TLE92633BQXXUMA2 - Mid-Range+ SBC, 5V/3.3V LDO, CAN FD, LIN | Infineon
MPN： TLE92633BQXXUMA2 ✓ 啟用中TLE92633BQXXUMA2 概覽
A System Basis Chip (SBC) is a highly integrated power management and communication IC for automotive ECUs that combines a voltage regulator with transceivers for in-vehicle networking, typically CAN and LIN. Within the broader hierarchy, SBCs sit above standalone LDOs and standalone CAN/LIN transceivers, and below complete Automotive Power Management ICs (PMICs); by consolidating these functions on one die, SBCs reduce PCB area, quiescent current, and BOM cost in body controllers, gateways, and sensor nodes.
The TLE92633BQXXUMA2 features a 5V LDO (and a 3.3V LDO variant in the family), high-speed CAN FD with bus wake-up capability, two LIN transceivers, an integrated watchdog timer with multiple window modes, and a typical quiescent current of approximately 3.5mA. The PG-VQFN-48-79 exposed-pad package enables robust thermal performance for the harsh automotive under-hood environment and supports surface-mount manufacturing flows.
Typical applications include automotive body control modules (BCMs), central gateway ECUs, HVAC controllers, seat and door zone modules, and sensor/ECU nodes that communicate over CAN FD or LIN. The wide 3V to 28V input range tolerates load-dump and jump-start transients typical of 12V automotive power nets, and the watchdog supports ASIL-rated system architectures.
When designing with this SBC, follow Infineon's PCB layout guidance for the exposed pad to keep junction temperature within the -40C to +150C automotive range, and choose the appropriate LDO variant (5V or 3.3V) for the downstream microcontroller core voltage.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes for the TLE92633BQXXUMA2 not consolidated in the manufacturer datasheet alone.
直接替換替代品，適用於 TLE92633BQXXUMA2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： TLE92633BQXXUMA2 （相同外形與佔位） — 差異在於 Package, Product Type, AEC-Q100 Qualification, MSL Level, Interface.
TLE9263BQX
✅ 直接替換📋 參考替代品（不在目錄中）
TLE9263-3BQX
✅ 直接替換📋 參考替代品（不在目錄中）
TLE92623BQXXUMA2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →TLE92783BQX
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
TLE92633BQXUMA2
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
TLE92633BQXXUMA2 最大額定值與電氣特性
| Product Type | System Basis Chip (SBC) PMIC |
| Family | OPTIREG Mid-Range+ |
| 輸入電壓範圍 | 3 V to 28 V |
| Integrated LDOs | 5 V LDO (3.3 V in family variants) |
| CAN Interface | CAN FD high-speed transceiver with bus wake-up |
| LIN Interface | Two LIN transceivers |
| Watchdog | Integrated watchdog, multiple window modes |
| Typical Quiescent Current | 3.5 mA |
| 工作溫度範圍 | -40 C to +150 C (junction) |
| 封裝 | PG-VQFN-48-79 (48-VFQFN exposed pad) |
| 安裝類型 | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Target Application | Automotive CAN-LIN body and gateway ECUs |
| RoHS 狀態 | Compliant |
| AEC-Q100 Qualification | Automotive grade |
TLE92633BQXXUMA2 pg-vqfn-48-79 (48-vfqfn exposed pad) 腳位配置指南
TLE92633BQXXUMA2（pg-vqfn-48-79 (48-vfqfn exposed pad) 封裝）的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝，請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。
無詳細腳位定義資料： TLE92633BQXXUMA2.
請參閱 資料表 以查看完整腳位配置。
典型應用
TLE92633BQXXUMA2 適用於 6 應用s: Automotive Body Control Module (BCM), Central Gateway ECU, HVAC Control Module, Door/Seat Zone Module, Sensor/ECU Node (LIN Slave), Automotive Lighting Module (LIN-driven).
Automotive Body Control Module (BCM)
The TLE92633BQXXUMA2 is well-suited for 12V automotive body control modules because it consolidates a 5V LDO, a 3.3V LDO, and CAN FD plus dual LIN transceivers into a single PG-VQFN-48-79 chip. This reduces the BCM PCB area by approximately 30 percent versus discrete regulator-plus-transceiver solutions, and the 3V to 28V input range handles 12V cranking and load-dump events per ISO 7637. The integrated watchdog with multiple window modes supports ASIL-rated system architectures used in BCMs.
推薦
Central Gateway ECU
In automotive central gateway ECUs that bridge CAN FD and LIN subnetworks, the TLE92633BQXXUMA2 provides both network interfaces plus the microcontroller power rails from a single 12V battery source. The CAN FD transceiver supports bit rates up to 5 Mbit/s for high-bandwidth gateway traffic, while the dual LIN transceivers serve body and comfort sub-buses. The integrated 5V/3.3V LDOs power the gateway MCU directly, eliminating external PMICs and reducing BOM cost.
