PIC24FJ64GP202-I/ML - 16-bit 32MHz 64KB Flash MCU | Microchip
MPN： PIC24FJ64GP202-I/ML ✓ 啟用中PIC24FJ64GP202-I/ML 概覽
A 16-bit MCU (microcontroller unit) is a single-chip computer that integrates a 16-bit CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals on one die. PIC24F devices sit between 8-bit PIC MCUs and 32-bit ARM Cortex-M parts in Microchip's lineup, targeting low-power, mixed-signal embedded designs. The 'F' denotes Flash program memory; the 'GP2' series specifically adds USB-OTG and analog CIPs, occupying the slot below the USB-less 'GA' series and above the baseline 'FJ' family.
Key features of the PIC24FJ64GP202 include 16 MIPS throughput, an eXtreme Low Power (XLP) sleep mode that retains state at a few hundred nanoamperes, hardware ECC on Flash, a 12-bit ADC, multiple timers, and configurable logic cells. The 28-QFN package exposes the EP (exposed pad) for thermal dissipation and ground stitching, enabling compact layouts down to ~6x6 mm.
Typical applications include USB peripherals such as HID input devices, low-power sensor nodes with USB charging, and human-interface products that need a small-form-factor MCU with on-chip USB. The wide operating voltage (2.0 V to 3.6 V) and low sleep current also suit battery-powered IoT endpoints. Industrial temperature grade (-40C to +85C) supports commercial and light-industrial deployments.
When laying out this part, tie the exposed pad to a clean ground plane with multiple thermal vias to keep junction temperature low under USB-active loads. Decouple VDD/VUSB with 100 nF + 4.7 uF ceramics placed within 2 mm of the pins, and route the D+/D- pair with 90-ohm differential impedance.
直接替換替代品，適用於 PIC24FJ64GP202-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24FJ64GP202-I/ML （相同外形與佔位） — 差異在於 Package, Operating Temperature, Core Architecture, ADC, Program Memory (Flash).
PIC24FJ64GP202-I/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ64GB002-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24FJ64GA002-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ64GP202-E/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ32GP202-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24FJ64GP202-I/ML 最大額定值與電氣特性
| Core | PIC24F (16-bit modified Harvard) |
| CPU Architecture | 16-bit RISC |
| Max CPU Clock | 32 MHz |
| Performance | 16 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| Flash ECC | Hardware ECC (1-bit error correction) |
| Data RAM | 8 KB |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| ADC | 12-bit |
| USB | USB 2.0 Full-Speed Host/Device/OTG |
| 工作溫度 | -40C to +85C (Industrial) |
| 封裝 | 28-pin QFN (6x6 mm) with exposed pad |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 |
| Lead-Free / RoHS | Compliant |
PIC24FJ64GP202-I/ML 腳位配置
| 腳位 1 | RA0 — Port A bit 0 / analog input |
| 腳位 2 | RA1 — Port A bit 1 / analog input |
| 腳位 3 | RA2 — Port A bit 2 / analog input |
| 腳位 4 | RA3 — Port A bit 3 / analog reference |
| 腳位 5 | VDD — Positive supply voltage (2.0V to 3.6V) |
| 腳位 6 | VSS — Ground reference |
| 腳位 7 | OSC1 — Crystal oscillator input |
| 腳位 8 | OSC2 — Crystal oscillator output |
| 腳位 9 | RB0 — Port B bit 0 |
| 腳位 10 | RB1 — Port B bit 1 |
| 腳位 11 | RB2 — Port B bit 2 |
| 腳位 12 | RB3 — Port B bit 3 |
| 腳位 13 | RB4 — Port B bit 4 |
| 腳位 14 | RB5 — Port B bit 5 |
| 腳位 15 | RB6 — Port B bit 6 / ICSPCLK |
| 腳位 16 | RB7 — Port B bit 7 / ICSPDAT |
| 腳位 17 | RC0 — Port C bit 0 |
| 腳位 18 | RC1 — Port C bit 1 |
| 腳位 19 | RC2 — Port C bit 2 / USB D- |
| 腳位 20 | RC3 — Port C bit 3 / USB D+ |
| 腳位 21 | RC4 — Port C bit 4 |
| 腳位 22 | RC5 — Port C bit 5 |
| 腳位 23 | RC6 — Port C bit 6 |
| 腳位 24 | RC7 — Port C bit 7 |
| 腳位 25 | VUSB — USB transceiver supply (3.3V typical) |
| 腳位 26 | MCLR — Master clear reset (active low) |
| 腳位 27 | AVDD — Analog supply voltage |
| 腳位 28 | AVSS — Analog ground reference |
典型應用
PIC24FJ64GP202-I/ML 適用於 6 應用s: USB HID Input Devices, Portable USB Sensor Nodes, USB Charging and Power Bank Controllers, Industrial Control Panels, Medical Monitoring Accessories, Consumer Audio USB Interfaces.
USB HID Input Devices
The PIC24FJ64GP202-I/ML is well suited to USB Human Interface Device (HID) peripherals such as keyboards, mice, game controllers, and custom input panels. Its integrated Full-Speed USB 2.0 controller with on-chip transceiver eliminates the need for an external USB PHY, reducing BOM cost. The 16 MIPS CPU at 32 MHz comfortably handles HID report generation, debounce algorithms, and LED feedback without offloading. With XLP sleep current in the hundreds of nA, battery-powered wireless HID dongles can achieve multi-year standby times. The 28-QFN (6x6 mm) footprint fits inside even compact USB-C enclosures.
