PIC18F27J13-I/ML - 128KB Flash 8-bit MCU | Microchip QFN-28
MPN： PIC18F27J13-I/ML ✓ 啟用中PIC18F27J13-I/ML 概覽
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and peripherals such as ADC, timers, and communication interfaces. Within the broader semiconductor hierarchy, an MCU sits under microcontrollers, which themselves fall under integrated circuits and ultimately semiconductors. The PIC18F27J13 uses a RISC-based Harvard architecture, executing most instructions in a single cycle to deliver deterministic real-time control at low power.
Key features include 128KB Flash (64K x 16), 4KB RAM, an integrated 12-bit ADC with up to 13 channels, and the deep-sleep nanoWatt XLP mode that draws only nanoamp-level standby current. The device supports an operating voltage range from 2.15 V to 3.6 V (FindMyChip) and an extended 4.2 V to 5.5 V range (Chipdig listing) depending on configuration, and operates across an industrial temperature range of -40C to +85C. The QFN-28 package with 25 I/O pins supports compact PCB layouts where board area is critical.
The PIC18F27J13 uses a 16-bit wide instruction set with an 8-bit data path, optimizing code density while retaining the simplicity of an 8-bit core. It includes a 4x PLL for high-speed operation from low-frequency crystals and integrated peripherals such as UART, SPI, I2C, comparators, and PWM modules. This combination makes it well suited to mixed-signal embedded applications where both digital control and analog acquisition are required.
Typical applications include consumer electronics, industrial sensor nodes, portable medical devices, low-power IoT endpoints, and human-machine interface (HMI) controllers. The 12 MIPS throughput and 128KB code space support graphical UI libraries and protocol stacks, while XLP technology extends battery life in always-on products.
When designing with this device, ensure proper decoupling (100 nF + bulk) near VDD pins and follow QFN-28 thermal pad soldering guidelines to maximize heat dissipation and mechanical reliability.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single-source reference for evaluating the PIC18F27J13-I/ML.
直接替換替代品，適用於 PIC18F27J13-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC18F27J13-I/ML （相同外形與佔位） — 差異在於 Package, Timers, ADC, Program Memory (Flash), I/O Pins.
PIC18F26J13-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18F26J53-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC18F27J13T-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC18F26J13T-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC18F25J13-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18F27J13-I/ML 最大額定值與電氣特性
| Core Architecture | PIC18 8-bit RISC (Harvard) |
| Program Memory (Flash) | 128 KB (64K x 16) |
| Data RAM | 4 KB |
| 最大時脈頻率 | 48 MHz |
| MIPS (Peak) | 12 MIPS |
| Supply Voltage Range | 2.15 V to 3.6 V (XLP mode); 4.2 V to 5.5 V (extended) |
| I/O Pins | 25 |
| ADC | 12-bit, up to 13 channels |
| 封裝 | QFN-28 (ML) 6x6 mm |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +85C (Industrial, -I suffix) |
| Low-Power Technology | nanoWatt XLP with deep-sleep mode |
| Communication Interfaces | UART, SPI, I2C |
| Timers/PWM | Multiple 8/16-bit timers with PWM |
| RoHS 狀態 | Compliant |
PIC18F27J13-I/ML 腳位配置
| 腳位 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| 腳位 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| 腳位 3 | RA2/AN2/VREF- — Digital I/O / Analog input channel 2 / ADC VREF- |
| 腳位 4 | RA3/AN3/VREF+ — Digital I/O / Analog input channel 3 / ADC VREF+ |
