PIC32MM0256GPM048-I/PT - 25MHz 32-bit MCU, 256KB Flash, USB | Microchip
MPN： PIC32MM0256GPM048-I/PT ✓ 啟用中PIC32MM0256GPM048-I/PT 概覽
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program and data memory, peripherals, and I/O into a single device. Within the taxonomy, the PIC32MM0256GPM048 sits as: 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. The PIC32MM GPM family uses the MIPS32 microAptiv core, which supports the MIPS16e instruction set for code-density optimization. ECC on Flash detects and corrects single-bit errors in program memory, which improves reliability for industrial and consumer applications.
Key features of the PIC32MM0256GPM048-I/PT include a 25 MHz maximum core clock, 256 KB ECC Flash, 16 KB SRAM, 4 KB EEPROM (emulated), USB 2.0 full-speed device, multiple timer/capture-compare/PWM modules, 12-bit 1.1 Msps ADC, multiple UART/SPI/I2C peripherals, and rich touch/analog integration suited for HMI and sensor applications. The -I suffix denotes the -40C to +85C industrial temperature range.
The PIC32MM0256GPM048-I/PT uses a 3.3V single supply with multiple power-saving modes targeted at ultra-low active and sleep currents. Its rich peripheral set and USB 2.0 FS device interface make it a cost-effective choice for HID-class devices, sensors, and human-machine interfaces.
Typical applications include USB human-interface devices (HID) such as keyboards, mice, and touch panels; low-power IoT sensor nodes; motor-control front ends; consumer appliances with touch UIs; and industrial control systems where low active and sleep power are critical. The integrated USB device peripheral eliminates external PHY chips, reducing BOM cost.
When designing with this device, allocate sufficient decoupling (100 nF plus 4.7 uF bulk) near each VDD pin and keep the USB DP/DM traces 90-ohm differential-matched. The exposed thermal pad must be soldered to a grounded copper pour for electrical and thermal performance; omitting it can degrade ESD/EMC behavior.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for selecting and implementing the PIC32MM0256GPM048-I/PT.
直接替換替代品，適用於 PIC32MM0256GPM048-I/PT — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MM0256GPM048-I/PT （相同外形與佔位） — 差異在於 Package, Core Architecture, ADC, USB, DMA Channels.
PIC32MM0256GPM048T-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC32MM0064GPM048-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC32MM0128GPM048-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC32MM0256GPM048-I/PT 最大額定值與電氣特性
| Core Architecture | MIPS32 microAptiv |
| Instruction Set | 32-bit MIPS / microMIPS (MIPS16e) |
| Maximum CPU Clock | 25 MHz |
| Program Flash | 256 KB (with ECC) |
| SRAM | 16 KB |
| USB | USB 2.0 Full-Speed Device |
| Operating Voltage | 2.0 V to 3.6 V |
| Temperature Range (Grade) | -40C to +85C (Industrial, -I) |
| 封裝 | 48-pin TQFP-EP (7x7 mm) with exposed thermal pad |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
PIC32MM0256GPM048-I/PT 48-pin tqfp-ep (7x7 mm) with exposed thermal pad 腳位配置指南
PIC32MM0256GPM048-I/PT（48-pin tqfp-ep (7x7 mm) with exposed thermal pad 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MM0256GPM048-I/PT.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MM0256GPM048-I/PT 適用於 6 應用s: USB HID Peripherals (Keyboard/Mouse/Touch), IoT Sensor Nodes and Edge Devices, Consumer Appliance User Interfaces with Touch, Motor Control Front Ends and BLDC Drivers, Industrial Control and Factory Automation, USB-Connected Test and Measurement.
USB HID Peripherals (Keyboard/Mouse/Touch)
The PIC32MM0256GPM048-I/PT is purpose-built for USB Human Interface Device peripherals. Its integrated USB 2.0 Full-Speed (12 Mbps) device controller with on-chip transceiver eliminates external PHY chips, while the eXtreme Low Power (XLP) nanoWatt sleep modes minimize idle current between user events. The 25 MHz MIPS32 microAptiv core executes HID report updates and debouncing in microseconds, and 256 KB of ECC Flash accommodates USB HID descriptors, multi-bootloader support, and OEM customization. The exposed-pad TQFP-EP package handles thermal dissipation in sealed enclosures. Place a 100 nF decoupling capacitor on each VDD pin and route the USB DP/DM traces as a 90-ohm differential pair for USB-IF compliance.
推薦
IoT Sensor Nodes and Edge Devices
For battery-powered IoT sensor nodes, the PIC32MM0256GPM048-I/PT delivers an optimal balance of MIPS performance and deep-sleep current. The XLP technology offers Sleep and Deep Sleep modes with currents in the microamp range, suitable for coin-cell or energy-harvesting designs. The 12-bit ADC (multiple channels) reads analog sensors directly, while the 16 KB SRAM buffers sample packets before transmission over UART or I2C. With 256 KB Flash and ECC, the device can run TLS stacks or sensor-fusion firmware safely in industrial environments. Pair the MCU with a low-power radio module; the PIC32MM powers down between transmissions while maintaining timer-based wake-up for scheduled sampling windows.
