PIC24HJ64GP504T-I/ML - 16-bit 40MIPS MCU 64KB Flash 44-QFN | Microchip
MPN： PIC24HJ64GP504T-I/ML ✓ 啟用中PIC24HJ64GP504T-I/ML 概覽
A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, and integrated peripherals. The PIC24H family sits in the hierarchy as a 16-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. These 16-bit devices target high-speed control applications that exceed the capability of 8-bit MCUs while offering deterministic interrupt latency and rich peripheral integration.
Key features of the PIC24HJ64GP504T-I/ML include 40 MIPS CPU performance from a 3.0V to 3.6V supply, 16-channel 12-bit ADC with 500 ksps conversion rate, multiple UART/SPI/I2C peripherals, and 35 programmable I/O pins. The device also supports 8 DMA channels for efficient data movement without CPU intervention, plus three 16-bit timers that can be paired to form a 32-bit timer.
The device uses a modified Harvard architecture with a 16-bit data path and 24-bit instruction word, providing efficient C code density and DSP-style arithmetic. The integrated DSP engine (in the dsPIC33F-compatible family) makes this MCU suitable for digital signal control loops. The 44-QFN package with exposed pad enables compact layouts while maintaining thermal performance.
Typical applications include industrial motor control (BLDC, PMSM, AC induction), digital power conversion (SMPS, PFC, LLC), sensor signal conditioning, automotive body electronics, and consumer audio processing. The wide peripheral set supports multi-protocol industrial networking including CAN, SPI-based sensor hubs, and UART-based device management.
When designing, ensure the supply is regulated within 3.0V-3.6V and that decoupling capacitors are placed within 5mm of the VDD pins. The 'T' suffix indicates Tape & Reel packaging, while 'I/ML' denotes the -40C to +85C industrial temperature grade and 44-QFN (ML) package.
This page synthesizes distributor pricing, drop-in alternatives within the PIC24H family, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 PIC24HJ64GP504T-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24HJ64GP504T-I/ML （相同外形與佔位） — 差異在於 ADC, Package, Timers, Core Architecture, Program Memory (Flash).
PIC24HJ128GP504T-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24HJ64GP504-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24HJ64GP504-E/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24HJ64GP504-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC24HJ32GP304T-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24HJ64GP504T-I/ML 最大額定值與電氣特性
| Core Architecture | PIC24H 16-bit modified Harvard |
| CPU Speed | 40 MIPS (max) |
| Program Memory | 64 KB Flash (22K x 24) |
| RAM | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 35 |
| ADC | 12-bit, 500 ksps |
| DMA Channels | 8 |
| Timers | 5 x 16-bit (or 2 x 32-bit paired) |
| Communication | UART, SPI, I2C |
| 封裝 | 44-QFN (8x8 mm) - ML |
| 工作溫度 | -40 C to +85 C (Industrial) |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 (168 hours) |
| RoHS 狀態 | Compliant |
PIC24HJ64GP504T-I/ML 腳位配置
| 腳位 1 | RA0 — Analog/Digital I/O |
| 腳位 2 | RA1 — Analog/Digital I/O |
| 腳位 3 | RA2 — Analog/Digital I/O |
| 腳位 4 | RA3 — Analog/Digital I/O |
| 腳位 5 | RA4 — Analog/Digital I/O |
| 腳位 6 | AVDD — Analog supply voltage |
| 腳位 7 | AVSS — Analog ground |
| 腳位 8 | RA5 — Analog/Digital I/O |
| 腳位 9 | RA6 — Analog/Digital I/O |
| 腳位 10 | RA7 — Analog/Digital I/O |
| 腳位 11 | RB0 — Digital I/O |
| 腳位 12 | RB1 — Digital I/O |
| 腳位 13 | RB2 — Digital I/O |
| 腳位 14 | RB3 — Digital I/O |
| 腳位 15 | RB4 — Digital I/O |
| 腳位 16 | RB5 — Digital I/O |
