TM4E123GH6ZRBI7 - 80MHz ARM Cortex-M4F MCU, 256KB Flash | TI
MPN： TM4E123GH6ZRBI7 ✓ 啟用中TM4E123GH6ZRBI7 概覽
Key features include 8 UARTs, 4 I2C modules, 4 SSI/SPI controllers, 2 CAN 2.0 A/B controllers, a 12-bit 2-MSPS ADC with 24 analog inputs, two analog comparators, and a 16-bit PWM timer block with up to 32 PWM outputs. The device operates from 3.3 V (LDO regulation on-chip), supports industrial -40C to +85C temperature ranges, and integrates a JTAG/SWD debug interface. The 157-ball BGA package provides compact routing for high-pin-count designs.
The TM4E123GH6ZRBI7 sits within the broader category hierarchy: ARM Cortex-M4F microcontroller -> ARM Cortex-M -> 32-bit microcontroller (MCU) -> microcontroller -> embedded processor -> semiconductor. This taxonomy helps engineers locate the part within the TI ecosystem and competing Cortex-M portfolios from NXP, STMicroelectronics, and Microchip.
The architecture combines ARM Cortex-M4F core with TI's peripheral driver library and StellarisWare-compatible APIs. The deterministic interrupt controller provides 7 priority levels with tail chaining, reducing interrupt latency for real-time control. Hardware CRC and a random-number generator support communications protocols requiring data integrity verification.
Typical applications include industrial motor control, factory automation, building HVAC, programmable logic controllers (PLCs), sensor aggregation hubs, and human-machine interface (HMI) panels. The 80 MHz core with FPU delivers sufficient throughput for closed-loop PID control while the BGA package suits space-constrained PCB designs with high I/O density.
When designing with this part, ensure the BGA's thermal vias are properly stitched to internal ground planes for heat dissipation. Allocate sufficient PCB layers for signal escape routing on the 157-ball array, and use the on-chip LDO regulator mode by tying the VDD25 rail to the internal 2.5 V output.
This page synthesizes distributor pricing, drop-in Tiva C Series alternatives, and practical design notes beyond the manufacturer datasheet, giving engineers a single source for selection and sourcing decisions.
直接替換替代品，適用於 TM4E123GH6ZRBI7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： TM4E123GH6ZRBI7 （相同外形與佔位） — 差異在於 ADC, Core Architecture, FPU, Mounting Type, PWM Outputs.
TM4E123GH6ZRBIR
✅ 直接替換📋 參考替代品（不在目錄中）
TM4C123GH6ZRB
✅ 直接替換📋 參考替代品（不在目錄中）
TM4C1237H6PZI
✅ 直接替換聯絡詢價
查看資料表 →TM4E123GH6ZRBI7 最大額定值與電氣特性
| Core Architecture | ARM Cortex-M4F |
| CPU Clock Speed (Max) | 80 MHz |
| Program Memory (Flash) | 256 KB |
| SRAM | 32 KB |
| Operating Voltage | 3.3 V (with on-chip 2.5 V LDO) |
| 封裝 | 157-ball BGA (ZRBI) |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | -40C to +85C (industrial) |
| UART | 8 |
| I2C | 4 |
| SSI/SPI | 4 |
| CAN 2.0 A/B | 2 |
| ADC | 12-bit, 2 MSPS, 24 analog input channels |
| PWM Outputs | 16 (with extended mode options) |
| Analog Comparators | 2 |
| FPU | Yes (single-precision IEEE 754) |
| Debug Interface | JTAG / Serial Wire Debug (SWD) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
TM4E123GH6ZRBI7 157-ball bga (zrbi) 腳位配置指南
TM4E123GH6ZRBI7（157-ball bga (zrbi) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： TM4E123GH6ZRBI7.
請參閱 資料表 以查看完整腳位配置。
典型應用
TM4E123GH6ZRBI7 適用於 6 應用s: Industrial Motor Control, Factory Automation and PLCs, Building HVAC and Climate Control, Human-Machine Interface (HMI) Panels, Sensor Aggregation Hubs and IoT Gateways, Precision Test and Measurement Instruments.
Industrial Motor Control
The TM4E123GH6ZRBI7 is well-suited for industrial motor control because its 80 MHz ARM Cortex-M4F core with FPU executes closed-loop PID math in microseconds, while hardware PWM generates up to 16 complementary outputs for three-phase inverter switching. Its 12-bit 2-MSPS ADC samples phase currents across 24 channels at the bandwidth needed for field-oriented control, and quadrature encoder inputs handle position feedback from BLDC servos. The on-chip CAN 2.0 controllers provide robust fieldbus communication with other drives on the factory floor. Designers should pair this MCU with gate drivers like the TI DRV8301 for a tightly integrated motor drive solution.
推薦
Factory Automation and PLCs
In factory automation, the TM4E123GH6ZRBI7 acts as the control brain of a small PLC or sensor aggregation node, leveraging 8 UARTs to bridge RS-485 Modbus segments, 2 CAN 2.0 ports for industrial fieldbus, and 4 I2C channels for digital sensor expansion. The 256 KB Flash stores ladder-logic interpreters or IEC 61131-3 runtimes, and the deterministic interrupt controller guarantees worst-case response times for safety interlocks. The 157-ball BGA footprint accommodates high-density PCB routing for multi-axis controllers, while the -40C to +85C industrial temperature rating tolerates cabinet environments.
