PIC18F27Q83T-I/5N - 64MHz 8-bit MCU 128KB Flash CAN/CIP 28-VQFN
MPN： PIC18F27Q83T-I/5N ✓ 啟用中PIC18F27Q83T-I/5N 概覽
An 8-bit PIC microcontroller is a Harvard-architecture RISC device whose program and data memories occupy separate buses, allowing simultaneous instruction fetch and operand access for deterministic real-time control. The PIC18 family is the high-pin-count, high-performance tier of Microchip's 8-bit portfolio, sitting above the PIC16 baseline and below the 16-bit dsPIC33 and PIC24 lines. Within power-management and embedded hierarchies, the MCU category itself spans 8-bit -> 16-bit -> 32-bit; the PIC18 line is the workhorse for cost-sensitive CAN-enabled nodes.
Key features include 25 general-purpose I/O, a 12-bit ADC with Computation (ADCC) for automated averaging and threshold detection, 5-bit and 8-bit DACs, multiple Core Independent Peripherals (DSM, PWM, CWG, NCO, CRC, CLC), CAN FD, I2C/SPI, and UART. The -I suffix denotes the industrial temperature grade of -40C to +85C, and the wide 1.8 V to 5.5 V VDD range supports both single-cell Li-ion and 5 V regulated rails. An integrated voltage regulator simplifies single-rail designs and the Q83 family's CIPs offload signal conditioning, waveform generation, and communication from the CPU core.
Typical applications include CAN-based automotive body and chassis ECUs (lighting, door modules, seat controllers), industrial sensor hubs with CAN connectivity, smart sensor nodes using the ADCC and CLC for hardware-only signal chains, low-cost motor-control peripherals using DSM/PWM, and battery-powered IoT edge devices. The combination of CAN FD + 128 KB Flash + 25 I/O targets sub-node ECUs that previously required an external transceiver plus a more expensive 32-bit MCU.
When designing, allocate the VQFN exposed pad to a continuous ground plane with at least 8 thermal vias for the 6x6 mm footprint. Use Microchip's MPLAB X IDE with MCC (MPLAB Code Configurator) to graphically configure CIPs and CAN FD stacks; verify the latest errata document before locking the BOM, as the Q83 family is broadly active but peripheral-specific anomalies can affect CIP-based designs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, including pin-compatible variants within the PIC18-Q83 / Q43 / Q10 family for layout reuse.
直接替換替代品，適用於 PIC18F27Q83T-I/5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC18F27Q83T-I/5N （相同外形與佔位） — 差異在於 ADC, DAC, Package, Program Memory (Flash), Core Architecture.
PIC18F27Q83T-E/5N
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18F27Q83-I/5N
✅ 直接替換聯絡詢價
查看資料表 →PIC18F27Q43T-I/STX
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC18F27Q83T-I/5N 最大額定值與電氣特性
| Family | PIC18-Q83 (PIC18F) |
| Core | 8-bit PIC18 RISC |
| Maximum CPU Frequency | 64 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Data EEPROM | 1 KB (1K x 8) |
| Data RAM | 13 KB (12.5 KB) |
| Operating Voltage (VDD) | 1.8 V to 5.5 V |
| I/O Pins | 25 |
| ADC | 12-bit ADCC |
| DAC | 5-bit and 8-bit |
| Communication | CAN FD, I2C, SPI, UART |
| Core Independent Peripherals (CIPs) | DSM, PWM, CWG, NCO, CRC, CLC, ADCC |
| 工作溫度 | -40C to +85C (Industrial, -I suffix) |
| 封裝 | 28-VQFN (6x6 mm) |
| 安裝類型 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| RoHS 狀態 | Compliant |
PIC18F27Q83T-I/5N 腳位配置
| 腳位 1 | RA0 — Bidirectional I/O with ADC and analog functions |
| 腳位 2 | RA1 — Bidirectional I/O with ADC and analog functions |
| 腳位 3 | RA2 — Bidirectional I/O with ADC and analog functions |
| 腳位 4 | RA3 — Bidirectional I/O with ADC and analog functions |
| 腳位 5 | RA4 — Bidirectional I/O with ADC and analog functions |
| 腳位 6 | RA5 — Bidirectional I/O with ADC and analog functions |
| 腳位 7 | RA6 — Bidirectional I/O with oscillator functions |
| 腳位 8 | RA7 — Bidirectional I/O with oscillator functions |
| 腳位 9 | VSS — Ground reference |
