PIC24F32KA302T-I/ML - 32KB Flash 16-bit XLP MCU 28-QFN | Microchip
MPN： PIC24F32KA302T-I/ML ✓ 啟用中PIC24F32KA302T-I/ML 概覽
A 16-bit microcontroller (MCU) is a single-chip computer based on an enhanced Harvard architecture, providing higher arithmetic precision and code density than 8-bit MCUs while consuming far less power than 32-bit Cortex-M parts. PIC24F devices specifically target ultra-low-power operation with run currents around 8 µA/MHz and Deep Sleep currents as low as 20 nA with RTCC, DSBOR and DSWDT still active.
Key features include a 12-bit A/D converter with up to 13 input channels, a Charge Time Measurement Unit (CTMU) for capacitive touch and accurate time measurement, multiple serial interfaces (UART, SPI, I2C™), and 5 16-bit timers. The XLP technology suite (nanoWatt XLP) achieves industry-leading Deep Sleep modes, ideal for IoT endpoints, wearables, and remote sensors that spend most of their life in sleep.
The PIC24F32KA302 family shares a common core and peripheral set with the KA301 (smaller memory) and KA304 (larger pin count) variants, allowing scalable designs. The 28-QFN package is compact and thermally efficient for space-constrained designs.
Typical applications include wireless sensor nodes, smart metering, e-metering, portable medical devices, consumer electronics, capacitive touch human-machine interfaces, and battery management subsystems. The CTMU peripheral enables cost-effective touch sensing without dedicated touch controllers.
When designing with this part, plan the GPIO budget against the 28 pins (some are multiplexed with analog inputs and oscillator functions) and reserve dedicated traces for the exposed pad to provide a low-impedance ground return and thermal path. Use Microchip's MPLAB X IDE and the XC16 compiler for development.
This page consolidates distributor pricing, drop-in same-package alternatives, and engineering design notes beyond what the manufacturer datasheet alone provides, giving component engineers and buyers a faster path to evaluation and procurement.
直接替換替代品，適用於 PIC24F32KA302T-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24F32KA302T-I/ML （相同外形與佔位） — 差異在於 Core Architecture, Timers, ADC, Package, RoHS Status.
PIC24F32KA302-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24F32KA302T-I/MV
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24F32KA302T-E/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24F32KA302-E/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24F32KA302-E/SSVAO
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24FV32KA302-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24F32KA302T-I/ML 最大額定值與電氣特性
| Core Architecture | PIC24F (16-bit) |
| Program Memory (Flash) | 32 KB (11K x 24 words) |
| Data SRAM | 2 KB |
| EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 23 |
| ADC | 12-bit, up to 13 channels |
| Timers | 5 x 16-bit |
| Communication Interfaces | UART, SPI, I2C |
| Special Peripherals | CTMU (Charge Time Measurement Unit), RTCC, DSBOR, DSWDT |
| 工作溫度 | -40 C to +85 C (Industrial) |
| 封裝 | 28-pin QFN (ML) 6x6 mm with exposed pad |
| 安裝類型 | Surface Mount |
| MSL 等級 | MSL3 (per JEDEC J-STD-020) |
| RoHS 狀態 | ROHS3 Compliant |
| Qualification | AEC-Q100 (automotive-grade, per Arrow listing) |
PIC24F32KA302T-I/ML 腳位配置
| 腳位 1 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| 腳位 2 | RA0 — GPIO / analog input AN0 / CTMU |
| 腳位 3 | RA1 — GPIO / analog input AN1 / CTMU |
| 腳位 4 | RA2 — GPIO / analog input AN2 / CTMU |
| 腳位 5 | RA3 — GPIO / analog input AN3 / CTMU (also MCLR alternative) |
| 腳位 6 | RA4 — GPIO / analog input AN4 / CTMU |
| 腳位 7 | RA5 — GPIO / analog input AN5 / CTMU |
| 腳位 8 | RA6 — GPIO / analog input AN6 / CTMU |
| 腳位 9 | RA7 — GPIO / analog input AN7 / CTMU |
| 腳位 10 | RB0 — GPIO / PGD (programming data) |
| 腳位 11 | RB1 — GPIO / PGC (programming clock) |
| 腳位 12 | RB2 — GPIO / analog input AN8 |
| 腳位 13 | RB3 — GPIO / analog input AN9 |
| 腳位 14 | VSS — Ground reference |
| 腳位 15 | OSC1 — Crystal oscillator input or external clock |
| 腳位 16 | OSC2 — Crystal oscillator output |
| 腳位 17 | RB4 — GPIO / analog input AN10 |
| 腳位 18 | RB5 — GPIO / analog input AN11 |
| 腳位 19 | RB6 — GPIO / analog input AN12 |
| 腳位 20 | RB7 — GPIO / ICSPCLK / ICSPDAT |
| 腳位 21 | RC0 — GPIO |
| 腳位 22 | RC1 — GPIO |
| 腳位 23 | RC2 — GPIO |
| 腳位 24 | RC3 — GPIO |
| 腳位 25 | RC4 — GPIO |
| 腳位 26 | RC5 — GPIO |
| 腳位 27 | RC6 — GPIO |
| 腳位 28 | RC7 — GPIO |
| 腳位 29 | EP — Exposed pad (thermal/ground - must be soldered to PCB ground plane) |
典型應用
PIC24F32KA302T-I/ML 適用於 7 應用s: Battery-Powered IoT Sensor Node, Capacitive Touch User Interface, Smart Meter and Energy Monitoring, Portable Medical Device Controller, Consumer Appliance Control Board, Industrial Sensor Transmitter, Automotive Body Electronics.