| 腳位 5 | RA4/AN4 — Digital I/O / Analog input channel 4 |
| 腳位 6 | RA5/AN5 — Digital I/O / Analog input channel 5 |
| 腳位 7 | RA6 — Digital I/O |
| 腳位 8 | RA7 — Digital I/O |
| 腳位 9 | VSS — Ground reference |
| 腳位 10 | VDD — Positive power supply |
| 腳位 11 | RB0/INT0 — Digital I/O / External interrupt 0 |
| 腳位 12 | RB1/INT1 — Digital I/O / External interrupt 1 |
| 腳位 13 | RB2 — Digital I/O |
| 腳位 14 | RB3 — Digital I/O |
| 腳位 15 | RB4 — Digital I/O |
| 腳位 16 | RB5 — Digital I/O |
| 腳位 17 | RB6/PGC — Digital I/O / ICSP clock |
| 腳位 18 | RB7/PGD — Digital I/O / ICSP data |
| 腳位 19 | VSS — Ground reference |
| 腳位 20 | VDD — Positive power supply |
| 腳位 21 | RC0 — Digital I/O |
| 腳位 22 | RC1 — Digital I/O |
| 腳位 23 | RC2 — Digital I/O |
| 腳位 24 | RC3 — Digital I/O |
| 腳位 25 | RC4 — Digital I/O |
| 腳位 26 | RC5 — Digital I/O |
| 腳位 27 | RC6 — Digital I/O |
| 腳位 28 | RC7 — Digital I/O |
典型應用
PIC18F27J13-I/ML 適用於 6 應用s: Low-Power IoT Sensor Nodes, Industrial Sensor Interfaces, Consumer HMI Controllers, Portable Medical Monitoring, Battery Chargers & Power Management, Automotive Body Electronics (Non-Safety).
Low-Power IoT Sensor Nodes
The PIC18F27J13-I/ML fits IoT sensor nodes because its nanoWatt XLP deep-sleep mode draws nanoamp-level standby current, directly extending battery life in always-on wireless sensors. Its 128 KB Flash accommodates Zigbee, LoRaWAN, or BLE stack libraries without external memory, while 4 KB RAM handles modest buffering of sensor reads. Placed as the main MCU on a coin-cell or Li-ion powered PCB, the chip operates from 2.15 V to 3.6 V, eliminating the need for a boost regulator. Compared to Cortex-M0+ alternatives, the 8-bit PIC18 core simplifies firmware development for simple periodic-sampling applications such as temperature, humidity, or motion sensors.
推薦
Industrial Sensor Interfaces
Industrial sensor interfaces benefit from the PIC18F27J13-I/ML's 12-bit ADC with up to 13 input channels, providing accurate conversion of analog transducer signals such as strain gauges, RTDs, and pressure sensors. The 12 MIPS throughput handles linearization math and Modbus RTU framing on UART in real time. With -40C to +85C industrial temperature rating, the MCU operates reliably in factory automation panels and field instrumentation. Compared to 10-bit ADC MCUs, the extra 2 bits of resolution reduce calibration effort in precision measurement loops such as load-cell weighing or flow metering.
推薦
Consumer HMI Controllers
Consumer human-machine interface (HMI) controllers use the PIC18F27J13-I/ML because its 128 KB Flash stores small graphical libraries, button debouncing tables, and menu state machines for appliances and toys. The 4 KB RAM is sufficient for character-LCD frame buffers and short animation sequences. Operating from 2.15 V to 3.6 V, the MCU can run directly from two AA cells in cost-sensitive consumer products. Compared to lower-end PIC16 parts, the PIC18F27J13-I/ML provides the headroom to add UART/SPI/I2C peripherals for touch or LED driver ICs without firmware compromise.
推薦
Portable Medical Monitoring
Portable medical monitoring devices such as pulse oximeters, blood-pressure cuffs, and glucose meters leverage the PIC18F27J13-I/ML's combination of low-power deep-sleep, accurate 12-bit ADC for sensor signal acquisition, and ample code space for medical algorithms. The wide 2.15 V to 3.6 V operating range supports direct Li-ion or 2xAA battery operation, extending field-use runtime. Compared to 5V-only MCUs, the lower minimum supply voltage reduces battery-pack complexity in portable designs.
