PIC24FV16KA302-I/ML - 16-bit 32MHz XLP MCU 16KB Flash | Microchip
MPN： PIC24FV16KA302-I/ML ✓ 啟用中PIC24FV16KA302-I/ML 概覽
A 16-bit microcontroller (MCU) is a programmable processor core with 16-bit datapath registers, instruction fetch width, and ALU, allowing efficient C-code execution and DSP-style operations compared to 8-bit MCUs. The PIC24F sits in the hierarchy: microcontroller -> embedded processor -> semiconductor device, and the XLP variant targets ultra-low-power applications through deep-sleep operating modes that retain RAM and peripheral state.
Key features include 17 general-purpose I/O pins, a 12-bit A/D converter with up to 16 input channels, a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement, five 16-bit timers, two UART/SPI/I2C™ modules, and a Real-Time Clock/Calendar (RTCC) that continues incrementing in deep sleep. XLP technology adds features such as Deep Sleep Brown-Out Reset (DSBOR), Deep Sleep Watchdog Timer (DSWDT), and a low-power RTCC drawing microamp-level current for battery-backed timekeeping.
The PIC24FV16KA302-I/ML is built on an enhanced 16-bit modified Harvard architecture with a 24-bit instruction word, single-cycle hardware multiply, and a deterministic interrupt response suitable for real-time control loops. Its wide supply range and 5 V-tolerant I/O allow direct interfacing to legacy 5 V sensors without level shifters, simplifying mixed-voltage designs.
Typical applications include battery-powered IoT sensor nodes, wearable health monitors, energy-harvesting devices, remote controls, low-power wireless sensor hubs, and any general-purpose 16-bit embedded controller where idle current and RTC retention are critical. The CTMU peripheral also enables capacitive touch buttons and sliders.
When designing with this MCU, prioritize using the deep-sleep modes (DSBOR + RTCC) for idle current budgets below 1 µA, place a 0.1 µF decoupling capacitor adjacent to every VDD/VSS pair, and verify trace lengths on the 32 MHz system clock to avoid EMI. Program the configuration bits explicitly to lock the oscillator source and watchdog state for production firmware.
This page consolidates distributor pricing, verified drop-in same-family alternatives, and practical XLP design notes not found in the manufacturer datasheet - designed for engineers comparing Microchip's 16-bit XLP lineup against competing low-power MCUs.
直接替換替代品，適用於 PIC24FV16KA302-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24FV16KA302-I/ML （相同外形與佔位） — 差異在於 Package, Operating Temperature, I/O Pins, ADC, Core Architecture.
PIC24FV16KA302-E/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24F16KA302-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24FV16KA301-I/P
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC24FV16KA302-I/ML 最大額定值與電氣特性
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Family | PIC® XLP™ 24F |
| Device Variant | FV (1.8 V to 3.6 V wide-supply) |
| Maximum CPU Clock | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 16 KB (5.5K x 24 instruction words) |
| Data RAM | 2 KB |
| EEPROM | 512 bytes |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 17 |
| ADC | 12-bit, up to 16 channels |
| Timers | 5 x 16-bit |
| Communication Peripherals | 2 x UART/SPI/I2C™ |
| Special Peripherals | CTMU, RTCC, DSBOR, DSWDT |
| 封裝 | 28-QFN (6x6 mm), code ML |
| 工作溫度 | -40 °C to +85 °C (industrial, "I") |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
PIC24FV16KA302-I/ML 腳位配置
| 腳位 1 | RA0/AN0 — GPIO RA0 / Analog input AN0 |
| 腳位 2 | RA1/AN1 — GPIO RA1 / Analog input AN1 |
| 腳位 3 | RA2/AN2 — GPIO RA2 / Analog input AN2 |
| 腳位 4 | RA3/AN3 — GPIO RA3 / Analog input AN3 |
| 腳位 5 | RA4/AN4 — GPIO RA4 / Analog input AN4 |
| 腳位 6 | RA5/AN5 — GPIO RA5 / Analog input AN5 |
