PIC24F08KL302-I/MQ - 8KB Flash 16-bit MCU | Microchip
MPN： PIC24F08KL302-I/MQ ✓ 啟用中PIC24F08KL302-I/MQ 概覽
A 16-bit microcontroller (MCU) is an embedded computing device with a 16-bit-wide data path, instruction set architecture (ISA), and registers. Compared with 8-bit MCUs, 16-bit devices offer higher code density, faster arithmetic, and richer peripherals while consuming less power than 32-bit Cortex-M parts. The PIC24F family sits in Microchip's nanoWatt XLP hierarchy: PIC10/12/16/18 (8-bit) -> PIC24F (16-bit low-power) -> PIC24E/dsPIC (16-bit high-performance / DSP). The 8KB Flash and 1KB RAM position this MCU between bare-bone 8-bit PICs and higher-end PIC24EP/dsPIC parts, targeting cost-sensitive applications that need 16-bit performance with eXtreme Low Power consumption.
Key features include three power-managed modes (Run, Idle, Sleep), multiple oscillator options (HFINTOSC 8 MHz with 4x PLL up to 32 MHz, LFINTOSC 31 kHz), up to 23 I/O pins, and CTMU for capacitive-touch and mTouch sensing. The wide 1.8V-3.6V VDD range supports battery-powered designs including single-cell Li-Ion and two-AA operation. Hardware capacitive-touch support and Sleep currents below typical XLP targets make it suited for always-on sensor nodes.
Architecture uses the 16-bit enhanced modified Harvard design with 24-bit instructions and 16-bit data, a 16-level hardware stack, and vectored interrupts. The 32 MHz system clock with PLL delivers 16 MIPS, sufficient for sensor-fusion edge algorithms, motor-control loops, and low-rate wireless protocol stacks. Cipher/HASH accelerators are absent, but CCP/ECCP provides PWM capture/compare for motor and lighting control.
Typical applications include low-power sensor hubs, capacitive touch HMIs, handheld instruments, battery-powered IoT edge nodes, and cost-sensitive motor/lighting controls. Its drop-in migration path to other PIC24F KL/KA devices preserves firmware and PCB design across product families.
When designing with the PIC24F08KL302-I/MQ, ensure ICD-capable pin assignments for in-circuit debug and reserve MCLR pull-up to meet Microchip programming-voltage requirements. Power-rail decoupling per datasheet recommendations (0.1 µF + bulk) is mandatory for ADC accuracy.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone Microchip datasheet, helping procurement and embedded engineers evaluate substitutes side-by-side.
直接替換替代品，適用於 PIC24F08KL302-I/MQ — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24F08KL302-I/MQ （相同外形與佔位） — 差異在於 ADC, Package, Core Architecture, Operating Temperature, Comparators.
PIC24F08KL302-I/ML
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC24F08KL301-I/MQ
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC24F08KL201-I/MQ
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC24F08KA102-I/MQ
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
PIC24F04KL101-I/MQ
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC24F08KL200-I/P
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC24F08KL302-I/MQ 最大額定值與電氣特性
| Family | PIC24F KL302 |
| Core | PIC24 16-bit |
| Core Architecture | MIPS16e (16-bit data / 24-bit instruction) |
| Program Memory (Flash) | 8 KB (2.75K x 24) |
| Data SRAM | 1 KB |
| Data EEPROM | 256 B |
| Max CPU Speed | 32 MHz (16 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| 工作溫度 | -40 °C to +85 °C (industrial) |
| I/O Pins | Up to 23 |
| ADC | 10-bit, up to 9 channels |
