PIC24F08KA101-E/SS - 16-Bit 32MHz XLP Microcontroller | Microchip
MPN： PIC24F08KA101-E/SS ✓ 啟用中PIC24F08KA101-E/SS 概覽
直接替換替代品，適用於 PIC24F08KA101-E/SS — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24F08KA101-E/SS （相同外形與佔位） — 差異在於 I/O Pins, Package.
PIC24F08KA101-I/SS
✅ 直接替換聯絡詢價
查看資料表 →PIC24F08KA101-E/SS 最大額定值與電氣特性
| Architecture | 16-bit PIC microcontroller |
| Program Memory | 8 KB flash (2.75K x 24) |
| RAM | 1.5 KB (1.5K x 8) |
| Maximum CPU Frequency | 32 MHz |
| I/O Pins | 18 |
| 封裝 | 20-pin SSOP |
| 安裝類型 | Surface mount |
| Oscillator | Internal |
| Low-Power Technology | XLP eXtreme Low Power |
| Deep-Sleep Features | DSBOR, DSWDT, RTCC |
| Serial EEPROM | 512 bytes |
| ADC | 1 ADC |
| Packaging | Tube |
| Manufacturer | Microchip Technology |
PIC24F08KA101-E/SS 20-pin ssop 腳位配置指南
PIC24F08KA101-E/SS（20-pin ssop 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC24F08KA101-E/SS.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC24F08KA101-E/SS 適用於 6 應用s: Battery-powered Sensor Node, Portable Environmental Monitor, Industrial Control Module, Low-Power Data Logger, Smart Home Sensor Interface, Compact Power-Supply Controller.
Battery-powered Sensor Node
PIC24F08KA101-E/SS fits compact battery-operated sensor nodes because its XLP design targets low active and sleep consumption, while the 16-bit processor provides more control capability than an 8-bit MCU. The 8 KB flash memory stores application firmware, 1.5 KB RAM supports short acquisition and processing buffers, and 18 I/O pins connect sensors and indicators. Firmware can use DSBOR, DSWDT, and RTCC to coordinate low-power states and reliable wake-up behavior. The principal design trade-off is that actual battery life depends on duty cycle, sensor current, active processor time, and the external regulator, so developers should measure the complete load profile rather than relying on MCU current alone.
推薦
Portable Environmental Monitor
The PIC24F08KA101-E/SS is appropriate for portable temperature, humidity, and environmental monitoring products because it combines 32 MHz processing, one ADC, 18 I/O pins, and XLP low-power features in a 20-pin SSOP. The MCU can sample sensors, perform threshold decisions, and store state in flash while spending much of its operating life in a low-power mode. The 16-bit architecture improves arithmetic efficiency for compensation and filtering, while DSBOR and DSWDT support safer behavior during low-battery conditions. Product teams must still verify the ADC accuracy and voltage range required by their sensors and should account for the current drawn by the sensor, regulator, status indicator, and communication module.
推薦
Industrial Control Module
PIC24F08KA101-E/SS can serve as the control core in a compact industrial module requiring deterministic peripheral handling and low standby consumption. Its 32 MHz maximum operating speed and 16-bit architecture support responsive control tasks, while 18 I/O pins provide interfaces for sensors, digital inputs, indicators, and actuators. The XLP feature set helps modules reduce power during idle periods, especially in distributed equipment where continuous mains connectivity is undesirable. Temperature-grade selection is critical: the verified I/SS comparison reaches 125°C, whereas the E/SO comparison reaches 85°C. Engineers should confirm the exact E/SS limits and use isolation, surge protection, and suitable industrial connectors where the environment requires them.
推薦
Low-Power Data Logger
PIC24F08KA101-E/SS is well suited to a low-power data logger because 8 KB flash provides embedded firmware storage, 1.5 KB RAM can hold acquisition buffers, and the XLP architecture supports duty-cycled operation. The 18 available I/O pins can accommodate an I2C or SPI sensor, a serial memory interface, a real-time-clock connection, and a status indicator, subject to the device's verified peripheral assignments. DSWDT supports supervised recovery from unexpected stalls, while DSBOR assists controlled behavior as the supply declines. For reliable records, firmware should timestamp events and commit data in a way that respects flash endurance. The exact write timing, retention, and cycle characteristics must be taken from the Microchip datasheet.