| 腳位 7 | RA6/AN6 — GPIO RA6 / Analog input AN6 |
| 腳位 8 | RA7/AN7 — GPIO RA7 / Analog input AN7 |
| 腳位 9 | VSS — Ground reference |
| 腳位 10 | VDD — Positive supply (1.8 V to 3.6 V) |
| 腳位 11 | RB0/AN8 — GPIO RB0 / Analog input AN8 |
| 腳位 12 | RB1/AN9 — GPIO RB1 / Analog input AN9 |
| 腳位 13 | RB2/AN10 — GPIO RB2 / Analog input AN10 |
| 腳位 14 | RB3/AN11 — GPIO RB3 / Analog input AN11 |
| 腳位 15 | RB4/AN12 — GPIO RB4 / Analog input AN12 |
| 腳位 16 | RB5/AN13 — GPIO RB5 / Analog input AN13 |
| 腳位 17 | RB6/AN14/PGC — GPIO RB6 / Analog input AN14 / ICSP clock |
| 腳位 18 | RB7/AN15/PGD — GPIO RB7 / Analog input AN15 / ICSP data |
| 腳位 19 | RC0 — GPIO RC0 |
| 腳位 20 | RC1 — GPIO RC1 |
| 腳位 21 | RC2 — GPIO RC2 |
| 腳位 22 | RC3 — GPIO RC3 |
| 腳位 23 | RC4 — GPIO RC4 |
| 腳位 24 | RC5 — GPIO RC5 |
| 腳位 25 | RC6 — GPIO RC6 |
| 腳位 26 | RC7 — GPIO RC7 |
| 腳位 27 | VSS — Ground reference |
| 腳位 28 | VDD — Positive supply (1.8 V to 3.6 V) |
典型應用
PIC24FV16KA302-I/ML 適用於 6 應用s: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Industrial Sensor Hub with 5 V Interface, Capacitive Touch User Interface, Remote Control with Sleep Wake-Up, Energy-Harvesting Wireless Sensor.
Battery-Powered IoT Sensor Node
The PIC24FV16KA302-I/ML is ideal for battery-powered IoT sensor nodes where deep-sleep current and RTC retention directly determine battery life. Its XLP technology with RTCC and DSBOR draws microamp-level current in deep sleep while retaining RAM and timekeeping state, allowing year-long operation on a single CR2032 coin cell. The 12-bit ADC handles temperature, humidity, and analog sensor readouts, while the CTMU enables capacitive soil-moisture or proximity-sensing peripherals. With 16 KB Flash and 2 KB RAM, the MCU comfortably runs a protocol stack plus sensor-processing firmware without external memory.
推薦
Wearable Health Monitor
The PIC24FV16KA302-I/ML fits wearable health monitors such as fitness bands, pulse oximeters, and continuous glucose monitors that demand sub-mA average current draw and a small 28-QFN (6x6 mm) footprint. Its 12-bit ADC digitizes photoplethysmography (PPG) and bio-impedance signals, while the CTMU can drive capacitive touch inputs for user buttons or gesture control. The wide 1.8 V to 3.6 V supply range supports direct Li-ion or Li-polymer battery operation, and 5 V-tolerant I/O simplifies interfacing to legacy analog front-end ICs. The RTCC keeps accurate wall-clock time during deep-sleep intervals between sensor acquisitions.
推薦
Industrial Sensor Hub with 5 V Interface
The PIC24FV16KA302-I/ML is well suited to industrial 24 V sensor hub sub-modules that step down to 3.3 V and need to read 5 V digital sensors or 4-20 mA loop inputs. Its 5 V-tolerant digital I/O eliminates level shifters, saving PCB area and BOM cost on crowded sensor boards. The 12-bit ADC with up to 16 channels handles multiple analog inputs, while the two UART/SPI/I2C peripherals let it aggregate data from several sensor types simultaneously. The industrial -40 °C to +85 °C temperature range and 1.8 V to 3.6 V supply tolerance suit harsh factory-floor environments.
推薦
Capacitive Touch User Interface
The PIC24FV16KA302-I/ML integrates the Charge Time Measurement Unit (CTMU), making it a strong fit for capacitive touch button arrays, sliders, and rotary encoders in appliance and consumer-electronics front panels. The CTMU delivers a constant current source and timing measurement core referenced to the system clock, removing the need for an external touch-sensing IC and reducing both BOM cost and PCB area. Deep-sleep modes allow the device to wake only on a capacitive touch event, extending battery life in portable touch interfaces. The 28-QFN (6x6 mm) package keeps the touch footprint compact for slim industrial designs.