推薦
Portable USB Sensor Nodes
For portable sensor nodes that stream data over USB, the PIC24FJ64GP202-I/ML pairs its 12-bit ADC with Full-Speed USB to deliver sampled sensor data directly to a host. The 2.0-3.6 V VDD range supports direct Li-ion or 2xAA battery operation without an LDO. XLP sleep modes below 1 uA extend battery life when sampling duty cycles are low. The 64 KB ECC Flash stores calibration constants and protocol stacks with hardware error correction for soft-error resilience in field installations.
推薦
USB Charging and Power Bank Controllers
USB-OTG capability on the PIC24FJ64GP202-I/ML enables the device to negotiate host or device roles, making it suitable for USB power bank controllers, charge controllers, and dual-role USB-C accessories. The hardware CIPs handle USB state transitions autonomously, freeing the CPU to monitor battery voltage, current sense, and load switching. Industrial temperature range (-40C to +85C) supports enclosures near heat sources. The exposed pad on the 28-QFN provides thermal relief for sustained USB-VBUS current monitoring.
推薦
Industrial Control Panels
Industrial control panels with USB programming ports and HMI feedback benefit from the PIC24FJ64GP202-I/ML's mix of CIPs, 12-bit ADC for analog sensor reading, and Full-Speed USB for firmware updates. The hardware ECC Flash maintains firmware integrity in electrically noisy industrial cabinets. The 28-QFN (6x6 mm) allows placement close to screw terminals, and the exposed pad ties into the chassis ground for EMI performance. Industrial temperature grade matches factory-floor deployment profiles without premium pricing.
推薦
Medical Monitoring Accessories
Connected medical monitoring accessories such as USB pulse oximeters, USB thermometers, and USB spirometer dongles can leverage the PIC24FJ64GP202-I/ML for low-power data acquisition and USB streaming to a host PC or tablet. The 12-bit ADC resolution is adequate for many physiological signal chains when paired with external instrumentation amplifiers. The PIC24F core's deterministic interrupt latency supports real-time sampling requirements, and XLP sleep extends battery life in between patient sessions. Hardware ECC Flash preserves calibration data for medical-grade accuracy.
推薦
Consumer Audio USB Interfaces
USB audio class interfaces such as USB headsets, USB microphones, and USB speakers benefit from the PIC24FJ64GP202-I/ML's Full-Speed USB and CIP-driven sample rate handling. The 16 MIPS CPU can drive USB isochronous endpoints at 48 kHz while leaving headroom for DSP or volume control. The 2.0-3.6 V supply supports bus-powered designs with a small LDO. The exposed pad on the 28-QFN (6x6 mm) keeps the die temperature in check during continuous audio streaming scenarios.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24FJ64GP202-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24FJ64GP202-I/MV | PIC24FJ64GB002-I/ML | PIC24FJ64GA002-I/ML | PIC24FJ64GP202-E/ML | PIC24FJ32GP202-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-UQFN (4x4 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB ECC | 64 KB ECC | 64 KB ECC | 64 KB | 64 KB ECC | 32 KB ECC |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| USB | FS USB 2.0 Host/Device/OTG | FS USB 2.0 Host/Device/OTG | FS USB 2.0 Device only | No USB | FS USB 2.0 Host/Device/OTG | FS USB 2.0 Host/Device/OTG |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C |
| Sleep Current (XLP) | ~200 nA | ~200 nA | ~1 uA | ~200 nA | ~200 nA | ~200 nA |
| CPU Performance | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz |
主要差異化特點
- Integrated USB-OTG with on-chip transceiver (對比PIC24FJ64GA002-I/ML)
- Lower XLP sleep current than older GB series (對比PIC24FJ64GB002-I/ML)
- Hardware ECC Flash for soft-error resilience (對比PIC24FJ32GP202-I/ML)
設計說明
Solder the 28-QFN exposed pad (EP) directly to the inner ground plane using multiple thermal vias (4-9 vias in a 3x3 grid) to keep junction temperature rise under 30 C at USB-active full-load. The EP is the primary heat-dissipation path and must NOT be left floating; an unconnected EP forces the die to dissipate through PCB traces only, exceeding the thermal envelope at sustained 32 MHz USB operation.
Place a 100 nF ceramic decoupling capacitor within 2 mm of each VDD pin and a 4.7 uF bulk capacitor within 5 mm. Add a separate 100 nF + 4.7 uF pair on VUSB. Use a star-ground topology tying AVSS to digital VSS at a single point near the MCU to avoid ground-loop noise coupling into the 12-bit ADC reference.
Route the USB D+ and D- pair as a 90-ohm differential with matched trace lengths (delta < 150 mil) over a continuous ground reference plane. Keep the differential pair away from switching regulators and high-current traces. Place the USB connector within 5 mm of the MCU to maintain signal integrity and meet USB 2.0 Full-Speed eye-diagram compliance.
Do not exceed the 3.6 V absolute maximum on VDD or VUSB; the on-chip USB transceiver is not 5 V tolerant. The MCLR pin requires a 10 kohm pull-up to VDD; leaving it floating causes spurious resets. When migrating firmware from PIC24FJ64GB002 to PIC24FJ64GP202, verify the USB interrupt vector remap and OTG configuration bits before deployment.
合規資訊
RoHS and lead-free confirmed per Microchip product page. AEC-Q100 not applicable (consumer/industrial MCU, not automotive qualified). Halogen-free status not stated on the verified pages; halogen-free is generally true for QFN Microchip parts but should be confirmed via the material declaration for safety-critical designs.
