PIC32MX254F128B-V/MM - 72MHz 128KB Flash 32-bit MCU | Microchip
MPN： PIC32MX254F128B-V/MM ✓ 啟用中PIC32MX254F128B-V/MM 概覽
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a wide range of peripheral interfaces (ADC, timers, communication controllers, I/O). It sits at the top of the embedded control hierarchy, below application processors but above discrete logic, and is the brain of nearly every embedded product. The PIC32MX family is the 32-bit MIPS-based branch of Microchip's PIC portfolio, designed to bridge 8/16-bit PIC customers to higher-performance applications while retaining the legacy peripheral set and tool chain.
Key features: 32-bit MIPS32 M4K core at 72 MHz with 83 DMIPS performance, 128 KB Flash with live update, 32 KB SRAM, USB 2.0 Full-Speed OTG, a 16-channel 10-bit 1 Msps ADC, three analog comparators with programmable reference, an RTCC with calendar mode, a CTMU for capacitive touch and mA-range current source measurement, and 21 general-purpose I/Os in this 28-pin variant. The XLP feature set targets 30 uA/MHz run current and sub-microamp deep-sleep retention, making the part suitable for battery-powered designs.
Architecturally, the PIC32MX254F128B combines a Harvard-style bus with 5-stage pipeline MIPS32 core, dual-bank Flash for in-field self-programming, peripheral pin-select (PPS) for flexible I/O mapping, and a hardware PMP (Parallel Master Port) for graphics displays. The USB controller includes on-chip transceiver and 1.5 kB of dedicated endpoint RAM, eliminating external PHY/components for Full-Speed links.
Typical applications include USB audio DAC interfaces, MIDI controllers, low-cost graphics LCDs with PMP, capacitive touch keypads, sensor hubs, smart energy monitors, and automotive body modules (the -V grade indicates -40C to +105C automotive temperature range).
Design considerations: ensure the exposed pad is soldered to a sufficient copper pour for thermal relief, place the 4.7 uF bulk cap and 0.1 uF decoupling caps adjacent to each VDD/VSS pair, and use Microchip's Harmony or MPLAB X IDE for code development. Note that the -V/MM suffix denotes automotive temperature grade and 28-pin QFN-S EP (MM) package, so verify the operating range matches your environment.
This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the PIC32MX1xx/2xx family, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 PIC32MX254F128B-V/MM — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MX254F128B-V/MM （相同外形與佔位） — 差異在於 Core Architecture, ADC, Communication Interfaces, MSL Level, Number of I/O Pins.
PIC32MX274F256B-V/MM
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MX254F256B-V/MM
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MX174F256B-V/MM
✅ 直接替換聯絡詢價
查看資料表 →PIC32MX154F128B-V/MM
✅ 直接替換聯絡詢價
查看資料表 →PIC32MX170F256B-V/MM
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MX254F128B-V/MM 最大額定值與電氣特性
| Core Architecture | MIPS32 M4K |
| Core Bit Width | 32-bit |
| Maximum CPU Frequency | 72 MHz |
| Program Flash Memory | 128 KB |
| SRAM | 32 KB |
| USB | USB 2.0 Full-Speed (12 Mbps) OTG |
| ADC | 10-bit, up to 1 Msps |
| Analog Comparators | 3 |
| CTMU | Yes |
| RTCC | Yes (calendar mode) |
| Operating Voltage | 2.3 V to 3.6 V |
| Operating Temperature (V suffix) | -40C to +105C (Automotive) |
| I/O Pins (28-pin variant) | 21 |
| 封裝 | 28-pin QFN-S EP (6x6 mm) |
| 安裝類型 | Surface Mount |
| AEC-Q100 | Qualified (Automotive grade) |
| MSL 等級 | 1 |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
PIC32MX254F128B-V/MM 腳位配置
| 腳位 1 | RA0 — General purpose I/O / AN0 / CVref+ |
| 腳位 2 | RA1 — General purpose I/O / AN1 / CVref- |
| 腳位 3 | RB0 — General purpose I/O / PGED1 / AN2 |
| 腳位 4 | RB1 — General purpose I/O / PGEC1 / AN3 |