推薦
Battery Chargers & Power Management
Battery charger and power-management subsystems use the PIC18F27J13-I/ML as a supervisory controller for charging profiles, cell-balancing algorithms in multi-cell packs, and user interface feedback (LEDs, beeps). Its 25 I/O pins support multiple status LEDs, sense inputs for current/voltage monitoring via the 12-bit ADC, and PWM control of switching FETs. The XLP deep-sleep mode keeps idle current under 100 nA, preserving battery shelf life. Compared to dedicated charger ICs, this MCU allows flexible programmable charging curves via firmware updates.
推薦
Automotive Body Electronics (Non-Safety)
Non-safety automotive body electronics such as interior lighting controllers, seat-position memory modules, and mirror-adjustment systems use the PIC18F27J13-I/ML in non-safety subsystems where AEC-Q100 is not required. The -40C to +85C industrial temperature range covers cabin-environment conditions, while the 12-bit ADC reads potentiometer positions and current-sensing shunts. For safety-critical applications, designers should instead select AEC-Q100 qualified parts from the PIC18F K-series Q84 family. The 128 KB code space supports CAN/LIN stack libraries for body networking.
推薦
推薦產品摘要
工程參考資料，適用於 PIC18F27J13-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC18F26J13-I/ML | PIC18F26J53-I/ML | PIC18F27J13T-I/ML | PIC18F26J13T-I/ML | PIC18F25J13-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-28 (6x6 mm) | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same |
| Flash Memory | 128 KB | 64 KB | 64 KB | 128 KB | 64 KB | 32 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Max Clock Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| ADC | 12-bit, 13 ch | 12-bit, 13 ch | 12-bit, 13 ch | 12-bit, 13 ch | 12-bit, 13 ch | 12-bit, 13 ch |
| USB 2.0 OTG | No | No | Yes | No | No | No |
| Supply Voltage | 2.15-3.6 V / 4.2-5.5 V ext | 2.15-3.6 V / 4.2-5.5 V ext | 2.15-3.6 V / 4.2-5.5 V ext | 2.15-3.6 V / 4.2-5.5 V ext | 2.15-3.6 V / 4.2-5.5 V ext | 2.15-3.6 V / 4.2-5.5 V ext |
主要差異化特點
- Largest Flash in PIC18F27J13 QFN-28 family (對比PIC18F26J13-I/ML)
- No USB peripheral, more I/O for non-USB designs (對比PIC18F26J53-I/ML)
- Wider 2.15-3.6 V supply range supports Li-ion direct connection (對比PIC18F25J13-I/ML)
設計說明
Place a 100 nF decoupling capacitor as close as possible to each VDD pin (pins 10 and 20) and a single bulk 10 uF tantalum or aluminum-polymer capacitor near the chip. For battery-powered designs targeting nanoWatt XLP deep-sleep, also place a 1 nF bypass on the MCLR/VPP pin to suppress noise that could wake the MCU unexpectedly. The PIC18F27J13 draws under 100 nA in deep-sleep mode, but improper decoupling can introduce spikes that appear as wake-up events.
The QFN-28 (6x6 mm) package has an exposed thermal pad that MUST be soldered to a PCB land of at least the same size as the pad itself, with thermal vias to an inner ground plane for heat dissipation. Skipping the thermal pad solder connection will cause the part to overheat at sustained loads and may lead to intermittent brown-out resets. QFN packages are also more sensitive to PCB flex than QFP, so place the MCU away from board edges, mounting screws, and high-stress connector regions.
Ensure the ICSP programming pins RB6/PGC (pin 17) and RB7/PGD (pin 18) are accessible in your layout - if your PCB design uses these pins for application functions, add 4.7 kohm pull-ups or test points so the programmer can drive them. The MCLR reset pin should NOT be left floating; tie it to VDD through a 10 kohm resistor or use the internal MCLR configuration in the configuration bits. Lastly, verify the CONFIG bits for the oscillator mode and watchdog timer before locking the firmware, as these settings cannot be changed without a programmer.
合規資訊
RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified; for automotive designs use AEC-Q100 qualified siblings like PIC18F26K83-I/SS or PIC18F26Q84-I/SP.
