2.5 ns, equivalent to DDR2-800 (CL5) operation.
Typical applications include legacy industrial controllers, networking line cards, set-top box main memory, printer image buffers, and any 1.8V main-memory subsystem designed around DDR2-800 with x16 organization. The industrial temperature range (-40C to +85C) supports factory-floor and outdoor enclosures.
When designing with this device, follow JEDEC DDR2 PCB layout guidelines for controlled-impedance 50 ohm single-ended traces, 100 ohm differential DQS pairs, and VREF supply decoupling. The MT47H128M16RT-25EIT:C is pin-compatible with other MT47H128M16 speed grades (-25, -3, -37) and density variants, enabling simple BOM scaling.
This page synthesizes distributor pricing, verified Micron drop-in alternatives within the MT47H family, and JEDEC-aligned design notes not collected in a single place on the manufacturer datasheet.
直接替換替代品，適用於 MT47H128M16RT-25EIT:C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
MT47H128M16RT-25EIT:H
✅ 直接替換📋 參考替代品（不在目錄中）
MT47H128M16HQ-25EIT:C
✅ 直接替換📋 參考替代品（不在目錄中）
MT47H128M16RT-25EIT:C TR
✅ 直接替換📋 參考替代品（不在目錄中）
MT47H128M16RT-25E:C
✅ 直接替換📋 參考替代品（不在目錄中）
MT47H128M16RT-25EIT:C 最大額定值與電氣特性
| 記憶體類型 | DDR2 SDRAM |
| Density | 2 Gbit (128M x 16) |
| 組織 | 128M words x 16 bits |
| Number of Banks | 8 |
| Clock Frequency | 400 MHz |
| Access Time | 2.5 ns (tCK min, -25E speed grade) |
| 資料速率 | DDR2-800 |
| Prefetch Architecture | 4n-bit |
| Supply Voltage VDD | 1.8 V +/-0.1 V |
| Supply Voltage VDDQ | 1.8 V +/-0.1 V |
| I/O Standard | SSTL_18 (JEDEC-standard 1.8V) |
| Data Strobe | Differential DQS, DQS# |
| 封裝 | 84-ball FBGA (9x12.5 mm) |
| 工作溫度 | -40C to +85C (Industrial / IT grade) |
| RoHS 狀態 | Compliant (per Micron product page) |
| 安裝類型 | Surface Mount |
MT47H128M16RT-25EIT:C 84-ball fbga (9x12.5 mm) 腳位配置指南
MT47H128M16RT-25EIT:C（84-ball fbga (9x12.5 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MT47H128M16RT-25EIT:C.
請參閱 資料表 以查看完整腳位配置。
典型應用
MT47H128M16RT-25EIT:C 適用於 6 應用s: Legacy Industrial Controller Main Memory, Networking Line Card Packet Buffer, Set-Top Box Main Memory, Printer / MFP Image Buffer, Automotive Infotainment Legacy Platform, Medical Imaging Buffer (Legacy).
Legacy Industrial Controller Main Memory
The MT47H128M16RT-25EIT:C fits legacy industrial controllers because its 2 Gbit DDR2 capacity and 128Mx16 organization directly match the address map designed into CPU boards from the DDR2 era (2005-2015). The 400 MHz clock and 5-5-5 timing deliver 800 MT/s peak bandwidth, which is sufficient for HMI panels, PLC runtime memory, and fieldbus buffers. The IT (-40C to +85C) industrial temperature grade is critical for factory-floor enclosures and outdoor cabinets. Unlike newer DDR3/DDR4 SDRAMs, this DDR2 part requires 1.8V VDD/VDDQ supplies and SSTL_18 receivers, so the host controller must already be DDR2-compatible. Recommended companion MPNs include a DDR2 register/PLL like the Micron MT47H series timing reference and a 1.8V LDO for the VTT termination rail.
推薦
Networking Line Card Packet Buffer
In networking line cards and routers, the MT47H128M16RT-25EIT:C serves as packet-buffer memory when the line card ASIC/FPGA has a native DDR2 controller. Its x16 organization matches the typical 16-bit DDR2 controller PHY on legacy Broadcom/Intel/Marvell switching ASICs, providing 128 M of 16-bit-wide storage per chip. With 800 MT/s peak transfer rate, a single 2 Gbit device handles ~12.8 Gbps of read+write bandwidth, suitable for gigabit-class access ports. The industrial temperature range supports outdoor DSLAM/PON cabinet installations. Use this part instead of newer DDR3/LPDDR only when the host ASIC cannot be re-fabricated; the IT suffix makes it suitable for telecom outdoor units.
推薦
Set-Top Box Main Memory
The MT47H128M16RT-25EIT:C is well-suited for set-top box (STB) main memory because legacy STB SoCs from STMicro, Broadcom, and Ali Corporation were designed around 1.8V DDR2 interfaces with x16 organization. A single 2 Gbit device provides 256 MB of system RAM, sufficient for Linux/Middleware stacks on entry-level IPTV and cable STBs. The 84-ball FBGA footprint keeps the PCB small, which is essential for compact enclosure designs. The DDR2-800 speed grade ensures adequate bandwidth for H.264 1080p decoding and graphics overlay operations. The IT temperature rating supports enclosures mounted near heat sources without active cooling. Pair this part with a JEDEC-compliant DDR2 clock driver for source-synchronous operation.
推薦
Printer / MFP Image Buffer
Office printers and multifunction peripherals (MFPs) use the MT47H128M16RT-25EIT:C as a frame buffer to hold rasterized print images before the laser or inkjet engine. A 128M x 16 organization matches the legacy DDR2 image-processor ASICs from manufacturers like Ricoh and Canon, providing 256 MB of buffer for full-bleed A3 rasterization at 1200 dpi. The 400 MHz clock rate keeps data flowing to the print engine without stalling, while the 84-ball FBGA enables compact controller boards. The IT temperature grade supports printers installed in non-climate-controlled offices and warehouses. Use this part instead of SDR/DDR1 only if the print engine controller was designed for DDR2.