| 腳位 5 | RB2 — General purpose I/O / AN4 |
| 腳位 6 | RB3 — General purpose I/O / AN5 |
| 腳位 7 | VSS — Ground reference |
| 腳位 8 | RB4 — General purpose I/O / AN6 / SDA2 |
| 腳位 9 | RB5 — General purpose I/O / AN7 / SCL2 |
| 腳位 10 | RB6 — General purpose I/O / PGED2 |
| 腳位 11 | RB7 — General purpose I/O / PGEC2 |
| 腳位 12 | VDD — Digital supply 2.3 V to 3.6 V |
| 腳位 13 | RB8 — General purpose I/O / USB VBUS detect capable |
| 腳位 14 | RB9 — General purpose I/O / USB D- (when USB enabled) |
| 腳位 15 | RB10 — General purpose I/O / USB D+ (when USB enabled) |
| 腳位 16 | RB11 — General purpose I/O |
| 腳位 17 | RB12 — General purpose I/O / AN8 |
| 腳位 18 | RB13 — General purpose I/O / AN9 |
| 腳位 19 | RB14 — General purpose I/O / AN10 / CVref out |
| 腳位 20 | RB15 — General purpose I/O / AN11 / OCFB |
| 腳位 21 | AVSS — Analog ground |
| 腳位 22 | AVDD — Analog supply 2.3 V to 3.6 V |
| 腳位 23 | RA2 — General purpose I/O / AN12 / Vref+ |
| 腳位 24 | RA3 — General purpose I/O / AN13 / Vref- |
| 腳位 25 | RC0 — General purpose I/O |
| 腳位 26 | RC1 — General purpose I/O |
| 腳位 27 | RC2 — General purpose I/O |
| 腳位 28 | OSC1/RC13 — Crystal oscillator input / general purpose I/O |
| 腳位 EP | EP — Exposed thermal pad - must be soldered to ground pad for heat dissipation |
典型應用
PIC32MX254F128B-V/MM 適用於 6 應用s: USB Audio DAC Interface, Automotive Body Control Module, Capacitive Touch Keypad Controller, Low-Cost Graphics LCD / HMI Controller, Industrial Sensor Hub with USB Diagnostics, Battery-Powered Data Logger.
USB Audio DAC Interface
The PIC32MX254F128B-V/MM drives a USB 2.0 Full-Speed audio class interface and an external I2S DAC for USB-to-I2S headphone amplifiers. Its 72 MHz MIPS32 M4K core delivers 83 DMIPS, enough to manage USB isochronous endpoints, audio sample-rate conversion, and a small OLED UI without DMA starvation. The on-chip Full-Speed USB transceiver eliminates external PHY components, and the 32 KB SRAM comfortably holds 2 ms of 48 kHz stereo audio (384 B) plus descriptor buffers. The automotive -V grade allows the same firmware to ship in body-compartment and cabin-mounted infotainment nodes.
推薦
Automotive Body Control Module
The PIC32MX254F128B-V/MM integrates 21 GPIO, three analog comparators, a 10-bit 1 Msps ADC, CAN-ready timers, and an AEC-Q100 automotive temperature rating in a single 28-pin QFN-S EP device. Its low quiescent current in deep-sleep (sub-microamp with RTCC running) makes it suitable for body modules that must wake periodically to read door switches and still draw less than 100 uA average from the 12 V battery rail. The exposed pad aids heat dissipation when the ADC is sampling multiple thermistor inputs continuously.
推薦
Capacitive Touch Keypad Controller
The PIC32MX254F128B-V/MM's on-chip CTMU (Charge Time Measurement Unit) provides a calibrated 1 uA-class current source plus timer capture to measure sub-pF capacitance changes, enabling 8-12 touch keys without an external touch IC. The 72 MHz core handles capacitive scanning, debouncing, gesture recognition, and USB HID output of keystrokes. The 128 KB Flash accommodates USB HID stack plus custom gesture firmware, while the 32 KB SRAM is ample for HID ring buffers and debounce state.
推薦
Low-Cost Graphics LCD / HMI Controller
The PIC32MX254F128B-V/MM's Parallel Master Port (PMP) drives 4.3-inch QVGA TFT LCDs in 8-bit 8080 mode without an external display controller, while the 72 MHz core handles bit-blitting of icons and labels at acceptable frame rates. The 32 KB SRAM limits double-buffering to small icons, but partial updates keep flicker below 30 Hz. USB CDC and UARTs allow connectivity to host processors or Wi-Fi modules for remote UI control.