推薦
Consumer Appliance User Interfaces with Touch
The PIC32MM0256GPM048-I/PT integrates rich touch and analog peripherals well-suited for white-goods and consumer appliance control panels. The mTouch capacitive touch peripheral supports capacitive buttons, sliders, and proximity sensing without external components, while the 12-bit ADC monitors temperature and supply rails. The 25 MHz core drives LED matrix animations or LCD segment controls in real-time, and the USB 2.0 FS device enables firmware update ports for field serviceability. With 256 KB Flash, OEMs can store multi-language UI assets, calibration data, and bootloader code. The -40C to +85C industrial range meets appliance environmental specifications.
推薦
Motor Control Front Ends and BLDC Drivers
In low-power motor control applications such as fans, pumps, and small BLDC drivers, the PIC32MM0256GPM048-I/PT acts as a flexible front-end MCU. Its multiple PWM and timer/capture modules generate commutation signals with precise timing, while the 12-bit ADC samples phase currents and back-EMF for sensorless control algorithms. The ECC Flash improves reliability in environments with electrical noise. The 16 KB SRAM supports real-time control loops, and the USB device interface enables configuration ports for OEM tuning. For more demanding DSP-style control, a dsPIC companion like the DSPIC33EP64GS805 handles field-oriented control (FOC) and sine-wave commutation.
推薦
Industrial Control and Factory Automation
For industrial PLC-style I/O modules and factory-automation endpoints, the PIC32MM0256GPM048-I/PT offers the right mix of peripherals, reliability, and lifecycle support. The 256 KB ECC Flash protects against bit-flips in electrically noisy factory environments, while the -40C to +85C industrial temperature range supports outdoor and cabinet-mounted installations. UART, SPI, and I2C peripherals communicate with sensor stacks and host PLCs, while the USB 2.0 FS device port enables diagnostic log download and firmware updates. With decades-long Microchip product longevity, the PIC32MM GPM family suits long-life industrial deployments where component continuity matters.
推薦
USB-Connected Test and Measurement
In USB-based test and measurement instruments, the PIC32MM0256GPM048-I/PT serves as a low-cost data acquisition and USB bridge controller. The integrated 12-bit ADC (up to 1.1 Msps) captures analog signals, while the USB 2.0 FS device streams data to a host PC at 12 Mbps in bulk or isochronous transfers. The 25 MHz MIPS32 core performs digital filtering and statistical aggregation in real-time. With 256 KB Flash, calibration constants, USB descriptors, and protocol handlers fit comfortably. The exposed-pad TQFP-EP package aids thermal management during sustained ADC conversions.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MM0256GPM048-I/PT — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MM0256GPM048T-I/PT | PIC32MM0064GPM048-I/PT | PIC32MM0128GPM048-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-TQFP-EP (7x7) | 48-TQFP-EP (7x7) - same | 48-TQFP-EP (7x7) - same | 48-TQFP-EP (7x7) - same |
| Core | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Program Flash | 256 KB (ECC) | 256 KB (ECC) | 64 KB (ECC) -75% | 128 KB (ECC) -50% |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB |
| USB | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging Format | Tray | Tape & Reel | Tray | Tray |
主要差異化特點
- Highest-density Flash in the PIC32MM GPM 48-pin family (對比PIC32MM0064GPM048-I/PT)
- Tape-and-reel packaging for high-volume assembly (對比PIC32MM0256GPM048-I/PT (tray))
- eXtreme Low Power (XLP) nanoWatt technology (對比PIC24FJ256GB610-I/PT)
設計說明
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin, and a single 4.7 uF bulk capacitor near the package. The USB VBUS pin requires its own 100 nF decoupling. When operating in Deep Sleep modes, verify that the core regulator's retention current matches your battery-life budget; on the PIC32MM GPM family, the Deep Sleep current is typically a few microamps with RTC running.
The 48-pin TQFP-EP package has an exposed thermal pad that MUST be soldered to a grounded copper pour (at least 1 square inch of 1 oz copper is recommended). The pad improves thermal dissipation and provides a low-impedance ground reference for the USB and ADC peripherals. Route the USB DP and DM traces as a 90-ohm differential pair with matched length, and place a common-mode choke or ferrite bead near the connector for EMI suppression.
When using the 12-bit ADC for precision measurements, place a small RC filter (10 ohm + 100 nF) at each analog input to attenuate switching noise from digital signals. Avoid routing digital traces parallel to analog traces; use a ground fill beneath the ADC input traces. Connect AVSS to the same ground plane as VSS with a single-point connection near the MCU to avoid ground loops in sensitive analog paths.
Do not leave the exposed thermal pad of the TQFP-EP package floating - it must be soldered to a grounded copper pour or the device may exhibit ESD/EMC degradation. When programming via ICSP, use matching PGECx/PGEDx pin pairs (e.g., PGEC2 with PGED2), not mismatched pairs. For USB applications, ensure the VBUS sense pin is correctly configured; leaving it floating can cause enumeration failures on some hosts.
合規資訊
RoHS and REACH compliant per Microchip product page. The -I suffix denotes industrial -40C to +85C temperature range; not AEC-Q100 qualified - choose PIC32MK or PIC32MX variants for AEC-Q100 automotive applications.
