PIC16LF18345-E/GZ - 8-Bit 32MHz 14KB Flash XLP MCU | Microchip
MPN： PIC16LF18345-E/GZ ✓ 啟用中PIC16LF18345-E/GZ 概覽
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, optimized for deterministic real-time control, low standby power, and low system cost. PIC microcontrollers sit within the broader hierarchy: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. The PIC16(L)F183xx family adds Core Independent Peripherals (CIPs) such as CLC, CWG, NCO, DSM, and Configurable Logic, alongside the Peripheral Pin Select (PPS) routing engine that lets digital peripherals be remapped to almost any I/O pin.
Key features of the PIC16LF18345 include a 10-bit ADC with computation (ADC2), a 5-bit DAC, two 8-bit timers and three CCP modules supporting PWM, two I2C/SPI modules, an EUSART, up to 18 I/O pins, and Microchip's eXtreme Low Power (XLP) technology that drops the device into the nanoWatt sleep range. The integrated 32MHz internal oscillator eliminates an external crystal in most designs, reducing BOM and PCB area.
Architecturally, the PIC16LF18345 uses Microchip's enhanced mid-range 8-bit core with a hardware stack, single-cycle instruction execution, and a 14-bit instruction word. The CIP block performs logic, signal conditioning, and waveform generation in hardware without CPU intervention, freeing the core for application code and dramatically improving real-time determinism and energy efficiency.
Typical applications include battery-powered IoT sensor nodes, wearable health monitors, low-power wireless remote controls, energy-harvesting edge nodes, automotive body and lighting modules, and small home appliances where XLP standby current and on-chip CIPs reduce external component count. Industrial sensor transmitters, electronic shelf labels, and LoRa / sub-GHz companion-MCU designs also benefit from the PIC16LF18345's PPS flexibility.
When designing with this part, pay attention to the UQFN-20 exposed pad - it must be soldered to the ground pad for both thermal and electrical performance. Decouple VDD with a 1uF ceramic plus a 100nF parallel cap, place them within 3mm of the VDD pin, and reserve the MCLR pin with its typical 10k pull-up unless using the internal weak pull-up configuration.
直接替換替代品，適用於 PIC16LF18345-E/GZ — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC16LF18345-E/GZ （相同外形與佔位） — 差異在於 Package, ADC, Operating Temperature, Program Memory (Flash), Communication Peripherals.
PIC16LF18344-I/GZ
✅ 直接替換聯絡詢價
查看資料表 →PIC16F18345-E/GZ
✅ 直接替換聯絡詢價
查看資料表 →PIC16F15345-E/GZ
✅ 直接替換聯絡詢價
查看資料表 →PIC16LF18346-I/GZ
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
PIC16LF18325-E/JQVAO
✅ 直接替換聯絡詢價
查看資料表 →PIC16LF18345-E/GZ 最大額定值與電氣特性
| Core Architecture | 8-bit PIC enhanced mid-range |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1 KB |
| Data EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| 工作溫度 | -40 C to +125 C (E = extended industrial) |
| I/O Pins | 18 |
| ADC | 10-bit with Computation (ADC2) |
| DAC | 5-bit |
| Timers | 2 x 8-bit, 2 x 16-bit (via CCP/CCPTMR) |
| CCP Modules | 3 (capture / compare / PWM) |
| Communication Peripherals | 2 x I2C/SPI, 1 x EUSART |
| Core Independent Peripherals | CLC, CWG, NCO, DSM, CLC, Configurable Logic |
| Peripheral Pin Select (PPS) | Yes |
| 封裝 | 20-pin UQFN (4x4 mm) with Exposed Pad |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| MSL 等級 | 1 |
PIC16LF18345-E/GZ 腳位配置
| 腳位 1 | RA0 — Bidirectional I/O / analog input |
| 腳位 2 | RA1 — Bidirectional I/O / analog input |
| 腳位 3 | RA2 — Bidirectional I/O / analog input |
| 腳位 4 | RA3 — Bidirectional I/O / analog input |
| 腳位 5 | RA4 — Bidirectional I/O / analog input |
| 腳位 6 | RA5 — Bidirectional I/O / analog input |
| 腳位 7 | VSS — Ground |
| 腳位 8 | RA6 — Bidirectional I/O / analog input |
| 腳位 9 | RA7 — Bidirectional I/O / analog input |
| 腳位 10 | RB0 — Bidirectional I/O / analog input |
| 腳位 11 | RB1 — Bidirectional I/O / analog input |
| 腳位 12 | RB2 — Bidirectional I/O / analog input |
| 腳位 13 | RB3 — Bidirectional I/O / analog input |
| 腳位 14 | RB4 — Bidirectional I/O / analog input |
| 腳位 15 | RB5 — Bidirectional I/O / analog input |
| 腳位 16 | RB6 — Bidirectional I/O / ICSPCLK |
| 腳位 17 | RB7 — Bidirectional I/O / ICSPDAT |
| 腳位 18 | VDD — Positive supply voltage (1.8V-3.6V) |
| 腳位 19 | MCLR — Master Clear / reset input (active-low) |
| 腳位 20 | RC0 — Bidirectional I/O / analog input |
典型應用
PIC16LF18345-E/GZ 適用於 6 應用s: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Low-Power Wireless Remote Control, Energy-Harvesting Edge Sensor, Automotive Body and Lighting Module, Small Home Appliance Control.
