XC7A75T-2FGG484I - Artix-7 FPGA, 75K Logic Cells | AMD
MPN： XC7A75T-2FGG484I ✓ 啟用中XC7A75T-2FGG484I 概覽
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device that implements digital logic by configuring a fabric of LUTs, flip-flops, block RAM, and DSP slices through a bitstream. FPGAs fill the design gap between ASSPs and ASICs: they provide parallel execution, low-latency I/O, and field upgradeability. In a system hierarchy, the FPGA often sits beside an embedded processor, handling high-throughput signal conditioning while the processor runs control stacks.
Key features of the XC7A75T-2FGG484I include 3,870,720 block RAM bits, 285 versatile user I/Os with LVCMOS/LVDS and other standard interfaces, and integrated clock management tiles containing MMCM and PLL circuits. The FGG484 package enables easy migration between selected Artix-7 family members, reducing redesign risk when scaling density. All packages are lead-free (Pb-free) options.
The Artix-7 architecture is optimized for low-power, cost-sensitive applications while retaining DDR3/DDR4 memory interfaces, multi-gigabit transceivers where available, and PCIe hard blocks in larger devices. The 28nm high-k metal gate process balances static and dynamic power. Designers use AMD Vivado Design Suite for synthesis, implementation, and bitstream generation, with support for IP cores such as MIG, AXI interconnects, and error correction.
Typical applications for the XC7A75T-2FGG484I include industrial motor control and factory automation, software-defined radio baseband processing, machine vision and video pipelines, medical imaging front ends, and test and measurement instrumentation. The industrial temperature range makes it suitable for harsh environments in transportation, energy, and rugged communications.
When designing with this FPGA, pay close attention to power integrity: decouple the 1.0V VCCINT rail with multiple low-ESR ceramic capacitors and follow AMD's PCB design recommendations. The FGG484 package must be assembled with proper BGA reflow profiles, and the JTAG/configuration pins should be made accessible for system-level debug and field updates.
直接替換替代品，適用於 XC7A75T-2FGG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7A75T-2FGG484I （相同外形與佔位） — 差異在於 Logic Cells, Block RAM, Core Supply Voltage, Process Technology, Package.
XC7A75T-2FGG484C
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A75T-1FGG484I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC7A75T-1FGG484C
✅ 直接替換📋 參考替代品（不在目錄中）
XA7A75T-1FGG484Q
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A100T-2FGG484I
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$45.9375 / 單位
查看資料表 →XC7A50T-2FGG484I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC7A75T-2FGG484I 最大額定值與電氣特性
| Family | Artix-7 |
| Logic Cells | 75520 |
| User I/O | 285 |
| Block RAM | 3870720 bits |
| 封裝 | 484-ball FBGA (FGG484) |
| Process Technology | 28nm CMOS |
| Core Supply Voltage | 1 V |
| Speed Grade | -2 |
| 工作溫度 | -40C to +100C (industrial) |
| Clock Management | MMCM and PLL |
| I/O Standards | LVCMOS, LVDS and others |
| 安裝類型 | Surface Mount (BGA) |
| Lead Free | Yes (Pb-free package) |
| Design Software | AMD Vivado Design Suite |
XC7A75T-2FGG484I 腳位配置
| 腳位 A2 | VCCINT — 1.0V core supply |
| 腳位 B1 | GND — Ground |
| 腳位 F2 | VCCAUX — 1.8V auxiliary supply |
| 腳位 H4 | TCK — JTAG test clock |
| 腳位 H5 | TDI — JTAG test data in |
| 腳位 J4 | TDO — JTAG test data out |
| 腳位 J5 | TMS — JTAG test mode select |
| 腳位 K4 | IO_LxxP — User I/O bank 13 (example LVDS P pair) |
| 腳位 K5 | IO_LxxN — User I/O bank 13 (example LVDS N pair) |
| 腳位 L2 | CCLK — Configuration clock |
| 腳位 M1 | DONE — Configuration done indicator |
| 腳位 M2 | PROGRAM_B — Configuration reset (active low) |
典型應用
XC7A75T-2FGG484I 適用於 6 應用s: Industrial Motor Control and Factory Automation, Software-Defined Radio Baseband, Machine Vision and Video Pipelines, Medical Imaging Front Ends, Test and Measurement Instrumentation, Rugged Communications and Transportation.
Industrial Motor Control and Factory Automation
The XC7A75T-2FGG484I fits industrial motor control because its 285 user I/Os and 75,520 logic cells let engineers implement multi-axis PWM generation, encoder decoding, and safety interlocks in parallel with deterministic latency. The industrial -40C to +100C rating survives cabinet environments near drives and hot factories. Placed as a real-time co-processor beside a main controller, it closes high-speed current loops in the fabric while the host runs supervisory logic; the -2 speed grade provides timing margin for dense PWM and filter pipelines at high switching frequencies.
