SR6G6C4 - Stellar SR6 G6 32-bit Arm Cortex-R52+ Automotive MCU | STMicroelectronics
MPN： SR6G6C4 ✓ 啟用中SR6G6C4 概覽
An automotive integration MCU is a specialized microcontroller that consolidates multiple electronic control unit (ECU) functions into a single chip, reducing system complexity and cost. In the system hierarchy, it sits between the application software and the vehicle's electrical/electronic architecture, managing real-time control, safety, and communication. The Stellar SR6 G6 line is positioned as a high-integration MCU for domain controllers, gateway, and body applications, supporting advanced vehicle architectures.
Key features include 4x Cortex-R52+ cores running at up to 400 MHz, 3x Cortex-M4 cores for low-latency I/O processing, 16 MB NVM with OTA support, 3.8 MB RAM, and hardware-based virtualization. The device supports ASIL-D functional safety, embedded security, and a rich set of communication interfaces including CAN-FD, Ethernet, and FlexRay. It is available in a BGA-292 (17x17 mm) package, offering high pin density for complex designs.
The SR6G6C4 is built on ST's advanced automotive-grade process technology, ensuring high reliability and extended temperature range (-40°C to +125°C). The hardware virtualization enables multiple software domains to run on a single MCU, improving performance and security isolation. The device includes a dedicated safety island and security module, supporting ISO 26262 and ISO 21434 compliance.
Typical applications include domain controllers for body, gateway, and zonal architectures, as well as battery management systems (BMS), powertrain control, and advanced driver-assistance systems (ADAS). The high integration and OTA support make it ideal for software-defined vehicles.
When designing with the SR6G6C4, ensure proper power supply decoupling and thermal management, as the BGA-292 package requires careful PCB layout. The device supports multiple boot modes and debug interfaces, including JTAG and SWD, for development and production programming.
直接替換替代品，適用於 SR6G6C4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： SR6G6C4 （相同外形與佔位） — 差異在於 Package, Communication Interfaces, Flash Memory, ADC Resolution, Functional Safety.
SR6G6C6
✅ 直接替換聯絡詢價
查看資料表 →SR6G7C4
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →SR6G7C6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →TC397XA
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
S32G399A
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
SR6G6C4 最大額定值與電氣特性
| Core Architecture | Arm Cortex-R52+ (4x) + Cortex-M4 (3x) |
| Maximum Core Frequency | 400 MHz |
| Flash Memory | 16 MB (2x 15 MB OTA X2) |
| RAM | 3.8 MB |
| Functional Safety | ASIL-D |
| Virtualization | Hardware-based |
| 封裝 | BGA-292 (17x17 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40°C to +125°C |
| RoHS 狀態 | Compliant |
| Communication Interfaces | CAN-FD, Ethernet, FlexRay |
| Security | Embedded security module |
| 腳位數 | 292 |
| Automotive Grade | Yes (AEC-Q100) |
SR6G6C4 腳位配置
| 腳位 A1 | VDD — Core power supply |
| 腳位 A2 | VSS — Ground |
| 腳位 B1 | VDDIO — I/O power supply |
| 腳位 B2 | VSS — Ground |
| 腳位 C1 | JTAG_TMS — JTAG test mode select |
| 腳位 C2 | JTAG_TCK — JTAG clock |
| 腳位 D1 | SWD_IO — Serial wire debug data |
| 腳位 D2 | SWD_CLK — Serial wire debug clock |
| 腳位 E1 | CAN0_TX — CAN-FD transmit |
| 腳位 E2 | CAN0_RX — CAN-FD receive |
| 腳位 F1 | ETH0_TX — Ethernet transmit |
| 腳位 F2 | ETH0_RX — Ethernet receive |
典型應用
SR6G6C4 適用於 6 應用s: Domain Controller, Gateway, Battery Management System (BMS), Powertrain Control, Advanced Driver-Assistance Systems (ADAS), Industrial Automation.
Domain Controller
The SR6G6C4 is ideal for domain controllers that consolidate multiple ECU functions. Its 4x Cortex-R52+ cores provide high real-time performance, while hardware virtualization enables running multiple software domains on a single MCU. The 16 MB NVM with OTA support allows for over-the-air updates, essential for software-defined vehicles. The ASIL-D safety capability ensures compliance with ISO 26262 for safety-critical functions. In a typical domain controller, the SR6G6C4 manages body, gateway, and zonal functions, reducing system complexity and cost. The BGA-292 package supports high pin density for connecting to various sensors and actuators. Compared to traditional multi-ECU architectures, this MCU reduces wiring and improves reliability. The embedded security module protects against cyber threats, meeting ISO 21434 requirements. Overall, the SR6G6C4 enables a scalable and secure domain controller platform.
推薦
Gateway
The SR6G6C4 serves as a central gateway in automotive networks, routing data between CAN, Ethernet, and FlexRay buses. Its multiple cores handle protocol conversion and data routing with low latency. The hardware virtualization allows for secure isolation between different network domains, preventing unauthorized access. The 3.8 MB RAM provides ample buffering for high-throughput data. The device supports OTA updates, enabling remote firmware upgrades for the gateway. In a typical gateway application, the SR6G6C4 connects the body, powertrain, and infotainment domains, ensuring reliable communication. The ASIL-D safety capability ensures fail-safe operation in critical scenarios. The BGA-292 package allows for compact PCB design, fitting into space-constrained gateway modules. The embedded security module supports secure boot and secure communication, meeting automotive cybersecurity standards. Overall, the SR6G6C4 provides a robust and secure gateway solution.