| 腳位 17 | RB6 — Digital I/O / PGC |
| 腳位 18 | RB7 — Digital I/O / PGD |
| 腳位 19 | RB8 — Digital I/O |
| 腳位 20 | RB9 — Digital I/O |
| 腳位 21 | RB10 — Digital I/O |
| 腳位 22 | RB11 — Digital I/O |
| 腳位 23 | RC1 — Digital I/O |
| 腳位 24 | RC2 — Digital I/O |
| 腳位 25 | RC3 — Digital I/O |
| 腳位 26 | RC4 — Digital I/O |
| 腳位 27 | VDD — Digital supply voltage |
| 腳位 28 | VSS — Digital ground |
| 腳位 29 | RC5 — Digital I/O |
| 腳位 30 | RC6 — Digital I/O |
| 腳位 31 | RC7 — Digital I/O |
| 腳位 32 | RC8 — Digital I/O |
| 腳位 33 | RC9 — Digital I/O |
| 腳位 34 | OSC1 — Crystal oscillator input |
| 腳位 35 | OSC2 — Crystal oscillator output |
| 腳位 36 | RC12 — Digital I/O |
| 腳位 37 | RC13 — Digital I/O |
| 腳位 38 | RC14 — Digital I/O |
| 腳位 39 | RC15 — Digital I/O |
| 腳位 40 | MCLR — Master Clear reset input |
| 腳位 41 | RD0 — Digital I/O |
| 腳位 42 | RD1 — Digital I/O |
| 腳位 43 | RD2 — Digital I/O |
| 腳位 44 | RD3 — Digital I/O |
典型應用
PIC24HJ64GP504T-I/ML 適用於 6 應用s: Industrial Motor Control (BLDC/PMSM), Digital Power Conversion (SMPS/PFC), Automotive Body Electronics, Sensor Signal Conditioning & IoT Edge, Consumer Audio Processing, Industrial Communication Gateways.
Industrial Motor Control (BLDC/PMSM)
The PIC24HJ64GP504T-I/ML is ideal for BLDC and PMSM motor drives because its 40 MIPS core can execute field-oriented control (FOC) at 10-20 kHz PWM switching frequencies with adequate margin for current loop closure. The integrated 12-bit 500 ksps ADC simultaneously samples three-phase currents with low latency, while the 8 DMA channels offload timer-triggered ADC transfers without CPU intervention. Its 16-bit timers paired with PWM peripherals generate center-aligned PWM with dead-time insertion, and the -40C to +85C industrial temperature range supports harsh factory environments.
推薦
Digital Power Conversion (SMPS/PFC)
The PIC24HJ64GP504T-I/ML fits digital SMPS and PFC applications where its 40 MIPS DSP engine can implement digital compensators at PWM switching rates of 100-500 kHz. The high-speed 12-bit ADC samples current and voltage feedback synchronously to the PWM, while DMA delivers conversion results to memory without jitter. The 64KB Flash supports complex multi-loop digital control firmware including soft-start, slope compensation, and valley switching detection. Industrial temperature grade and the compact 44-QFN footprint enable high-density power supply designs.
推薦
Automotive Body Electronics
The PIC24HJ64GP504T-I/ML serves automotive body controllers managing lighting, mirrors, and accessory systems. Its CAN-ready peripheral set combined with high computational throughput supports body control modules (BCM) handling multiple LIN sub-networks simultaneously. The wide GPIO count (35 pins) directly drives relays, LEDs, and switches without external expanders, while the -40C to +85C temperature rating meets automotive under-hood thermal requirements. The compact 44-QFN package reduces PCB area versus TQFP equivalents in space-constrained body modules.
推薦
Sensor Signal Conditioning & IoT Edge
The PIC24HJ64GP504T-I/ML is well-suited for IoT edge sensor nodes that perform local signal conditioning before forwarding data. Its 12-bit ADC with multiple analog channels reads temperature, pressure, and motion sensors with low noise floor, while DMA stream samples into memory buffers for FFT or statistical analysis. Multiple UART/SPI/I2C interfaces connect to wireless modules (Wi-Fi, BLE, LoRa) for cloud connectivity. The 64KB Flash accommodates over-the-air (OTA) update firmware and protocol stacks, while the 8KB RAM supports multi-sensor data fusion.