推薦
Software-Defined Radio Baseband
For SDR, the XC7A75T-2FGG484I supplies 3,870,720 block RAM bits for buffering ADC/DDC streams and abundant DSP-friendly fabric for filters and mixers at baseband rates. The 28nm process keeps static power low for radio units with thermal budgets, while the FGG484 package offers enough I/O to attach wide parallel LVDS ADC and DAC buses. Designers typically pair the device with high-speed data converters and use Vivado IP for channelization; the -2 speed grade sustains the parallel sample pipelines demanded by modern wideband receivers.
推薦
Machine Vision and Video Pipelines
The XC7A75T-2FGG484I suits machine vision because its block RAM and fabric can implement image preprocessing, frame buffering, and camera-protocol bridges (such as parallel/LVDS sensor interfaces) with line-rate latency. The 285 I/Os handle sensor, memory, and display connections without external glue logic, and the industrial temperature range suits factory-floor enclosures. Implemented with DDR3 memory via Vivado MIG IP, the FPGA pipelines pixel operations deterministically; the -2 grade gives setup margin for high pixel-clock paths in 1080p-class inspection systems.
推薦
Medical Imaging Front Ends
Medical ultrasound and imaging front ends benefit from the XC7A75T-2FGG484I's ability to aggregate multiple ADC channels over LVDS, apply beamforming and filtering in fabric, and stream results to a processor. The 3.87 Mbit of block RAM supports per-channel sample buffering, while the 28nm process limits power in fanless enclosures. The industrial temperature grade tolerates extended warm environments typical of imaging hardware; the -2 speed grade provides the parallel timing headroom needed for high-channel-count coherent processing paths.
推薦
Test and Measurement Instrumentation
Bench and modular instruments use the XC7A75T-2FGG484I for real-time triggering, protocol generation, and data-path acceleration. Its 285 I/Os interface to front-end converters, relays, and backplane connectors, and MMCM/PLL tiles generate low-jitter sample clocks across multiple domains. The industrial -40C to +100C rating supports calibration-tolerant thermal environments, and Vivado IP accelerates instrument firmware development. The FGG484 footprint also allows seamless migration to XC7A100T when instrument channel density grows.
推薦
Rugged Communications and Transportation
The XC7A75T-2FGG484I is used in rugged radios, railway, and energy-infrastructure equipment where the -40C to +100C industrial grade and Pb-free FGG484 package meet environmental requirements. The fabric implements framing, FEC, and interface bridging with deterministic latency, while 75,520 logic cells accommodate multi-protocol support in a single device. Combined with isolated transceivers and wide-input power modules, the FPGA forms the digital core of systems exposed to vibration, temperature cycling, and noisy electrical environments in the field.
推薦
推薦產品摘要
工程參考資料，適用於 XC7A75T-2FGG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7A75T-2FGG484C | XC7A75T-1FGG484I | XC7A100T-2FGG484I |
|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484) | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Logic Cells | 75520 | 75520 | 75520 | 101440 |
| Speed Grade | -2 | -2 | -1 | -2 |
| User I/O | 285 | 285 | 285 | 285 |
| Block RAM (bits) | 3870720 | 3870720 | 3870720 | 4838400 |
| Temperature Range | -40C to +100C (I) | 0C to +85C (C) | -40C to +100C (I) | -40C to +100C (I) |
| Core Voltage | 1 V | 1 V | 1 V | 1 V |
主要差異化特點
- Industrial temperature grade at -2 speed (對比XC7A75T-2FGG484C)
- Fastest standard speed grade (對比XC7A75T-1FGG484I)
- Footprint-compatible migration to higher density (對比XC7A100T-2FGG484I)
設計說明
Decouple the 1.0V VCCINT rail with multiple low-ESR ceramic capacitors placed directly beneath the FGG484 package on via-in-pad connections. Follow AMD power distribution guidance (UG583) for rail sequencing and PDN impedance targets; VCCAUX at 1.8V and each VCCO bank also require local decoupling sized to bank transient current. Artix-7 power varies strongly with toggle rate, so run the Vivado power estimator with post-implementation activity data before finalizing the regulator selection.
The 484-ball FBGA requires a controlled reflow profile per the package assembly specification, with solder paste inspection on the 0.8mm or finer ball pitch land pattern. Route high-speed LVDS pairs with 100-ohm differential impedance and length matching. Use the AMD package pinout files (UG475 CSV/TXT) for symbol and footprint creation rather than hand-drawing the 484-ball map to avoid ball-mapping errors.
Make JTAG (TCK, TDI, TDO, TMS) and configuration pins (CCLK, DONE, PROGRAM_B) accessible via header for Vivado hardware debug and field bitstream updates - burying them forces full board rework on configuration faults. Verify speed-grade timing closure in Vivado before committing to the -2 SKU in production; migrating later between -1 and -2 is electrically drop-in but not timing-identical.
合規資訊
Lead-free (Pb-free) FGG484 package per AMD data and distributor listings (LCSC, DigiKey). REACH, halogen-free, and conflict minerals status not stated in provided data.