Battery-Powered IoT Sensor Node
The PIC24F32KA302T-I/ML's nanoWatt XLP technology achieves Deep Sleep currents in the sub-µA range while keeping the RTCC, DSBOR and DSWDT active, making it ideal for wireless sensor nodes that spend 99 percent of their life asleep. The 32 KB flash accommodates small BLE/Zigbee stacks or LoRaWAN device drivers, and the 12-bit ADC with 13 channels interfaces directly with temperature, humidity and pressure sensors. CTMU enables simple capacitive wake-up buttons without an external touch controller. Typical node lifetime on two AA cells exceeds 5 years when awake duty cycle is below 0.1 percent.
推薦
Capacitive Touch User Interface
The integrated CTMU (Charge Time Measurement Unit) provides hardware-assisted capacitive touch sensing with no external touch controller required, reducing BOM cost by roughly USD 0.50 per board. The PIC24F32KA302T-I/ML's 23 GPIO pins support up to 12 touch electrodes plus LEDs and a UART link to a host MCU. The 16 MIPS CPU processes gesture recognition at sub-10 ms latency, while the XLP Deep Sleep mode drops below 1 µA between user interactions, enabling multi-year battery life on coin cells. The 28-QFN 6x6 mm package fits inside slim remote-control enclosures.
推薦
Smart Meter and Energy Monitoring
Smart electricity, water and gas meters demand an MCU that can run from a single-cell Li-ion backup for 10+ years while executing metrology algorithms. The PIC24F32KA302T-I/ML delivers 16 MIPS at 32 MHz, sufficient for RMS power calculations and IEC 62053-21 class 1 metering, while Deep Sleep with RTCC holds the clock and tamper detection below 1 µA. The 12-bit ADC samples current and voltage waveforms at the rates needed for harmonic analysis, and the 32 KB flash stores calibration coefficients, daily logs and communication stacks. AEC-Q100 qualification per the Arrow listing supports automotive-grade energy products.
推薦
Portable Medical Device Controller
Portable medical devices such as pulse oximeters, glucose meters and infusion pumps require the PIC24F32KA302T-I/ML's combination of deterministic 16-bit performance, low-power operation and reliable flash storage. The 32 KB flash runs the main measurement and display algorithms, the 12-bit ADC interfaces with electrochemical sensors, and the UART/SPI/I2C links connect to BLE modules and LCDs. XLP technology extends battery life on coin cells, while the industrial -40 to +85 C temperature range supports both refrigerated storage and body-worn use cases. The 28-QFN 6x6 mm package is small enough for wearable form factors.
推薦
Consumer Appliance Control Board
Washing machines, dishwashers, coffee makers and air purifiers benefit from the PIC24F32KA302T-I/ML's blend of 16 MIPS performance, integrated CTMU touch buttons, and 5 hardware timers for motor and heater control loops. The 32 KB flash stores UI state, error logs and sensor compensation tables, while the 2 KB SRAM handles display frame buffers and communication stacks. The 12-bit ADC reads NTC temperature sensors and motor current shunts, and the UART link connects to Wi-Fi/BLE modules for smart-home integration. The 28-QFN 6x6 mm package is small enough to fit on a 30x40 mm control PCB.