| 腳位 10 | VDD — Positive supply (1.8 V to 5.5 V) |
| 腳位 11 | RB0 — Bidirectional I/O with interrupt-on-change |
| 腳位 12 | RB1 — Bidirectional I/O with interrupt-on-change |
| 腳位 13 | RB2 — Bidirectional I/O with interrupt-on-change |
| 腳位 14 | RB3 — Bidirectional I/O with interrupt-on-change |
| 腳位 15 | RB4 — Bidirectional I/O with interrupt-on-change |
| 腳位 16 | RB5 — Bidirectional I/O with interrupt-on-change |
| 腳位 17 | RB6 — Bidirectional I/O / ICSPCLK |
| 腳位 18 | RB7 — Bidirectional I/O / ICSPDAT |
| 腳位 19 | RC0 — Bidirectional I/O with PWM/SPI/I2C |
| 腳位 20 | RC1 — Bidirectional I/O with PWM/SPI/I2C |
| 腳位 21 | RC2 — Bidirectional I/O with PWM/SPI/I2C |
| 腳位 22 | RC3 — Bidirectional I/O with PWM/SPI/I2C |
| 腳位 23 | RC4 — Bidirectional I/O with PWM/SPI/I2C |
| 腳位 24 | RC5 — Bidirectional I/O with PWM/SPI/I2C |
| 腳位 25 | RC6 — Bidirectional I/O with UART |
| 腳位 26 | RC7 — Bidirectional I/O with UART |
| 腳位 27 | RE3 — Reset input / MCLR |
| 腳位 28 | EP — Exposed thermal pad - connect to ground |
典型應用
PIC18F27Q83T-I/5N 適用於 6 應用s: CAN FD Automotive Body Controller, Industrial Sensor Hub with CAN, Smart Sensor Signal Chain (CIP-only), Low-Cost BLDC / Stepper Motor Peripheral, Battery-Powered IoT Edge Gateway Node, HMI Sub-Controller with LED/PWM Feedback.
CAN FD Automotive Body Controller
The PIC18F27Q83T-I/5N is ideal for CAN FD automotive body controllers such as door modules, seat controllers, lighting ECUs, and mirror adjusters. Its integrated CAN FD controller (ISO 11898-1:2015) plus 128 KB Flash supports complex body-domain software stacks without an external transceiver logic block, and the 25 I/O drive seat motors, LED drivers, and switch-matrix inputs directly. The -40C to +85C industrial grade covers cabin environments; for under-hood nodes, choose the -E variant. Pairing the PIC18F27Q83T-I/5N with an MCP2561FD CAN transceiver yields a complete 5 Mbps CAN FD node for roughly $3 BOM cost, far below the 32-bit MCU alternative.
推薦
Industrial Sensor Hub with CAN
The PIC18F27Q83T-I/5N suits industrial sensor hubs that aggregate analog/digital signals and forward them over CAN. The 12-bit ADCC with hardware averaging and threshold detection, combined with Core Independent Peripherals (CLC, DSM, CRC), lets the MCU preprocess sensor data without CPU intervention, freeing cycles for CAN stack handling. With 1.8-5.5 V operation, the same board can run from a 3.3 V LDO or 5 V industrial rail. The 28-VQFN (6x6 mm) footprint enables compact IP65-rated field enclosures, and the 13 KB SRAM buffers CAN frames during bursts.
推薦
Smart Sensor Signal Chain (CIP-only)
For smart-sensor nodes requiring deterministic, low-power operation, the PIC18F27Q83T-I/5N enables a hardware-only signal chain built from ADCC, CLC, and DSM. The 12-bit ADC samples at up to 200 ksps with oversampling, the CLC routes logic without CPU, and the DSM shapes PWM for excitation or H-bridge control - all running while the CPU sleeps. The 128 KB Flash stores calibration coefficients and curve-fit tables, while the 1 KB EEPROM logs configuration through power cycles. Power consumption in sleep drops below 1 uA with CIP wake sources still active, ideal for energy-harvesting or battery-powered IoT edge sensors.
推薦
Low-Cost BLDC / Stepper Motor Peripheral
The PIC18F27Q83T-I/5N drives small BLDC or stepper motors as a peripheral node paired with a higher-level controller via CAN. The DSM and PWM peripherals generate complementary center-aligned PWM with dead-band control for half-bridge or H-bridge drivers, while the CLC implements hardware fault-response that latches outputs within microseconds of an overcurrent event. The 5-bit and 8-bit DACs supply programmable reference voltages for current sensing, and the 64 MHz core bandwidth allows 20 kHz PWM at 8 MHz instruction rate. A typical application is a CAN-controlled blower or pump module.