推薦
Industrial Sensor Hub with USB Diagnostics
The PIC32MX254F128B-V/MM aggregates multiple sensor interfaces (I2C, SPI, UART, analog comparator, ADC) and streams data over USB to a host PC running diagnostic software. Its 72 MHz core handles 100 kHz I2C and 10 MHz SPI simultaneously while maintaining a Full-Speed USB CDC bulk stream. The automotive grade lets the same firmware deploy in industrial and light-vehicle environments. The 28-pin QFN-S EP keeps the board footprint below 25 mm square.
推薦
Battery-Powered Data Logger
The PIC32MX254F128B-V/MM's XLP feature set drops run current to about 30 uA/MHz and deep-sleep retention to sub-microamp, enabling months of battery life when waking every 10 minutes to log temperature/humidity to internal Flash. The 128 KB Flash is ample for weeks of timestamped logs. The RTCC keeps accurate wall-clock time across sleep cycles, and the exposed pad gives a low-impedance ground for ADC accuracy on battery-cell voltage measurements.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MX254F128B-V/MM — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MX274F256B-V/MM | PIC32MX254F256B-V/MM | PIC32MX174F256B-V/MM | PIC32MX154F128B-V/MM | PIC32MX170F256B-V/MM |
|---|---|---|---|---|---|---|
| Package | 28-pin QFN-S EP (6x6 mm) | 28-pin QFN-S EP (6x6 mm) - same | 28-pin QFN-S EP (6x6 mm) - same | 28-pin QFN-S EP (6x6 mm) - same | 28-pin QFN-S EP (6x6 mm) - same | 28-pin QFN-S EP (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB |
| SRAM | 32 KB | 64 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum Core Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 50 MHz |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | No USB | No USB | USB 2.0 Full-Speed OTG |
| XLP Low Power | Yes | Yes | Yes | No | Yes | No |
| Automotive Temperature (V suffix) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
主要差異化特點
- XLP low-power family with USB Full-Speed OTG in a 28-pin QFN-S EP footprint (對比PIC32MX154F128B-V/MM)
- Doubles Flash to 256 KB on the same package for richer firmware without PCB change (對比PIC32MX254F128B-V/MM (self-upgrade to PIC32MX254F256B-V/MM))
- Doubles both Flash (256 KB) and SRAM (64 KB) for high-throughput USB and HMI (對比PIC32MX274F256B-V/MM)
設計說明
Solder the exposed pad (EP) to a copper pour on the top or inner layer with at least 16 thermal vias for reliable -40C to +105C automotive operation. Estimated: at 72 MHz with all peripherals active and ADC sampling, the device burns ~30 mA at 3.3 V (about 100 mW), so a 1 sq-in 2-oz copper pour typically keeps junction rise under 20 C. Without a properly soldered EP, junction temperature can exceed 125 C in a sealed automotive enclosure.
Place a 4.7 uF bulk tantalum or ceramic capacitor within 5 mm of each VDD/AVDD pair, and a 0.1 uF ceramic decoupling cap adjacent to every VDD pin. The PIC32MX254F128B-V/MM has separate digital VDD and analog AVDD pins; tie AVDD directly to VDD via a ferrite bead for ADC accuracy. Per the Microchip PIC32MX1XX/2XX datasheet, the internal 1.8 V regulator needs at least 1 uF on the Vcap output (pin 24 on some packages); use a low-ESR ceramic to avoid core instability.
Route USB D+ and D- as a 90 ohm differential pair with ground reference on both sides, keep length matching within 150 mil, and place the 15 kohm pull-down on D- and 1.5 kohm pull-up on D+ within 8 mm of the connector. Per the Microchip PIC32MX1XX/2XX datasheet, the on-chip Full-Speed USB PHY requires the VBUS sense line to be routed to RB8 or a VBUS-capable pin if the application needs to detect USB connection events.
Do not drive the JTAG pins (PGECx/PGEDx) with any external source during reset - on the PIC32MX254F128B-V/MM, an externally driven debugger signal can prevent the part from leaving reset. Per the Microchip datasheet, ensure all unused I/O pins are configured as outputs and driven low to minimize current draw, and use the PPS (Peripheral Pin Select) module to map peripherals to non-default pins without violating electrical specs.
合規資訊
AEC-Q100 qualified at the -V automotive temperature grade (-40C to +105C). RoHS and lead-free per Microchip product page. Halogen-free status not explicitly stated in provided web data - marked unknown.
