RTAX1000SL-1CGS624V - 1M-Gate Rad-Tolerant FPGA | Microchip
MPN： RTAX1000SL-1CGS624V ✓ 啟用中RTAX1000SL-1CGS624V 概覽
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space: it withstands total ionizing dose (TID), single-event latchup (SEL), and single-event upsets (SEU). The RTAX-S/SL family sits within the hierarchy of programmable logic ICs (FPGA > radiation-tolerant FPGA > space-grade programmable logic) and is widely adopted for spaceflight payloads, satellite avionics, and launch-vehicle electronics.
Key features include SEU-hardened flip-flops that eliminate the need for Triple Module Redundancy (TMR) in many designs, SEU immunity to specified LET thresholds with SEU rates below 10-10 errors per bit-day, true single-chip operation, and live-at-power-up behavior enabled by the non-volatile antifuse programming technology. Unlike SRAM FPGAs, the antifuse configuration cannot be disturbed by radiation-induced configuration upsets, removing the need for external configuration PROMs.
The SL variant is the low-power derivative of the RTAX-S family, reducing static power consumption - a critical advantage for battery- and solar-powered spacecraft. System-level features include embedded SRAM with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic datapaths. The device is programmed once at the factory or programming house via the antifuse layer, providing very high design security.
Typical applications include satellite payload data processing, spacecraft telemetry and command interfaces, sensor signal processing in orbital platforms, and fault-tolerant control logic in deep-space probes.
Design consideration: as an antifuse (one-time programmable) device, design freezes must be complete before programming - no post-deployment reconfiguration is possible, so flight-design verification with prototype devices is essential.
This page synthesizes verified distributor data, drop-in family alternatives, and practical space-design guidance not found on standard distributor listings.
直接替換替代品，適用於 RTAX1000SL-1CGS624V — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： RTAX1000SL-1CGS624V （相同外形與佔位） — 差異在於 Package, Family, Radiation Tolerance, Configuration, Technology.
RTAX1000SL-CGS624E
✅ 直接替換聯絡詢價
查看資料表 →RTAX1000SL-1CGS624EV
✅ 直接替換📋 參考替代品（不在目錄中）
RTAX1000S-1CGS624V
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →RTAX1000SL-1LG624V
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →RTAX1000S-1LG624V
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →RTAX1000SL-1CGS624V 最大額定值與電氣特性
| System Gates | 1,000,000 (1.00E6) |
| Logic Cells / Logic Blocks | 12096 |
| Logic Family | Digital CMOS |
| Programmable Technology | Antifuse (one-time programmable) |
| Package Type | CGA-624 (ceramic column grid array) |
| 腳位數 | 624 |
| 工作溫度 | -55C to +125C |
| Speed Grade | -1 (standard) |
| SEU Immunity | SEU-hardened registers; SEU rate < 10-10 errors/bit-day |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified family) |
| Configuration | Live at power-up, single chip, no external boot PROM |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clock resources |
| Routing Features | Chip-wide highway routing, carry logic |
| 安裝類型 | Surface Mount |
RTAX1000SL-1CGS624V cga-624 (ceramic column grid array) 腳位配置指南
RTAX1000SL-1CGS624V（cga-624 (ceramic column grid array) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： RTAX1000SL-1CGS624V.
請參閱 資料表 以查看完整腳位配置。
典型應用
RTAX1000SL-1CGS624V 適用於 6 應用s: Satellite Payload Data Processing, Spacecraft Telemetry, Tracking & Command (TT&C), Launch Vehicle Avionics, Deep-Space Probe Instrument Control, Space-Grade Glue Logic Integration, Space Imaging & Sensor Front-End Processing.
Satellite Payload Data Processing
In LEO and GEO satellite payloads, the RTAX1000SL-1CGS624V formats, buffers, and pre-processes high-rate sensor and communication data. Its 1,000,000 system gates and 12,096 logic cells accommodate data framing, FIFO-based rate adaptation using embedded SRAM, and channel coding front-ends. The SEU-hardened registers, with SEU rates below 10-10 errors/bit-day per the Microchip datasheet, keep payload logic functional without heavy triple module redundancy, saving gates and timing margin. The antifuse fabric eliminates configuration upsets entirely - a decisive advantage over SRAM FPGAs in orbit. The SL low-power process reduces static current for solar/battery power budgets, and the 624-pin CGA package supplies enough I/O for wide parallel data buses at -55C to +125C.
推薦
Spacecraft Telemetry, Tracking & Command (TT&C)
TT&C subsystems demand deterministic, always-on logic: the RTAX1000SL-1CGS624V is live at power-up thanks to its antifuse configuration, requiring no external boot PROM and no configuration load time - critical during launch and safe-mode events. The device implements command decoders, telemetry formatters, and watchdog logic across its 12,096 logic cells with chip-wide highway routing for global control signals. Operation from -55C to +125C covers eclipse-driven thermal swings, and the SEU-hardened flip-flops keep command paths immune to single-event upsets to the specified LET threshold. The CGA-624 ceramic package provides the mechanical robustness and solder-column reliability required for vibration-intensive launch environments.