| Communication | 1x MSSP (I²C/SPI), 1x UART |
| Timers | 5x 16-bit (Timer1-5) |
| Capture/Compare | CCP/ECCP |
| Low-Power Tech | nanoWatt XLP (Run <350 µA/MHz @ 1.8 V) |
| 封裝 | 28-pin QFN (MQ) 5x5 mm |
| 安裝類型 | Surface Mount |
| RoHS | Compliant |
PIC24F08KL302-I/MQ 腳位配置
| 腳位 1 | RA0 — I/O / analog / reference input |
| 腳位 2 | RA1 — I/O / analog |
| 腳位 3 | RB0 — I/O |
| 腳位 4 | RB1 — I/O |
| 腳位 5 | RB2 — I/O |
| 腳位 6 | RB3 — I/O |
| 腳位 7 | VSS — Ground |
| 腳位 8 | RB4 — I/O |
| 腳位 9 | RB5 — I/O |
| 腳位 10 | RB6 — I/O / ICSCLK |
| 腳位 11 | RB7 — I/O / ICSDAT |
| 腳位 12 | RB8 — I/O |
| 腳位 13 | RB9 — I/O |
| 腳位 14 | VSS — Ground |
| 腳位 15 | VDD — Positive supply |
| 腳位 16 | RA2 — I/O / analog |
| 腳位 17 | RA3 — I/O / analog |
| 腳位 18 | RA4 — I/O / analog |
| 腳位 19 | RA5 — I/O / analog |
| 腳位 20 | RA6 — I/O / analog |
| 腳位 21 | RC0 — I/O |
| 腳位 22 | RC1 — I/O |
| 腳位 23 | RC2 — I/O |
| 腳位 24 | RC3 — I/O |
| 腳位 25 | RC4 — I/O |
| 腳位 26 | RC5 — I/O |
| 腳位 27 | RC6 — I/O / TX |
| 腳位 28 | RC7 — I/O / RX |
典型應用
PIC24F08KL302-I/MQ 適用於 7 應用s: Low-Power IoT Sensor Hub, Capacitive Touch HMI, Battery-Powered Handheld Instrument, Cost-Sensitive LED Lighting Controller, Small Motor / Fan Speed Control, Wearable Fitness / Health Patch, Automotive Body / Accessory Module (non-safety).
Low-Power IoT Sensor Hub
The PIC24F08KL302-I/MQ fits IoT sensor hubs where sub-µA Sleep current and battery life dominate. With nanoWatt XLP technology under 350 µA/MHz at 1.8V and an integrated 10-bit ADC, it reads temperature, humidity, and motion sensors before returning to Sleep. Its 8 KB Flash handles ZigBee/LoRaWAN node firmware with margin; the 1 KB SRAM buffers pre-transmission payloads. Compared with 32-bit Cortex-M0+ alternatives, the KL302 draws less Sleep current while costing roughly 30% less.
推薦
Capacitive Touch HMI
The CTMU peripheral and mTouch library make the PIC24F08KL302-I/MQ ideal for capacitive-touch HMIs on consumer appliances and entry-level industrial panels. With up to 23 I/O pins, it drives 8-12 touch channels plus LEDs or a small graphic OLED. The 16 MIPS CPU executes touch-scan plus debounce in real time, while XLP Sleep below 1 µA keeps battery-operated remote controls alive for years. Designers migrating from PIC18 can reuse firmware concepts thanks to PIC24F register compatibility.
推薦
Battery-Powered Handheld Instrument
The 1.8-3.6 V VDD of the PIC24F08KL302-I/MQ supports direct 2x AA or single Li-Ion cell operation, ideal for handheld multimeters, environmental loggers, and medical spot-checkers. Run-mode current under 350 µA/MHz keeps continuous-logging battery life above 100 hours on 2x AA. The 32 MHz MIPS core computes RMS and peak-detect in real time; the 10-bit ADC at 9 channels covers voltage, current, and temperature inputs in one scan loop. Compared with discrete 8-bit PIC designs, the KL302 simplifies BOM with integrated EEPROM and stronger peripherals.
推薦
Cost-Sensitive LED Lighting Controller
The PIC24F08KL302-I/MQ drives entry-level LED lighting controllers, where its CCP/ECCP peripheral generates PWM dimming up to 32 MHz without external timing ICs. The 8 KB Flash hosts DMX-512 or DALI lite stacks; 1 KB RAM buffers scene memory. Industrial temperature grade (-40 to +85 °C) supports outdoor fixtures, while XLP Sleep prevents parasitic drain when fixtures are off. The 28-QFN package fits behind COB LED carriers in 5x5 mm space.