Battery-Powered IoT Sensor Node
The PIC16LF18345-E/GZ is a strong fit for battery-powered IoT sensor nodes because its LF silicon delivers nanoWatt-range XLP sleep current and the on-chip 10-bit ADC2 with computation performs oversampling and threshold detection without waking the CPU. The 32MHz HFINTOSC eliminates an external crystal, reducing BOM and standby drain. With 1.8V-3.6V VDD, it runs directly from a single CR2032 or two AA cells, while the Peripheral Pin Select (PPS) routes I2C/SPI sensor interfaces to any spare pin, simplifying PCB layout in compact sensor modules.
推薦
Wearable Health Monitor
Wearable health monitors benefit from the PIC16LF18345-E/GZ's XLP sleep modes (down to nanoWatt range) and 1.8V-3.6V operation that runs directly from small LiPo or coin-cell batteries. The on-chip 5-bit DAC and 10-bit ADC2 with computation can drive bio-impedance or pulse-oximetry front-ends, while the three CCP/PWM channels drive haptic feedback motors and LED indicators. The UQFN-20 (4x4 mm) small footprint fits wristbands and patches, and PPS lets designers remap I2C sensor and SPI display buses without PCB rework when the BOM changes.
推薦
Low-Power Wireless Remote Control
For low-power wireless remote controls, the PIC16LF18345-E/GZ combines sub-uA sleep current with the CWG (Complementary Waveform Generator) and NCO (Numerically Controlled Oscillator) CIPs that can synthesize 38kHz IR carrier or sub-GHz OOK modulation in hardware without CPU intervention. The 32MHz core handles button-scan debouncing, RF protocol encoding, and battery-ADC monitoring, while the LF silicon extends coin-cell life well beyond typical RF remote duty cycles. PPS simplifies routing of the IR LED driver and RF module enable signals to available I/O pins.
推薦
Energy-Harvesting Edge Sensor
Energy-harvesting edge sensor nodes leverage the PIC16LF18345-E/GZ's nanoWatt XLP sleep and 1.8V minimum VDD to operate directly from small solar cells, thermal harvesters, or vibration rectennas without an intermediate boost regulator in many cases. The Core Independent Peripherals (CLC, CWG, DSM) wake the device in response to sensor events without CPU wake-up, dramatically reducing average current. The 10-bit ADC2 with computation performs threshold detection on harvested energy levels, and PPS lets the same firmware target different sensor interfaces with zero PCB changes.
推薦
Automotive Body and Lighting Module
Automotive body and lighting modules use the PIC16LF18345-E/GZ (extended -40C to +125C grade) for interior LED lighting, ambient color mixing via PWM, and CAN/LIN node control. The three CCP modules produce complementary PWM with hardware dead-band from the CWG, ideal for half-bridge LED drivers and small motor control. While not AEC-Q100 qualified at this part number, the extended-temperature E suffix and the 1.8V-3.6V operating range suit under-hood accessory electronics. PIC16LF18345-E/GZVAO is the AEC-Q100 equivalent variant for production automotive use.