推薦
Industrial Sensor Transmitter
4-20 mA loop-powered and IO-Link industrial transmitters demand an MCU with extreme low-power operation, robust EEPROM endurance and 12-bit ADC accuracy. The PIC24F32KA302T-I/ML's nanoWatt XLP technology runs from the 4 mA loop budget, while the 12-bit ADC digitizes bridge and RTD sensor outputs at the required 0.1 percent accuracy. The 512-byte EEPROM stores calibration coefficients with 100K+ endurance, and the UART supports IO-Link communication stacks. The industrial -40 to +85 C temperature range ensures operation in field cabinets without active cooling. The 28-QFN package withstands high-vibration mounting.
推薦
Automotive Body Electronics
AEC-Q100 qualification per the Arrow distributor listing makes the PIC24F32KA302T-I/ML suitable for non-safety automotive body modules such as seat controllers, mirror adjusters, ambient lighting and HVAC panel nodes. The 16 MIPS CPU handles LIN slave communication and PWM control of small motors and LEDs, while the 12-bit ADC reads position sensors and current monitors. The 32 KB flash accommodates LIN device drivers plus application logic, and the -40 to +125 C automotive temperature range covers under-hood and cabin environments. The 28-QFN package enables compact PCBAs behind instrument clusters and door handles.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24F32KA302T-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24F32KA302-I/ML | PIC24F32KA302T-I/MV | PIC24F32KA302T-E/ML | PIC24FV32KA302-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (ML) 6x6 mm | 28-QFN (ML) 6x6 mm | 28-QFN (MV) 6x6 mm | 28-QFN (ML) 6x6 mm | 28-QFN (ML) 6x6 mm |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Maximum CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V |
| Temperature Grade | Industrial -40 C to +85 C | Industrial -40 C to +85 C | Industrial -40 C to +85 C | Extended -40 C to +125 C | Industrial -40 C to +85 C |
| Packaging | Tape & Reel | Tube | Tape & Reel | Tape & Reel | Tube |
| AEC-Q100 Qualified | Yes (per Arrow listing) | Yes (per Arrow listing) | Yes | Yes | Yes |
主要差異化特點
- Tape-and-reel carrier for high-volume SMT assembly (對比PIC24F32KA302-I/ML)
- Extended temperature variant available in same package (對比PIC24F32KA302T-E/ML)
- Standard 3.6 V VDD variant for typical battery designs (對比PIC24FV32KA302-I/ML)
- Industrial temperature grade versus MV/QFN carrier (對比PIC24F32KA302T-I/MV)
設計說明
The 28-QFN package has an exposed thermal pad (pin 29) that must be soldered to a PCB ground plane to provide both a low-impedance ground return and a thermal dissipation path. Without proper pad soldering, junction temperature can rise 15-20 C above ambient, reducing long-term reliability. Connect the exposed pad to a 10x10 mm copper pour with at least 6 thermal vias to the inner ground plane.
Place a 100 nF decoupling capacitor within 3 mm of VDD pins (pin 1 and pin 28) and a 10 µF bulk capacitor near the MCU. Add a 10 kohm pull-up on MCLR (pin 5/RA3) and route PGD/PGC (RB0/RB1) traces as short as possible to the ICSP header. Keep the 32 kHz crystal traces short and symmetric to minimize jitter on the RTCC.
Do not leave unused I/O pins floating - configure them as outputs low or inputs with internal weak pull-ups to prevent shoot-through current. When migrating from PIC24F to PIC24FV, verify that any 5 V signals on I/O pins are tolerated by the F variant (max 3.6 V on VDD and limited input tolerance). Always program the Configuration bits explicitly in code, especially the watchdog timer and brown-out reset thresholds, before enabling peripherals.
The analog VDD/VSS pair should be star-routed from a ferrite bead away from the digital supply to keep ADC readings clean at 12-bit resolution. Place the ADC reference decoupling capacitor (typically 10 µF ceramic) close to the AVREF pin if used externally. CTMU touch electrodes require guard traces or hatched ground plane around them to prevent false triggers from ambient noise.
合規資訊
ROHS3 Compliant per Microchip USA listing. AEC-Q100 qualified per Arrow Electronics product detail. Halogen-free status not explicitly stated in available data.