推薦
Automotive Infotainment Legacy Platform
Some automotive infotainment head units designed around 2010-2015 used DDR2 x16 SDRAM for main memory, and the MT47H128M16RT-25EIT:C is qualified for that role in non-safety-critical applications. Its industrial temperature range covers the cabin environment, while the DDR2-800 bandwidth is sufficient for navigation map caching and rear-seat entertainment streams. The 84-ball FBGA footprint is JEDEC-standard, enabling direct compatibility with the original automotive design's PCB land pattern. Note that this is NOT an AEC-Q100 qualified part; for safety-critical automotive applications, contact Micron about AEC-Q100 equivalent variants or use a newer DDR3L automotive SDRAM.
推薦
Medical Imaging Buffer (Legacy)
Legacy ultrasound and patient-monitoring systems with DDR2-based SoCs use the MT47H128M16RT-25EIT:C as image buffer memory. The 2 Gbit capacity holds a full ultrasound frame at diagnostic resolution, while the 400 MHz DDR2-800 throughput keeps Doppler processing latency low. The IT (-40C to +85C) temperature range supports portable cart-based equipment used in variable-temperature clinical environments. For new medical designs, consider the Micron MT47H family as a drop-in but verify IEC 60601-1 compliance at the system level; the SDRAM itself does not carry a medical certification.
推薦
推薦產品摘要
工程參考資料，適用於 MT47H128M16RT-25EIT:C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MT47H128M16RT-25EIT:H | MT47H128M16HQ-25EIT:C | MT47H128M16RT-25EIT:C TR | MT47H128M16RT-25E:C |
|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 84-ball FBGA (9x12.5 mm) | 84-ball FBGA (9x12.5) - same | 84-ball FBGA (9x12.5) - same | 84-ball FBGA (9x12.5) - same | 84-ball FBGA (9x12.5) - same |
| Density | 2 Gbit (128M x 16) | 2 Gbit (128M x 16) | 2 Gbit (128M x 16) | 2 Gbit (128M x 16) | 2 Gbit (128M x 16) |
| Speed Grade | -25E (DDR2-800, CL5) | H grade (higher speed option) | -25E (DDR2-800, CL5) | -25E (DDR2-800, CL5) | -25E (DDR2-800, CL5) |
| Operating Temperature | -40C to +85C (Industrial / IT) | -40C to +85C (Industrial / IT) | -40C to +85C (Industrial / IT) | -40C to +85C (Industrial / IT) | 0C to +70C (Commercial) |
| Supply Voltage | 1.8V +/-0.1V (VDD/VDDQ) | 1.8V +/-0.1V | 1.8V +/-0.1V | 1.8V +/-0.1V | 1.8V +/-0.1V |
| Packaging Form | Tray | Tray or Tape & Reel (variant-dependent) | Tray | Tape & Reel | Tray |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Industrial Temperature (IT) grade as standard (對比MT47H128M16RT-25E:C)
- JEDEC-standard 84-ball FBGA footprint across family (對比MT47H64M8B6-25E L:D TR)
- DDR2-800 (-25E) is the highest-volume speed bin (對比MT47H128M16RT-25EIT:H)
設計說明
Per JEDEC DDR2 layout guidelines, route the 16-bit DQ bus and differential DQS/DQS# strobe pairs as 50 ohm single-ended and 100 ohm differential controlled-impedance traces on the outer PCB layers. Estimated: at 1.8V SSTL_18 swing, trace lengths on the DQ group must be matched within +/-25 mil to preserve setup/hold margins at DDR2-800. Place VREF decoupling caps within 200 mil of every VREF pin and use a star-ground topology to keep reference-plane return paths short.
Per the Micron MT47H datasheet, VDD and VDDQ both require 1.8V +/-0.1V with bulk decoupling of at least 10uF plus 0.1uF high-frequency ceramic per pin. VTT (termination supply) must track VDDQ/2 within +/-40 mV; use a dedicated VTT LDO such as a TPS51200 or equivalent. The ZQ pin requires a 240 ohm 1% resistor to ground for output-driver calibration - omitting this pin disables impedance matching and may cause signal-integrity failures.
DDR2 source-synchronous timing relies on the DQS/DQS# strobe pair being centered in the data eye. Per Micron application notes, fly-by routing with via-in-pad is NOT recommended for DDR2 - use microstrip or stripline on a continuous reference plane. Length matching of DQ to DQS within +/-50 ps is recommended for DDR2-800. Estimated: a 1mm trace mismatch at 1.8V edge rate (~1ns) contributes approximately 6 ps, so keep DQ-to-DQS length differences under 8 mm.
Common pitfalls when designing with MT47H128M16RT-25EIT:C include: (1) forgetting the 240 ohm ZQ calibration resistor - DDR2 will fail JEDEC compliance without it; (2) using a DDR3 SDRAM footprint - DDR2 uses 84-ball FBGA with different ball pitch; (3) mismatching the IT and Commercial temperature grades - the IT grade is -40C to +85C, the commercial is 0C to +70C; (4) assuming NRND means 'unavailable' - Micron NRND parts still ship for legacy support but should not be used in new designs.
合規資訊
RoHS compliance per Micron product page. NOT AEC-Q100 qualified - this is an industrial-temperature SDRAM, not an automotive-grade part. Halogen-free status not stated in available web data; set to 'unknown'. DDR2 SDRAM lifecycle status is NRND (Not Recommended for New Designs) per Micron.