推薦
Small Home Appliance Control
Small home appliances such as coffee makers, blenders, air purifiers, and smart thermostats use the PIC16LF18345-E/GZ as a low-cost main controller. The three CCP/PWM channels drive TRIACs, MOSFET gates, and brushless DC motors, while the CLC and CWG peripherals handle zero-cross detection and synchronous rectification in hardware, offloading the 32MHz core. The 14KB Flash comfortably fits user-interface state machines plus a Modbus or BLE bootloader, and the UQFN-20 (4x4 mm) package fits inside small PCB enclosures.
推薦
推薦產品摘要
工程參考資料，適用於 PIC16LF18345-E/GZ — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC16LF18344-I/GZ | PIC16F18345-E/GZ | PIC16F15345-E/GZ |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-pin UQFN (4x4) | 20-pin UQFN (4x4) - same | 20-pin UQFN (4x4) - same | 20-pin UQFN (4x4) - same |
| Flash / SRAM | 14 KB / 1 KB | 7 KB / 512 B (-50%) | 14 KB / 1 KB (same) | 14 KB / 1 KB (same) |
| Operating Voltage | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 5.5 V (F) | 1.8 V to 5.5 V (F) |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| I/O Pins | 18 | 18 | 18 | 18 |
| ADC / DAC | 10-bit ADC2 / 5-bit DAC | 10-bit ADC2 / 5-bit DAC | 10-bit ADC2 / 5-bit DAC | 10-bit ADC2 / 5-bit DAC |
| Core Independent Peripherals | CLC, CWG, NCO, DSM, CCP | CLC, CWG, NCO, DSM, CCP | CLC, CWG, NCO, DSM, CCP | CLC, CWG, NCO, DSM, CCP (improved) |
| Unit Price (qty 1, approx) | $1.51 | $1.30 | $1.55 | $1.45 |
主要差異化特點
- Larger Flash and SRAM at the same price tier as PIC16LF18344-I/GZ (對比PIC16LF18344-I/GZ)
- Lower-voltage optimized silicon for battery applications (對比PIC16F18345-E/GZ)
- Mature CIP peripheral set with PPS flexibility (對比PIC16F15345-E/GZ)
設計說明
Decouple VDD with a 1uF X7R ceramic in parallel with a 100nF NP0/C0G placed within 3mm of the VDD pin (pin 18) and the exposed thermal pad tied to VSS. For battery-powered designs, leverage the PIC16LF18345's nanoWatt XLP sleep modes by configuring the CPU to sleep between ADC2 interrupts; this typically reduces average current to the 1-5uA range for duty-cycled sensor nodes. Avoid switching I/O pins faster than needed - slower edges cut transient current peaks and reduce EMI in the 32MHz HFINTOSC band.
The 20-pin UQFN (4x4 mm) package dissipates heat primarily through the exposed pad (EP) on the bottom. The EP MUST be soldered to a ground copper pour of at least 25mm^2 on the top layer plus thermal vias to inner/inner-bottom ground planes to keep junction temperature within the -40C to +125C extended industrial range. At 32MHz active and 3.6V VDD, typical power dissipation is 15-25mW, well within the package's thermal limits, but a missing EP solder connection can raise theta_JA above 80 C/W.
Two common pitfalls: (1) forgetting to configure PPS for digital peripherals - SPI/I2C/UART default pins must be remapped in firmware or the peripherals will not drive the expected I/O; (2) failing to disable the JTAG pins on ports that share them, which leaves the pins floating until firmware clears the JTAGEN bit. Always run Microchip's MPLAB X IDE with the latest XC8 compiler and PIC16LF18345 Device Family Pack (DFP) to avoid register-name mismatches.
Route the ICSP clock and data lines (RB6/RB7) as short, parallel traces to the programming header with no series resistors greater than 100 ohms, otherwise ICSP programming may fail at low VDD. Keep the MCLR pull-up (typically 10k) close to the IC and add a 100nF cap to ground for ESD immunity. The HFINTOSC is sufficient for most designs, but if you need a precision UART baud rate, plan for an external 32.768kHz crystal on SOSC pins (RA4/RA5) instead of using HFINTOSC trimming.
合規資訊
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified in the -VAO variant only; standard PIC16LF18345-E/GZ is not automotive qualified.
