MX30LF1G18AC-XKR-T - 1Gb SLC NAND Flash, 3V, BGA-63 | Macronix
MPN： MX30LF1G18AC-XKR-T ✓ 啟用中MX30LF1G18AC-XKR-T 概覽
What is SLC NAND Flash? SLC (Single-Level Cell) NAND is a non-volatile memory technology that stores one bit per cell, giving it the highest endurance (typically 100k P/E cycles per block), the lowest bit-error rate, and the fastest write speeds of any NAND family. Within the broader hierarchy, SLC NAND sits below DRAM in the memory pyramid: faster than NOR for large-block writes, denser and cheaper per bit than NOR, and far more reliable than MLC/TLC/QLC NAND at the cost of lower density per die. The MX30LF1G18AC-XKR-T therefore fills the niche where designers need MLC-class capacity but cannot tolerate MLC-level endurance or error-rate penalties.
Key differentiating features include ONFI 1.0 command-set compliance, a hardware PT (Protection) pin on ball G5 that block-protects the entire chip at power-on, internal 4-bit ECC engines, and an extended -40 C to +105 C automotive temperature range. The 63-ball VFBGA package keeps board area under 100 mm^2, while the asynchronous interface allows simple MCU/FPGA glue logic without requiring an ONFI controller IP block.
Architecturally, the MX30LF1G18AC implements a single 1 Gbit die organized as 1024 blocks, each containing 64 pages of 2112 bytes (2048 data + 64 spare). Read is page-granular (typically 25 us), program is page-driven (~300 us), and erase is block-level (typically 2 ms). The ONFI 1.0 command set ensures the part can be driven by any standard NAND controller, including Linux MTD drivers and bare-metal bootloaders.
Typical applications include automotive infotainment and instrument-cluster boot/data storage, industrial HMI panel firmware, point-of-sale terminals, IoT gateways requiring reliable OTA update storage, and medical devices where long-term data retention (10-year JEDEC spec) outweighs density requirements.
When designing with this device, route the BGA balls to a minimum 4-layer PCB with continuous GND plane under the package to maintain signal integrity on the 8-bit parallel bus, and budget the I/O capacitance (typically 10 pF) when calculating read-window margins. Always issue the PT-protection release command sequence before programming in production, or leave PT floating (the internal weak pull-down disables protection).
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 MX30LF1G18AC-XKR-T — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
MX30LF1G18AC-XKI
✅ 直接替換📋 參考替代品（不在目錄中）
MX30LF2G18AC-XKR
✅ 直接替換📋 參考替代品（不在目錄中）
MX30LF1G08AA-XKI
✅ 直接替換📋 參考替代品（不在目錄中）
MX30LF1G18AC-XKR
✅ 直接替換📋 參考替代品（不在目錄中）
MX30LF1G18AC-XKR-T 最大額定值與電氣特性
| 記憶體類型 | Non-volatile NAND Flash (Single-Level Cell) |
| Density | 1 Gbit (128 MB) |
| 組織 | 128M x 8 |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| 介面 | Parallel asynchronous 8-bit (x8) |
| Read Access Time (tRC) | 20 ns |
| Page Size | 2112 bytes (2048 + 64 spare) |
| Block Size | 64 pages (128 KB + 4 KB spare) |
| Block Count | 1024 blocks |
| ECC Support | Internal 4-bit ECC |
| Command Set | ONFI 1.0 compliant |
| Protection Pin (PT) | Active-high at power-on, internal weak pull-down |
| 封裝 | 63-ball VFBGA, 9 x 11 mm |
| 工作溫度 | -40 C to +105 C (automotive grade) |
| Data Retention | 10 years (per JEDEC JESD22-A117) |
| Endurance | 100k program/erase cycles per block (SLC) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
MX30LF1G18AC-XKR-T 63-ball vfbga, 9 x 11 mm 腳位配置指南
MX30LF1G18AC-XKR-T（63-ball vfbga, 9 x 11 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MX30LF1G18AC-XKR-T.
請參閱 資料表 以查看完整腳位配置。
典型應用
MX30LF1G18AC-XKR-T 適用於 6 應用s: Automotive Infotainment Boot & Data Storage, Industrial HMI Panel Firmware Storage, Point-of-Sale (POS) Terminal Transaction Logging, IoT Gateway OTA Update Storage, Medical Device Patient Data Logging, Networking Equipment Routing Table & Log Storage.
Automotive Infotainment Boot & Data Storage
The MX30LF1G18AC-XKR-T's 1 Gbit SLC density, automotive +105 C grade, and 100 k P/E cycle endurance make it a strong fit for automotive infotainment head units and instrument clusters where the host SoC boots from NAND and stores navigation maps, audio buffers, and diagnostic logs. Placed on a 4-layer PCB with continuous GND plane beneath the BGA, it pairs with an ONFI-capable application processor; the 4-bit internal ECC corrects single-bit errors that occur naturally across the -40 C to +105 C automotive temperature span, eliminating the need for an external ECC engine. The PT pin (ball G5) can be tied to a power-good rail to protect boot blocks during in-vehicle brown-out events.
推薦
Industrial HMI Panel Firmware Storage
Factory-floor human-machine interface (HMI) panels require long-retention, high-endurance code storage that survives 10+ years of continuous operation. The MX30LF1G18AC-XKR-T's 10-year data retention and 100 k P/E cycle rating align with industrial panel MTBF targets, while the parallel 8-bit interface allows simple FPGA or MCU control without an external NAND controller IP block. Designers place the BGA on a 4-layer board, route the 8-bit data bus with 50 ohm controlled impedance, and rely on the ONFI 1.0 command set for predictable timing during firmware update operations. The +105 C ambient rating covers sealed enclosure environments without active cooling.
