PIC32MZ2064DAS169-V/6J - 200MHz 32-bit MCU, 2MB Flash | Microchip
MPN： PIC32MZ2064DAS169-V/6J ✓ 啟用中PIC32MZ2064DAS169-V/6J 概覽
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a 32-bit processor core, Flash program memory, SRAM data memory, and a rich peripheral set on one die. Within the embedded hierarchy, PIC32MZ devices sit above 8/16-bit MCUs and below application processors, balancing deterministic real-time behavior with enough throughput to drive large color TFT displays, run connectivity stacks, and host small embedded GUIs. The PIC32MZ DA family specifically adds an LCD controller, a 2D Graphics Processor (GPU), and DDR2 memory interface, making it a true graphics MCU.
Key features of the PIC32MZ2064DAS169 include a MIPS32 microAptiv core running at 200 MHz with I-cache and D-cache, a 12-bit 18 MSPS ADC with up to 45 analog inputs, a Hi-Speed USB 2.0 OTG controller, two CAN modules, and a hardware crypto accelerator. The on-chip stacked DDR2 eliminates the need for an external SDRAM chip, simplifying PCB layout and reducing BOM cost.
Architecturally, the device pairs a high-performance CPU subsystem with a dedicated graphics pipeline and DDR2 memory controller. The integrated GPU accelerates primitives, blits, and alpha blending, while the DDR2 controller handles high-bandwidth framebuffer access. The result is a single-chip platform capable of driving WVGA-resolution color displays without an external memory or graphics chip.
Typical applications include industrial HMI panels, home appliances with color TFT displays, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and portable instrumentation. The wide peripheral set and large memory also make the device attractive for IoT gateways requiring on-board crypto and secure boot.
When designing with this MCU, allocate a 4-layer PCB with a continuous ground plane for the DDR2 signals, follow the Microchip DDR2 routing guidelines in the family datasheet, and provide adequate bulk decoupling near the LFBGA. The -V/6J suffix indicates the V-temperature grade and 169-ball BGA package variant.
This page consolidates distributor pricing, drop-in and same-package alternatives, and practical hardware design notes that are not found in the manufacturer datasheet alone, giving engineers a single authoritative source for sourcing and second-sourcing decisions.
直接替換替代品，適用於 PIC32MZ2064DAS169-V/6J — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MZ2064DAS169-V/6J （相同外形與佔位） — 差異在於 Core Architecture, Graphics Controller, ADC, Operating Temperature, CAN.
PIC32MZ2064DAS169T-I/6J
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2025DAS169-V/6J
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1064DAS169
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MZ1025DAS169
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MZ2064DAS169-V/6J 最大額定值與電氣特性
| Core | MIPS32 microAptiv |
| Core Architecture | 32-bit RISC |
| Maximum CPU Clock | 200 MHz |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| On-chip DRAM | 32 MB or 128 MB stacked DDR2 |
| ADC | 12-bit, up to 18 MSPS |
| Analog Inputs (max) | 45 |
| Graphics Controller | Integrated LCD controller with 2D GPU |
| USB | Hi-Speed USB 2.0 OTG |
| CAN | 2x CAN modules |
| Crypto Accelerator | Hardware crypto engine |
| 封裝 | 169-ball LFBGA (11x11 mm) |
| 工作溫度 | -40C to +105C (V grade) |
| 安裝類型 | Surface Mount |
PIC32MZ2064DAS169-V/6J 169-ball lfbga (11x11 mm) 腳位配置指南
PIC32MZ2064DAS169-V/6J（169-ball lfbga (11x11 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MZ2064DAS169-V/6J.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MZ2064DAS169-V/6J 適用於 7 應用s: Industrial HMI Touch Panels, Home Appliance Color TFT Displays, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Portable Test and Measurement, IoT Gateways with Secure Boot.
Industrial HMI Touch Panels
The PIC32MZ2064DAS169-V/6J is purpose-built for industrial HMI panels running color TFT touch displays. Its 200 MHz MIPS32 microAptiv core, integrated 2D GPU, and LCD controller drive WVGA-resolution GUIs without an external graphics chip, while the stacked 32 MB or 128 MB DDR2 holds full framebuffers and asset storage. The 12-bit 18 MSPS ADC reads up to 45 analog sensor channels for process monitoring, and the V-grade -40C to +105C temperature range tolerates factory-floor heat. Two CAN buses connect to industrial field networks, and the hardware crypto engine secures OTA firmware updates in connected-factory deployments.
推薦
Home Appliance Color TFT Displays
High-end home appliances such as ovens, washing machines, and refrigerators increasingly use full-color TFT displays for animated user interfaces. The PIC32MZ2064DAS169-V/6J fits this role because its integrated 2D GPU accelerates icon animations, alpha-blended overlays, and language transitions that would otherwise burden the CPU. The on-chip stacked DDR2 (32 MB or 128 MB) eliminates the need for an external SDRAM chip, shrinking the PCB and BOM cost to a level acceptable for consumer pricing. Hi-Speed USB and CAN support connectivity to cloud services and appliance-internal networks.
推薦
Medical Patient Monitors
Bedside patient monitors display waveforms, numeric vital signs, and alarm screens on color TFT panels, which the PIC32MZ2064DAS169-V/6J can drive directly via its integrated LCD controller. The 12-bit 18 MSPS ADC simultaneously samples multiple analog signals such as ECG, SpO2, and respiration waveforms at sample rates sufficient for medical-grade fidelity. The hardware crypto engine protects patient data at rest and during wireless transmission, supporting HIPAA-style security requirements. Stacked DDR2 holds waveform buffers and localized language assets without external memory.