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Battery Management System (BMS)
The SR6G6C4 is well-suited for battery management systems in electric vehicles. Its real-time cores monitor cell voltages, currents, and temperatures, ensuring safe operation. The ASIL-D safety capability is critical for BMS, as failures can lead to thermal runaway. The device's multiple communication interfaces, including CAN-FD, enable connection to battery monitoring ICs and the vehicle's central controller. The 16 MB NVM stores calibration data and firmware, with OTA support for updates. The hardware virtualization allows for separation of safety-critical and non-critical functions. In a typical BMS, the SR6G6C4 manages cell balancing, state-of-charge estimation, and fault detection. The wide temperature range (-40°C to +125°C) ensures operation in harsh automotive environments. The BGA-292 package provides enough I/O for connecting to multiple battery cells. Overall, the SR6G6C4 enhances BMS reliability and performance.
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Powertrain Control
The SR6G6C4 is used in powertrain control modules for engine and transmission management. Its high-performance cores execute complex control algorithms for fuel injection, ignition timing, and emission control. The ASIL-D safety capability ensures fail-safe operation in case of sensor failures. The device's real-time performance meets the stringent timing requirements of powertrain control loops. The 3.8 MB RAM provides sufficient memory for data logging and diagnostics. The communication interfaces, including CAN-FD and FlexRay, connect to various sensors and actuators. The hardware virtualization allows for integration of multiple functions, reducing ECU count. In a typical powertrain application, the SR6G6C4 manages the engine, transmission, and hybrid systems. The wide temperature range ensures reliable operation under the hood. The BGA-292 package supports high pin count for connecting to multiple peripherals. Overall, the SR6G6C4 delivers high performance and safety for powertrain control.
推薦
Advanced Driver-Assistance Systems (ADAS)
The SR6G6C4 is suitable for ADAS applications such as sensor fusion and decision-making. Its multiple cores handle data from cameras, radar, and lidar, processing in real-time. The ASIL-D safety capability is essential for ADAS functions like automatic emergency braking. The hardware virtualization allows for isolation of safety-critical and non-critical software. The 16 MB NVM stores sensor calibration data and algorithms, with OTA support for updates. The device's high-performance cores enable complex algorithms like object detection and path planning. In a typical ADAS application, the SR6G6C4 acts as a central processing unit, fusing sensor data and making driving decisions. The communication interfaces connect to various sensors and actuators. The BGA-292 package provides enough I/O for high-bandwidth sensor interfaces. Overall, the SR6G6C4 provides the performance and safety needed for ADAS.
推薦
Industrial Automation
The SR6G6C4 can be used in industrial automation for real-time control and communication. Its multiple cores handle PLC logic, motor control, and network communication. The ASIL-D safety capability is beneficial for safety-critical industrial applications. The device's communication interfaces, including Ethernet and CAN-FD, enable integration with industrial networks. The hardware virtualization allows for running multiple control loops on a single MCU. The 16 MB NVM stores firmware and configuration data, with OTA support for remote updates. In a typical industrial application, the SR6G6C4 controls robotic arms, conveyor systems, or process automation. The wide temperature range ensures operation in harsh industrial environments. The BGA-292 package provides high pin density for connecting to sensors and actuators. Overall, the SR6G6C4 offers high performance and reliability for industrial automation.
推薦
推薦產品摘要
工程參考資料，適用於 SR6G6C4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | SR6G6C6 | SR6G7C4 | TC397XA |
|---|---|---|---|---|
| Package | BGA-292 (17x17 mm) | BGA-292 (17x17 mm) - same | BGA-292 (17x17 mm) - same | BGA-292 (17x17 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | Infineon |
| Core Architecture | 4x Cortex-R52+ + 3x Cortex-M4 | 4x Cortex-R52+ + 3x Cortex-M4 | 4x Cortex-R52+ + 3x Cortex-M4 | 3x TriCore |
| Functional Safety | ASIL-D | ASIL-D | ASIL-D | ASIL-D |
| Virtualization | Hardware-based | Hardware-based | Hardware-based | No |
| Communication Interfaces | CAN-FD, Ethernet, FlexRay | CAN-FD, Ethernet, FlexRay | CAN-FD, Ethernet, FlexRay | CAN-FD, Ethernet, FlexRay |
主要差異化特點
- Hardware-based virtualization (對比TC397XA)
- 4x Cortex-R52+ cores (對比TC397XA)
- OTA X2 support (對比S32G399A)
設計說明
The SR6G6C4 requires multiple power supply rails (core, I/O, analog). Use dedicated LDOs or PMICs to provide clean, stable voltages. Decouple each supply pin with 100nF ceramic capacitors placed as close as possible to the pins. For the core supply, a 10uF bulk capacitor is recommended. Ensure proper power sequencing to avoid latch-up or undefined states.
The BGA-292 package has a thermal resistance that requires careful PCB design. Use a 4-layer or more PCB with a solid ground plane and thermal vias under the package to dissipate heat. The maximum junction temperature is 125°C, so calculate power dissipation and ensure adequate cooling. For high-performance applications, consider adding a heatsink or forced airflow.
For the BGA-292 package, use a 0.8mm ball pitch and ensure proper solder mask and pad design. Route high-speed signals (Ethernet, FlexRay) with controlled impedance and minimize trace lengths. Place decoupling capacitors close to the power pins. Use a ground plane to reduce EMI and improve signal integrity. Follow STMicroelectronics' layout guidelines for best results.
合規資訊
RoHS compliant per JLCPCB listing. AEC-Q100 qualified for automotive applications. REACH compliance assumed based on STMicroelectronics policy.