推薦
Consumer Audio Processing
The PIC24HJ64GP504T-I/ML handles audio processing tasks in consumer audio devices such as DSP effects, active crossovers, and headphone amplifiers. Its 40 MIPS DSP engine can execute biquad filters and FFT-based processing in real-time, while multiple PWM outputs can directly drive Class-D amplifier stages or DAC reconstruction filters. The 8KB RAM accommodates audio buffer storage for 48 kHz sample rates with low-latency processing. SPI/I2C peripherals interface to external audio CODECs, while the compact QFN package enables slim-line audio product designs.
推薦
Industrial Communication Gateways
The PIC24HJ64GP504T-I/ML functions as a protocol converter in industrial gateways bridging RS-485, CAN, and Ethernet networks. Its multiple UART ports handle RS-485 Modbus traffic simultaneously while the SPI interface connects to Ethernet controllers like ENC28J60. The 40 MIPS CPU processes Modbus TCP/RTU protocol stacks with adequate throughput for sub-millisecond response times, and DMA moves packet data without CPU loading. The industrial temperature range and 64KB Flash support reliable operation in factory automation networks with over-the-air firmware update capability.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24HJ64GP504T-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24HJ128GP504T-I/ML | PIC24HJ64GP504-I/ML | PIC24HJ64GP504-E/ML | PIC24HJ32GP304T-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (ML) 8x8 | 44-QFN (ML) 8x8 - same | 44-QFN (ML) 8x8 - same | 44-QFN (ML) 8x8 - same | 44-QFN (ML) 8x8 - same |
| Program Memory | 64 KB Flash | 128 KB Flash | 64 KB Flash | 64 KB Flash | 32 KB Flash |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Operating Voltage | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C |
| Packaging | Tape & Reel | Tape & Reel | Tray | Tray/T&R | Tape & Reel |
| Pin-Compatible Family | dsPIC33F | dsPIC33F | dsPIC33F | dsPIC33F | dsPIC33F |
主要差異化特點
- Tape & Reel packaging for automated assembly (對比PIC24HJ64GP504-I/ML)
- Drop-in upgradable to 128KB Flash (對比PIC24HJ32GP304T-I/ML)
- Pin-compatible with dsPIC33F DSP family (對比Non-Microchip 16-bit MCUs)
設計說明
Use a low-noise 3.3V LDO regulator (e.g., MCP1700 or MIC5205) to supply the PIC24HJ64GP504T-I/ML. Place a 10uF bulk capacitor and 0.1uF ceramic decoupling capacitor within 5mm of each VDD/AVDD pin. Separate AVDD and VDD planes can reduce ADC noise; connect them at a single point near the LDO output. Brown-out detection should be enabled in the configuration bits to prevent code execution at insufficient voltage.
The 44-QFN package has an exposed thermal pad (EP) that MUST be soldered to a PCB copper pour of at least 1 square inch for reliable operation. Without proper thermal connection, junction temperature can rise 40-60C above ambient under typical 40 MIPS loads. The QFN thermal pad is also electrically connected to VSS internally, so the PCB thermal pad should connect to the ground plane.
Route the crystal oscillator traces (OSC1/OSC2) as short as possible and surround them with a ground guard ring to minimize EMI susceptibility. Place the ICSP programming pins (PGC/PGD on RB6/RB7) on accessible test points for in-circuit programming. Keep analog signal traces (ADC inputs) away from digital switching traces to prevent coupled noise into ADC readings.
Configuration bits must be set correctly for the application: oscillator selection (HS vs XT vs EC), watchdog timer enable/disable, brown-out reset voltage level, and code protection. The JTAG/ICSP pins (RB6/RB7) default to digital I/O after programming - if used for ICSP, ensure they are not driven externally during reset. The 3.3V supply MUST be stable before MCLR rises to avoid code lockup.
合規資訊
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - select automotive-grade variant for vehicle applications.