推薦
Automotive Infotainment Clusters
Automotive instrument clusters and entry-level infotainment displays benefit from the PIC32MZ2064DAS169-V/6J's MIPS32 200 MHz core, integrated graphics pipeline, and dual CAN interfaces. The GPU accelerates 2D dial rendering and animated telltale icons, while the 45-channel 12-bit ADC reads sensor inputs from the vehicle body. For harsher automotive temperature ranges, designers should consider the AEC-Q100-qualified PIC32 variants or pair this MCU with an external display co-processor for larger screens.
推薦
Point-of-Sale Terminals
Modern POS terminals combine a color touch display, a magnetic-card or NFC reader, and connectivity options on a compact mainboard. The PIC32MZ2064DAS169-V/6J consolidates GUI rendering, ADC-based sensor reads, USB device/host, and crypto-secured payment transactions in one chip. The stacked DDR2 provides enough bandwidth for animated product graphics and receipt preview rendering, while Hi-Speed USB OTG supports peripherals such as printers and barcode scanners.
推薦
Portable Test and Measurement
Handheld oscilloscopes, signal analyzers, and field meters require a fast ADC, a color display, and a responsive GUI in a small enclosure. The PIC32MZ2064DAS169-V/6J delivers 12-bit 18 MSPS sampling suitable for sub-MHz bandwidth instrumentation while driving a TFT display through its integrated LCD controller. The 640 KB SRAM and stacked DDR2 buffer long waveform captures without off-chip memory. The V-grade temperature range supports outdoor and industrial field use.
推薦
IoT Gateways with Secure Boot
Industrial IoT gateways aggregate sensor data and forward it to the cloud over Ethernet or cellular links. The PIC32MZ2064DAS169-V/6J's hardware crypto accelerator accelerates TLS handshakes and AES payload encryption, while the Hi-Speed USB OTG supports cellular modems and the dual CAN buses aggregate fieldbus data. The 2 MB Flash holds a full Linux-adjacent TLS stack and MQTT client, and the 128 MB stacked DDR2 variant buffers local message queues during network outages.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MZ2064DAS169-V/6J — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MZ2064DAS169T-I/6J | PIC32MZ2025DAS169-V/6J | PIC32MZ1064DAS169 | PIC32MZ1025DAS169 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-ball LFBGA (11x11) | 169-ball LFBGA (11x11) - same | 169-ball LFBGA (11x11) - same | 169-ball LFBGA (11x11) - same | 169-ball LFBGA (11x11) - same |
| Core / Clock | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz |
| Flash | 2 MB | 2 MB | 1.6 MB (-20%) | 1 MB (-50%) | 512 KB (-74%) |
| SRAM | 640 KB | 640 KB | 320 KB (-50%) | 320 KB (-50%) | 128 KB (-80%) |
| Stacked DDR2 | 32 MB or 128 MB | 32 MB or 128 MB | 32 MB or 128 MB | 32 MB or 128 MB | 32 MB |
| ADC | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS |
| Temperature Grade | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | varies by suffix | varies by suffix |
| USB / CAN / Crypto | HS USB OTG / 2x CAN / HW crypto | HS USB OTG / 2x CAN / HW crypto | HS USB OTG / 2x CAN / HW crypto | HS USB OTG / 2x CAN / HW crypto | HS USB OTG / 2x CAN / HW crypto |
主要差異化特點
- On-chip stacked DDR2 eliminates external SDRAM (對比PIC32MZ2064DAL169-I/HF)
- Highest memory density in 169-ball BGA family (對比PIC32MZ1064DAS169)
- Highest temperature grade in 169-ball BGA family (對比PIC32MZ2064DAS169T-I/6J)
設計說明
The 169-ball LFBGA at 11x11 mm requires a 4-layer PCB minimum with a continuous ground plane beneath the package. Follow Microchip's DDR2 routing guidelines in the family datasheet: matched-length traces for the DDR2 byte lanes (typically within 25 mil), series-stubs minimized, and reference planes kept continuous. Use microvia-in-pad if your fab supports it, otherwise dog-bone fanouts are acceptable at this 0.8 mm pitch.
Decouple the PIC32MZ2064DAS169-V/6J with at least four bulk capacitors (10 uF ceramic) placed as close as possible to each power pin pair, plus 0.1 uF and 1 nF ceramic high-frequency bypass capacitors on every VDD pin. The stacked DDR2 has its own rail that must be isolated with a ferrite bead or filter network from the logic supply to prevent switching noise from coupling into the analog ADC rails.
Estimated: at 200 MHz full CPU load with GPU active, the PIC32MZ2064DAS169-V/6J draws approximately 350 mA from a 1.2 V core supply, dissipating about 0.42 W internally. The 169-ball LFBGA has a typical theta_JA of approximately 25 C/W on a 4-layer JEDEC test board, giving a junction-to-ambient rise of about 10.5 C above ambient. The V-grade -40C to +105C specification provides ample thermal margin for industrial enclosures without an external heatsink.
Do not omit the external 32.768 kHz crystal on the SOSC pins if you need RTC operation; the internal FRC drifts too much for timekeeping. Ensure the PGECx/PGEDx ICSP pair selected in your programming tool matches the pins wired to your debugger, since the device has multiple programming/debug pairs. Configure the DDR2 timing parameters in the device configuration registers according to the specific JEDEC-grade DDR2 chip used in the stacked package variant.
合規資訊
RoHS and REACH compliance per Microchip product page. Standard part is not AEC-Q100 qualified; check Microchip's automotive-grade PIC32MZ DA variants for AEC-Q100 requirements. Halogen-free per Microchip packaging materials declaration.