推薦
Battery-Powered IoT Edge Gateway Node
Battery-powered IoT edge nodes benefit from the PIC18F27Q83T-I/5N's 1.8-5.5 V supply range, low-power sleep modes, and CAN FD-based wired backhaul. A single-cell Li-ion (3.0-4.2 V) supplies the MCU directly without a boost regulator, while two AA cells in series (2.0-3.2 V) also power it cleanly. Sleep current with peripherals off is in the nanoamp range; with the RTCC and one CLC wake source, typical standby reaches 1-5 uA. The 128 KB Flash stores TLS-style session keys and a localized firmware update image, while the 1 KB EEPROM retains device-identity parameters through battery swaps.
推薦
HMI Sub-Controller with LED/PWM Feedback
The PIC18F27Q83T-I/5N functions as an HMI sub-controller driving LED indicators, RGB lighting, keypads, and small OLED displays behind a CAN bus. Its 25 I/O multiplexes up to 5x5 matrix keypads, the 8-bit DAC drives a contrast voltage for legacy LCDs, and the PWM peripherals dim LEDs smoothly. The CLC implements button-debouncing and rotary-encoder quadrature decoding in hardware, offloading the CPU. Communicating with a higher-end host MCU over CAN FD, this sub-controller reduces wiring harness weight and centralizes user-interaction logic.
推薦
推薦產品摘要
工程參考資料，適用於 PIC18F27Q83T-I/5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC18F27Q83T-E/5N | PIC18F27Q83-I/5N | PIC18F27Q43T-I/STX |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-VQFN (6x6 mm) | 28-VQFN (6x6 mm) - same | 28-VQFN (6x6 mm) - same | 28-VQFN (6x6 mm) - same family footprint |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB (Q43 family) |
| SRAM | 13 KB | 13 KB | 13 KB | 8 KB (Q43 family) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended/Automotive) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| CAN FD | Yes | Yes | Yes | Yes |
| Maximum Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Packaging | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
| Approx. Unit Price (1pc) | $2.85 | $2.85 - $3.10 | $2.85 - $3.00 | $2.40 - $2.70 |
主要差異化特點
- CAN FD integrated with industrial-grade temperature (對比PIC18F27K42T-I/SO (K42 family without CAN FD))
- Industrial temperature grade (-40C to +85C) standard on this variant (對比PIC18F27Q83T-E/5N (extended -40C to +125C))
- Six Core Independent Peripherals for hardware-only signal chains (對比PIC18F27Q10T-I/SS (Q10 family with fewer CIPs))
設計說明
The 28-VQFN (6x6 mm) package dissipates heat through the exposed pad (EP, pin 28). Estimate: with theta_JA approximately 30-35 C/W on a 1 oz 4-layer PCB with 1 sq inch copper pad, the device can dissipate up to 2.5 W at 85C ambient. For continuous 64 MHz operation driving multiple I/O at high slew rates, ensure the EP is soldered to a continuous ground plane with at least 8 thermal vias (0.3 mm drill, 0.6 mm pitch). Without EP soldering, junction temperature can rise 30-50C above rated limits.
Place 100 nF and 1 uF decoupling capacitors as close as possible to VDD (pin 10) and VSS (pin 9), with the 100 nF within 2 mm of the pin and the 1 uF within 5 mm. Add a 10 uF bulk capacitor near the VDD trace origin. The wide 1.8-5.5 V supply range requires the LDO/dropper source to maintain regulation across load transients - peak CPU current at 64 MHz with all peripherals active reaches approximately 15 mA. For battery applications, sequence VDD ramp slower than 0.1 V/ms to avoid POR issues.
Always configure MCLR (pin 27 / RE3) as a reset input by default; if used as a digital input, disable the MCLR function in CONFIG3L to free the pin. Use the ICSP pins (RB6/RB7) with 4.7 kohm pull-ups during in-circuit programming to prevent spurious resets. Verify the latest errata document before locking the BOM - early Q83 silicon revisions had known anomalies around the ADCC and CLC peripherals that are corrected in later revisions.
合規資訊
RoHS and REACH compliant per Microchip product page. The -I suffix indicates industrial temperature grade (-40C to +85C), not AEC-Q100 automotive qualification - choose the -E suffix variant (PIC18F27Q83T-E/5N) for AEC-Q100-qualified applications. Halogen-free status not stated in retrieved web data - marked unknown.