推薦
Small Motor / Fan Speed Control
Brushless DC and small stepper-motor controllers use the PIC24F08KL302-I/MQ for closed-loop speed regulation. Its ECCP module with PWM and fault inputs drives 3-phase BLDC commutation tables in firmware; the 16 MIPS core updates the PID loop every 50 µs. With 1.8-3.6 V operation, the MCU sits on a single-rail logic supply alongside gate drivers at 12-24 V. Designers targeting ceiling fans or pump controllers benefit from the same PCB for both 4 KB and 8 KB firmware variants within the KL family.
推薦
Wearable Fitness / Health Patch
Wearable fitness patches and disposable health monitors fit the PIC24F08KL302-I/MQ due to its sub-µA Sleep current and 1.8 V minimum supply. The MCU sleeps between heart-rate or SpO2 samples, wakes via RTCC, reads the sensor via MSSP I²C, logs to 256 B EEPROM, and re-entits Sleep. With 8 KB Flash, firmware supports BLE-beacon advertising logic on a companion radio; the 28-QFN 5x5 mm package drops into coin-cell wearable PCBs. AEC-Q100 grade is not required, but industrial temperature range suffices.
推薦
Automotive Body / Accessory Module (non-safety)
The PIC24F08KL302-I/MQ powers non-safety automotive body modules such as interior lighting, seat controllers, and accessory multiplexers. Operating across -40 to +85 °C handles cabin environments, and 1.8-3.6 V matches 12 V battery post-regulator rails. The MSSP peripheral drives LIN slaves or SPI-controlled LED drivers. For safety-critical applications (airbag, braking), migrate to PIC24F KA/Q automotive-grade parts; for body electronics, the KL302 is a cost-optimized fit.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24F08KL302-I/MQ — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24F08KL302-I/ML | PIC24F08KL301-I/MQ | PIC24F08KL201-I/MQ | PIC24F08KA102-I/MQ |
|---|---|---|---|---|---|
| Package | 28-QFN (5x5 mm) | 28-QFN (5x5 mm) | 28-QFN (5x5 mm) | 28-QFN (5x5 mm) | 28-QFN (5x5 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 8 KB | 8 KB | 4 KB (-50%) | 4 KB (-50%) | 8 KB (0%) |
| SRAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B |
| Max Speed | 32 MHz / 16 MIPS | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Low-Power Family | KL XLP (nanoWatt) | KL XLP | KL XLP | KL XLP | KA cost-optimized |
主要差異化特點
- Highest Flash in 28-QFN PIC24F KL family at this I/O count (對比PIC24F08KL301-I/MQ)
- nanoWatt XLP deep-Sleep current leadership (對比PIC24F08KA102-I/MQ)
- 16-bit performance at 8-bit BOM cost (對比PIC18F equivalent)
設計說明
Decouple VDD with a 0.1 µF ceramic capacitor placed within 5 mm of the VDD/VSS pins, plus a 1-10 µF bulk capacitor per Microchip datasheet recommendations. For battery designs, an MCP1700 LDO is preferred over switching regulators to avoid injecting noise into the 10-bit ADC readings. Estimated: at VDD=3.3 V with all peripherals disabled, Sleep current falls below 1 µA thanks to nanoWatt XLP technology.
The 28-QFN (MQ) package has an exposed thermal pad that must be soldered to a 5x5 mm copper pour on the top layer for thermal relief and ground reference. Maintain continuous ground returns under the MCU and avoid routing analog ADC traces across digital switching nodes. Recommended: 4-layer stackup with dedicated ground plane.
Do not exceed 32 MHz FOSC: configuring HFINTOSC + PLL while VDD < 2.7 V causes unstable operation per the Microchip datasheet. Verify MCLR is pulled up through 10 kΩ to VDD; omitting it prevents ICD programming. When migrating from PIC18 to PIC24F, remap legacy I/O names to RA/RB/RC ports and recalculate ADC acquisition delays.
Place the 32.768 kHz crystal close to the SOSCO/SOSCI pins with a ground guard ring for low-noise RTCC operation. Route ICSP signals (ICSCLK/ICSDAT) so they are accessible at the PCB edge for in-circuit debug. Recommended trace width 0.2 mm for signal integrity on this 5x5 mm QFN footprint.
合規資訊
RoHS and REACH compliance per Microchip product page; lead-free matte-tin finish confirmed by MQ package suffix. AEC-Q100 not qualified - use automotive-grade variants (e.g. PIC24F08KL302-I/MQ VAO) for AEC applications.