推薦
Smart Home Sensor Interface
PIC24F08KA101-E/SS can act as a dedicated low-power interface between analog sensors and a home or building network. The one ADC supports analog measurement, the 18 I/O pins provide sensor and communication connections, and the 16-bit core can perform filtering and threshold logic before forwarding compact data. XLP operation is valuable in battery-powered nodes because the MCU can remain asleep between updates, reducing the load compared with a continuously active general-purpose processor. A practical implementation should define the communication duty cycle, isolate noisy actuators from sensitive measurement traces, and ensure the external regulator remains efficient at light loads. Network protocol support and exact peripheral multiplexing must be verified against the datasheet before board release.
推薦
Compact Power-Supply Controller
PIC24F08KA101-E/SS can manage a compact power subsystem by monitoring inputs, sequencing rails, controlling indicators, and coordinating fault responses. Its 16-bit architecture and 32 MHz maximum speed provide ample control throughput, while 18 I/O pins can support digital monitoring, enable signals, and status outputs. Low-power XLP modes are useful when the managed system spends long intervals inactive. The MCU should not be treated as a replacement for dedicated analog protection or power-conversion circuitry; instead, it can supervise external converters and react to measured conditions. Engineers must verify ADC input limits, switching-pin behavior, and the available timing functions in the selected package, then provide suitable input filtering and protection on field-connected nodes.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24F08KA101-E/SS — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24F08KA101-I/SS |
|---|---|---|
| Package | 20-pin SSOP | 20-pin SSOP |
| Brand | Microchip Technology | Microchip Technology |
| Architecture | 16-bit PIC microcontroller | 16-bit PIC microcontroller |
| Program Memory | 8 KB flash (2.75K x 24) | 8 KB flash (2.75K x 24) |
| RAM | 1.5 KB (1.5K x 8) | 1.5 KB (1.5K x 8) |
| Maximum CPU Frequency | 32 MHz | 32 MHz |
| I/O Pins | 18 | 18 |
| ADC Count | 1 ADC | 1 ADC |
| Low-Power Features | XLP, DSBOR, DSWDT, RTCC | PIC XLP family device |
主要差異化特點
- Higher-grade temperature option in the verified replacement (對比PIC24F08KA101-E/SS)
- Pin-compatible family configuration (對比PIC24F08KA101-I/SS)
- Low-power system integration (對比PIC24F08KA101-I/SS)
設計說明
Estimate the complete power budget rather than the PIC24F08KA101-E/SS current alone. Include the sensor, regulator quiescent current, communications activity, indicator drive, and leakage paths. Then use the verified XLP, DSBOR, DSWDT, and RTCC features to define the sleep and wake-up strategy. Do not publish a battery-runtime claim until it has been measured with the intended firmware, supply voltage, temperature, and accessory load.
Place the MCU, decoupling capacitors, oscillator components, and programming or debug connections according to the official Microchip pin configuration and layout guidance. Keep analog sensor traces away from switching nodes and high-current paths, and provide a low-impedance ground reference for the ADC. The supplied excerpts do not include the complete pin table or exposed-pad connection details, so verify those points in the manufacturer datasheet before fabrication.
Do not substitute PIC24F08KA101-I/SS solely because the package matches. The verified comparison shows a temperature-grade distinction, and the E/SS device's exact operating limits were not included in the source excerpts. Confirm supply voltage, maximum frequency, ADC limits, temperature range, pin multiplexing, and programming configuration for the exact suffix before approving a drop-in replacement.
The SSOP footprint has closely spaced leads, so inspect the land pattern against the official package drawing rather than relying on a generic SSOP footprint. Verify lead pitch, pin-1 orientation, solder-mask clearance, and the handling of any thermal or exposed pad. Use a qualified assembly process and inspect joints with adequate magnification because incorrect lead alignment can cause intermittent or permanent failures.
合規資訊
The supplied verified excerpts do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than assuming compliance. The -E ordering suffix is identified as a temperature-grade designation, but no specific automotive qualification was provided.