推薦
Point-of-Sale (POS) Terminal Transaction Logging
POS terminals log thousands of transactions per day to non-volatile storage and require bit-error-failure tolerant code and data storage. The MX30LF1G18AC-XKR-T's SLC architecture delivers 10-100x higher endurance than MLC/TLC NAND at the same density, while the parallel interface allows transaction bursts to be written at ~3.3 MB/s (8-bit bus at 20 ns cycle). ECC scrubbing every 10k P/E cycles extends retention; the PT pin protects boot sectors against accidental field-erasure. The BGA-63 footprint keeps the BOM cost below NOR-Flash alternatives of equivalent density.
推薦
IoT Gateway OTA Update Storage
IoT gateways in smart-building and asset-tracking deployments require reliable over-the-air (OTA) firmware update storage with predictable fail-safe recovery. The MX30LF1G18AC-XKR-T stores dual A/B firmware images in two partition blocks; on a failed boot, the host reverts to the previous image via ONFI block-copy operations. The 1 Gbit capacity covers 2-3 firmware revisions plus 256 MB of telemetry log buffer. The BGA-63 package fits inside compact gateway enclosures with limited PCB area, and the 2.7-3.6 V supply aligns with battery-backed 3.3 V rail designs without needing a level shifter.
推薦
Medical Device Patient Data Logging
Patient-monitoring devices such as infusion pumps and portable ECG recorders must store days to weeks of patient data in non-volatile memory with bit-error-failure-safe reliability. The MX30LF1G18AC-XKR-T's 10-year data retention and 100 k P/E endurance cover the typical 5-7 year medical-device service life with margin. Its parallel 8-bit interface allows simple read/write DMA from medical MCUs without needing a complex file system layer. The automotive +105 C rating exceeds medical operating-temperature requirements, ensuring reliability in autoclave-adjacent hospital environments.
推薦
Networking Equipment Routing Table & Log Storage
Industrial routers and managed switches need high-endurance non-volatile storage for routing tables, configuration logs, and firmware images. The MX30LF1G18AC-XKR-T's ONFI 1.0 command set enables Linux MTD driver support for open-source routing stacks, while its SLC endurance handles the frequent log-write workload of managed switches. The parallel interface allows direct memory-mapped access from network processors, achieving higher throughput than SPI NOR at the same density. The PT pin protects against accidental in-field erase during power-sequencing anomalies on PoE-powered switches.
推薦
推薦產品摘要
工程參考資料，適用於 MX30LF1G18AC-XKR-T — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MX30LF1G18AC-XKI | MX30LF2G18AC-XKR | MX30LF1G08AA-XKI | |
|---|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix | |
| Package | 63-VFBGA (9x11 mm) | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 48-TSOP - different footprint |
| Density | 1 Gbit (128 MB) | 1 Gbit | 2 Gbit | 1 Gbit | 1 Gbit |
| Cell Type | SLC | SLC | SLC | SLC | SLC |
| Interface | Parallel 8-bit, ONFI 1.0 | Parallel 8-bit, ONFI 1.0 | Parallel 8-bit, ONFI 1.0 | Parallel 8-bit, ONFI 1.0 | Parallel 8-bit, ONFI 1.0 |
| Operating Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +85 C | -40 C to +85 C |
| PT (Protection) Pin | Yes (ball G5) | Yes (ball G5) | Yes (ball G5) | No (first-generation die) | Yes |
| Endurance (P/E cycles) | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Delivery Format | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel |
主要差異化特點
- Higher automotive temperature rating than first-generation sibling (對比MX30LF1G08AA-XKI)
- Includes hardware PT (Protection) pin absent in prior generation (對比MX30LF1G08AA-XKI)
- BGA-63 footprint compatible with 2 Gbit upgrade path (對比MX30LF2G18AC-XKR)
- Tape-and-reel packaging for high-volume SMT assembly (對比MX30LF1G18AC-XKI)
設計說明
Route the 8-bit parallel data bus (DQ0-DQ7), control signals (CLE, ALE, CE, RE, WE), and R/B on a 4-layer PCB with continuous GND plane beneath the BGA-63 footprint. Maintain 50 ohm controlled impedance on the data bus and group DQ0-DQ7 within 0.5 mm of each other to minimize skew. Place 100 nF decoupling caps within 0.005 inches of each VCC ball. Avoid routing any signal traces beneath the BGA package.
Always issue the PT-protection release command sequence before programming the device in production, or leave the PT pin (ball G5) floating to use the internal weak pull-down. Driving PT high at power-on permanently block-protects the entire chip and requires a hardware reset to recover. Do not use the PT pin as a GPIO - it has no other function and its state is sampled only at VCC power-on.
The MX30LF1G18AC has a typical I/O capacitance of 10 pF per pin. When calculating read-window margins on a heavily-loaded bus (>4 devices), include this capacitance in your worst-case rise/fall time calculation. For read cycles, add 1 ns of propagation delay per 100 mils of trace beyond the first inch to avoid tRC violations at 20 ns.
Estimated: at continuous read operation (8-bit bus at 20 ns cycle) on a 4-layer PCB with 1 oz copper, the MX30LF1G18AC dissipates approximately 80 mW (input values: VCC = 3.3 V, ICC_active = 24 mA). The BGA-63 package has a typical theta_JA of 50 C/W, resulting in a 4 C junction temperature rise - well within the 105 C ambient limit. No heatsink is required.
合規資訊
XK suffix indicates automotive temperature grade; AEC-Q100 qualification per Macronix product page. Halogen-free and RoHS compliant per Macronix material declaration.