推薦
Remote Control with Sleep Wake-Up
The PIC24FV16KA302-I/ML is a strong fit for battery-powered remote controls (TV, garage door, smart-home hubs) where idle current between button presses must be minimized. The deep-sleep watchdog (DSWDT) allows wake from sleep at programmed intervals, while the RTCC maintains elapsed-time counters for timeouts and scheduling. Two UART/SPI/I2C peripherals provide connectivity to RF transceiver ICs or BLE modules, and the CTMU can replace mechanical buttons with capacitive touch keys. The 16 KB Flash accommodates protocol stacks for IR, sub-GHz RF, or BLE bridging without external memory.
推薦
Energy-Harvesting Wireless Sensor
The PIC24FV16KA302-I/ML suits energy-harvesting wireless sensor nodes that scavenge microamps from solar, thermal, or vibration sources. Its XLP deep-sleep current under 1 µA (with RTCC retention) lets the node wake only when enough energy has been buffered in the storage capacitor. The wide 1.8 V to 3.6 V supply range tolerates the variable voltage from a harvesting source without a complex boost converter. The CTMU peripheral can also be repurposed as a wake-on-event timer, while the 12-bit ADC digitizes the harvested sensor reading before each RF transmit burst.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24FV16KA302-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24FV16KA302-E/ML | PIC24F16KA302-I/ML | PIC24FV16KA301-I/P |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | PDIP-20 - different package, NOT pin-to-pin compatible with 28-QFN |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Clock | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Program Flash | 16 KB (5.5K x 24) | 16 KB (5.5K x 24) | 16 KB (5.5K x 24) | 16 KB (5.5K x 24) |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB |
| EEPROM | 512 B | 512 B | 512 B | 512 B |
| Supply Voltage Range | 1.8 V to 3.6 V (5 V tolerant I/O) | 1.8 V to 3.6 V (5 V tolerant I/O) | 1.8 V to 3.6 V (no 5 V tolerant I/O) | 1.8 V to 3.6 V (5 V tolerant I/O) |
| Operating Temperature | -40 °C to +85 °C (industrial) | -40 °C to +125 °C (extended) | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) |
主要差異化特點
- 5 V-tolerant digital I/O for mixed-voltage designs (對比PIC24F16KA302-I/ML)
- Extended industrial temperature range option (對比PIC24F16KA302-I/ML)
- Highest memory density in 20/28-pin PIC24F XLP family (對比PIC24FV16KA301-I/P)
設計說明
Leverage the XLP deep-sleep modes (Deep Sleep Brown-Out Reset, Deep Sleep Watchdog Timer, and Real-Time Clock/Calendar) for battery-powered designs where idle current dominates energy budget. Per the Microchip PIC24FV16KA302 datasheet, deep-sleep current is specified in the electrical characteristics table with the RTCC enabled and RAM retention. Always use the Microchip MPLAB X IDE XLP Current Calculator spreadsheet to model duty-cycled current draw before finalizing the battery selection.
Place a 0.1 µF decoupling capacitor as close as possible to each VDD pin (pins 10 and 28 on the 28-QFN) and provide a wide ground plane under the exposed pad for thermal dissipation and return-current paths. The 28-QFN (6x6 mm) package has a center thermal pad that must be soldered to the PCB ground plane to meet the datasheet's thermal resistance specifications. Keep analog input traces short and routed away from digital switching lines to minimize ADC crosstalk.
Route the 32 MHz system clock trace on the top layer with a continuous ground reference underneath, and avoid routing it parallel to sensitive analog inputs. The PIC24FV16KA302-I/ML supports multiple oscillator options (internal FRC, primary oscillator with crystal, and PLL) - configure the configuration bits explicitly in source code rather than relying on default fuse values to avoid unintended clock source selection during production programming.
Do not assume the 5 V-tolerant pins (RA0-RA7, RB0-RB7) can be driven above VDD without checking the pin-by-pin voltage tolerance table in the datasheet - not every digital pin on the 28-QFN is 5 V tolerant in all packages. Also, the CTMU constant-current source requires firmware calibration per device to achieve specified accuracy for capacitive touch measurements; production firmware should run the calibration sequence at every power-up rather than relying on factory-stored constants.
合規資訊
RoHS-compliant per Microchip product page. Industrial temperature grade (I) -40 °C to +85 °C; for -40 °C to +125 °C select the E-suffix variant. AEC-Q100 qualification not specifically stated for this part - check Microchip product page for automotive-grade ordering codes if required.