推薦
HVAC Control Module
The TLE92633BQXXUMA2 powers HVAC control modules that communicate with the vehicle body network over CAN FD or LIN. Its -40C to +150C junction temperature range handles the under-dash thermal environment, while the integrated watchdog supports fault recovery for safety-relevant HVAC functions. The 3.5mA typical quiescent current keeps battery drain low during parked-vehicle states, important for always-on HVAC features.
推薦
Door/Seat Zone Module
Door and seat zone modules require compact integration of LIN communication, sensor power, and actuator drive logic, all powered from the 12V battery. The TLE92633BQXXUMA2 fits this role with its dual LIN channels and dual LDO outputs, occupying less than 50 mm^2 of PCB area including passives. The PG-VQFN-48-79 package's exposed pad enables sustained operation in the door cavity's elevated ambient temperatures.
推薦
Sensor/ECU Node (LIN Slave)
For LIN-slave sensor nodes (e.g., rain-light, ambient temperature, or occupancy sensors), the TLE92633BQXXUMA2 provides the LIN physical layer plus 5V/3.3V rails to power the sensor MCU and analog front end from the 12V vehicle bus. Its bus-wake capability allows the sensor to wake the rest of the network when needed, supporting partial-networking strategies that reduce quiescent drain across the vehicle.
推薦
Automotive Lighting Module (LIN-driven)
LED headlamp or tail-lamp modules that communicate over LIN benefit from the TLE92633BQXXUMA2's combined power and communications integration. The 5V LDO can supply a companion LED driver (e.g., ILD8150EXUMA1), while the 3.3V LDO powers the lighting MCU. The 3V to 28V input range tolerates the load-dump pulses that occur on the 12V battery during alternator-load switching events.
推薦
推薦產品摘要
工程參考資料，適用於 TLE92633BQXXUMA2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | TLE9263BQX | TLE9263-3BQX | TLE92623BQXXUMA2 | TLE92783BQX |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-VQFN-48-79 | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same |
| Input Voltage Range | 3 V to 28 V | 3 V to 28 V | 3 V to 28 V | 3 V to 28 V | 3 V to 28 V |
| 5V LDO | Yes | Yes | Yes | Yes | Yes |
| 3.3V LDO | Yes | No | Yes | Yes | Yes |
| CAN FD Transceiver | Yes | Yes | Yes | Yes | Yes |
| LIN Transceivers | 2 | 2 | 2 | 1 | 2 |
| Watchdog | Yes (multi-window) | Yes (multi-window) | Yes (multi-window) | Yes (multi-window) | Yes (multi-window) |
| Automotive Grade (AEC-Q100) | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Dual LDO outputs (5V + 3.3V) in single SBC (對比TLE9263BQX)
- Dual LIN transceivers for body-network zoning (對比TLE92623BQXXUMA2)
- Same-package mid-range+ SBC family scalability (對比TLE92783BQX)
設計說明
Solder the exposed thermal pad of the PG-VQFN-48-79 package to a continuous PCB land with at least 16 thermal vias to the inner ground plane. At full CAN FD bus-load and continuous LDO current, internal dissipation can reach approximately 0.7W; without thermal vias, the junction-to-ambient resistance rises above 50 C/W and can exceed the -40C to +150C automotive rating in underhood environments.
Keep the CANH/CANL traces as a differential pair with 100-ohm impedance, and place a common-mode choke within 5 mm of the IC pins to meet automotive EMC requirements per IEC 61967. Decouple VS with a 100nF ceramic close to the IC plus a 10uF electrolytic bulk capacitor within 10 mm to absorb load-dump energy. Decouple each LDO output with a 2.2uF X7R ceramic.
Do not operate the TLE92633BQXXUMA2 below 3V on VS without ensuring the 5V LDO output has dropped out first; the integrated reset circuit may assert unexpectedly during slow VBAT ramps. For LIN bus wake-up to function, the WK pin must be configured per the Infineon TLE9263 family datasheet; a floating WK pin prevents bus wake from reaching the MCU.
Route the CAN and LIN signals on the top layer with a continuous ground reference plane below; avoid routing these traces across plane splits which can increase common-mode emissions. Place the IC's exposed pad on a top-layer copper pour that is stitch-bonded to the inner ground plane with a 4x4 via grid to minimize thermal and EMI impedance simultaneously.
合規資訊
RoHS compliant per distributor listings. AEC-Q100 qualified for automotive use; the -Q suffix in ordering codes indicates the automotive-qualified test flow per Infineon's product naming convention.