推薦
Launch Vehicle Avionics
Launch-vehicle flight computers and stage-control electronics operate for minutes in an extreme vibration and radiation environment, where live-at-power-up and configuration immunity are non-negotiable. The RTAX1000SL-1CGS624V's antifuse interconnect cannot suffer configuration single-event upsets, and its SEU-hardened registers deliver SEU rates below 10-10 errors/bit-day, per the Microchip datasheet - well suited to short, high-reliability flights. Segmentable clocks support multiple redundant timing domains, and dedicated carry logic accelerates guidance arithmetic datapaths within the 1M-gate fabric. The ceramic column grid array withstands launch shock better than plastic BGA packaging, and the -1 speed grade covers typical avionics timing closure with margin.
推薦
Deep-Space Probe Instrument Control
Deep-space missions face total ionizing dose and upset environments far harsher than LEO, making the RTAX1000SL-1CGS624V's radiation-tolerant antifuse architecture a strong fit for instrument sequencing, detector timing, and science-data acquisition. The SL low-power process minimizes static draw when solar flux is weak at large heliocentric distances, directly extending mission power margins. Embedded SRAM with built-in FIFO control buffers instrument data bursts without external memory parts, reducing board-level component count and failure points. SEU-hardened registers eliminate mandatory triple module redundancy for many control paths, freeing logic for science functions within the 12,096 logic cells and 1M system gates. The EV screening variant is recommended for the most severe missions.
推薦
Space-Grade Glue Logic Integration
Radiation-tolerant designs historically consumed many rad-hard ASICs and SSI/MSI parts for bus interfacing, address decoding, and protocol adaptation. A single RTAX1000SL-1CGS624V integrates this scattered logic into one 624-pin CGA device, cutting component count, board area, and solder joints - each a reliability gain in space hardware. With 1,000,000 system gates, the device absorbs legacy bus bridges, memory controllers with FIFO control from embedded SRAM, and custom peripheral interfaces. Live-at-power-up behavior ensures the integrated logic is functional immediately at spacecraft power application, and the antifuse fabric's configuration immunity removes scrubbing infrastructure that glue-logic SRAM FPGAs would require. This consolidation approach shortens radiation design reviews compared with discrete rad-hard logic builds.
推薦
Space Imaging & Sensor Front-End Processing
CCD and CMOS imaging payloads on Earth-observation satellites use the RTAX1000SL-1CGS624V to generate precise detector timing, perform correlated double sampling control, and pack image data for downlink. The -1 speed grade plus dedicated carry logic handles pixel-rate arithmetic, while embedded SRAM FIFOs absorb bursts between the sensor interface and the mass-memory. SEU-hardened registers protect timing generators whose corruption would create defective imagery, achieving sub-10-10 errors/bit-day upset rates without full TMR per the Microchip datasheet. The 624 I/O positions accommodate wide parallel sensor heads, and the CGA ceramic package maintains signal integrity and mechanical stability across the -55C to +125C orbital thermal range, making it a proven choice on imaging missions.
推薦
推薦產品摘要
工程參考資料，適用於 RTAX1000SL-1CGS624V — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | RTAX1000SL-CGS624E | RTAX1000SL-1CGS624EV | RTAX1000S-1CGS624V | RTAX1000SL-1LG624V |
|---|---|---|---|---|---|
| Package | CGA-624 (CCGA), 624 pins | CGA-624 - same footprint | CGA-624 - same footprint | CGA-624 - same footprint | 624-position ceramic (LG) - verify column construction |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology (Actel/Microsemi) | Microchip Technology (Actel/Microsemi) | Microchip Technology (Actel/Microsemi) | Microchip Technology (Actel/Microsemi) |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Cells | 12096 | 12096 | 12096 | 12096 | 12096 |
| Screening Flow | V (radiation-tolerant flight) | E (standard/commercial) | EV (enhanced) | V (radiation-tolerant flight) | V (radiation-tolerant flight) |
| Static Power | Low (SL low-power process) | Low (SL process) | Low (SL process) | Higher (standard S process) | Low (SL process) |
主要差異化特點
- Low-power SL process for spacecraft power budgets (對比RTAX1000S-1CGS624V)
- Enhanced screening option available in same footprint (對比RTAX1000SL-1CGS624EV)
- Configuration immunity vs SRAM space FPGAs (對比SRAM-based rad-tolerant FPGAs (e.g. Xilinx Virtex-QV class))
設計說明
The RTAX1000SL is one-time programmable: antifuse programming is performed at a certified programming house, not in the lab or in orbit. Freeze and fully verify the design (timing simulation, radiation-relevant analysis) before submitting the programming file, and use prototype-stage parts (E-suffix, e.g. RTAX1000SL-CGS624E) for hardware validation. There is no field update path - a functional bug after flight-unit programming cannot be patched, only respun at significant cost and schedule impact.
The SL process option significantly reduces static current versus the standard RTAX1000S, which matters on solar/battery-limited spacecraft buses. When estimating mission power, account for the difference if your prototype used an S-variant: the S die draws measurably higher standby current. Obtain per-device static current figures from the Microchip RTAX-S/SL datasheet tables for your voltage and temperature corner (-55C to +125C) rather than extrapolating from commercial FPGA experience.
The CGA-624 (ceramic column grid array) uses solder columns rather than solder balls, providing compliance for CTE mismatch between the ceramic package and the PCB during thermal cycling from -55C to +125C. Design the land pattern to the column geometry specified in the Microchip packaging section (not standard BGA ball pads), and for high-reliability assembly consider underfill or staking per your house assembly standard. Verify reflow profiles against the ceramic package's thermal mass, which exceeds plastic-packaged FPGAs.
合規資訊
Space-grade ceramic-packaged device; RoHS/REACH exemptions typical for aerospace hermetic packages apply but were not stated in the provided data.