推薦
Building HVAC and Climate Control
Building HVAC systems benefit from the TM4E123GH6ZRBI7's combination of analog and digital peripherals, with 24 ADC inputs reading temperature and pressure sensors while PWM outputs drive variable-speed fans and damper actuators. The FPU accelerates thermal-model calculations for energy-efficient control loops, and CAN or RS-485 connectivity integrates with building management systems (BMS) using BACnet or Modbus protocols. Low-power sleep modes down to microamp-level standby extend battery life in wireless sensor nodes, while the industrial temperature rating covers rooftop equipment enclosures.
推薦
Human-Machine Interface (HMI) Panels
HMI panels with TFT LCD touchscreens can use the TM4E123GH6ZRBI7 as the main graphics controller, driving displays through its SSI/SPI peripherals while the Cortex-M4F core runs lightweight graphics libraries and touch event processing. The 256 KB Flash and 32 KB SRAM budget support mid-resolution UIs, and the hardware CRC accelerator validates touch-panel firmware updates. Industrial temperature tolerance plus the BGA package's small footprint suit compact panel designs where space is at a premium.
推薦
Sensor Aggregation Hubs and IoT Gateways
The TM4E123GH6ZRBI7 aggregates sensor data from multiple buses into a single gateway, with 8 UARTs handling Modbus RTU slaves, 4 I2C buses connecting digital sensors, and 2 CAN interfaces bridging automotive or industrial networks. The Cortex-M4F core pre-processes and compresses data before forwarding over Ethernet or wireless links, while hardware AES encryption (via software libraries) secures transit data. The 256 KB Flash stores gateway protocol stacks, and the BGA footprint suits multi-bus PCBs requiring extensive signal escape.
推薦
Precision Test and Measurement Instruments
Bench instruments like data loggers and oscilloscope front-ends use the TM4E123GH6ZRBI7 for its 12-bit 2-MSPS ADC to capture fast analog signals, its FPU for FFT and DSP-style signal processing, and its deterministic interrupt controller for precise sample timing. The 8 UARTs connect to PC hosts or display modules, and the abundant GPIO enables direct interface to keypad and LCD subsystems. The BGA package keeps the PCB compact for portable instrument form factors.
推薦
推薦產品摘要
工程參考資料，適用於 TM4E123GH6ZRBI7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | TM4E123GH6ZRBIR | TM4C123GH6ZRB | TM4C1237H6PZI |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 157-ball BGA (ZRBI) | 157-ball BGA (ZRBI) - same | 157-ball BGA (ZRBI) - same | 157-ball BGA (ZRBI) - same |
| Core | ARM Cortex-M4F @ 80 MHz | ARM Cortex-M4F @ 80 MHz | ARM Cortex-M4F @ 80 MHz | ARM Cortex-M4F @ 80 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB |
| UART / I2C / SPI | 8 / 4 / 4 | 8 / 4 / 4 | 8 / 4 / 4 | 8 / 4 / 4 |
| CAN 2.0 | 2 | 2 | 2 | 2 |
| Ethernet MAC | No | No | No | Yes (integrated MAC + PHY) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Unit Price (qty 1000) | $9.85 | $9.85 (same die, T&R packaging) | $10.20 (slight cost delta) | $11.50 (Ethernet integration premium) |
主要差異化特點
- Deterministic interrupt controller with 7 priority levels and tail chaining (對比STM32F407VGT6)
- Same-package drop-in alternative within the Tiva C Series family (對比TM4C123GH6ZRB)
- Higher pin count and BGA integration versus LQFP alternatives (對比TM4C123GH6PMI7)
設計說明
The 157-ball BGA footprint requires at least a 4-layer PCB with dedicated ground and power planes. Place thermal vias directly under the BGA's center balls to stitch to the inner ground plane, and ensure the keep-out zone around the BGA leaves room for fanout routing. Use 0.5 mm pitch BGA escape techniques with micro-via-in-pad if your PCB house supports it, since 0.8 mm pitch traces cannot escape a 0.5 mm pitch BGA on outer layers alone.
The TM4E123GH6ZRBI7 requires 3.3 V on the VDD pins, while an internal LDO generates 2.5 V for the core. Decouple each VDD ball with a 100 nF ceramic capacitor placed as close as possible to the package, plus a 4.7 uF bulk capacitor near the package. Tie the VDD25 pin to the internal regulator output (do NOT drive externally) unless you are providing the core supply directly. Brown-out reset and power-on reset behavior should be reviewed in the datasheet's PMC section.
Estimated: at 80 MHz full-load operation, the TM4E123GH6ZRBI7 dissipates approximately 0.5-1.0 W depending on peripheral activity (assumes typical 1.0 V core at 80 MHz with peripherals toggling). The 157-ball BGA's theta_JA is roughly 25-30 C/W on a standard 4-layer JEDEC test board, yielding a junction temperature rise of 12-30 C above ambient. Industrial deployment at +85C ambient remains within spec, but high-duty PWM applications should monitor junction temperature via the on-chip temperature sensor.
When routing high-speed SSI/SPI signals at 80 MHz or driving external memory buses, place series damping resistors within 5 mm of the MCU balls to reduce overshoot and ringing. For CAN bus signals, keep the differential pair length-matched within 5 mm and maintain 100-ohm differential impedance. Avoid routing analog and digital signals through the same via layer to minimize ADC crosstalk.
Do not skip the JTAG pull-up/pull-down resistors on the TCK/TMS/TDI/TDO pins, as this can prevent reliable debug connection in production. Also, ensure the ERBI suffix variants are ordered with the correct packaging code (R for tape and reel, blank for tray) since the BGA die is identical but the carrier format affects pick-and-place programming. Finally, configure the Hibernate module's VBAT supply before entering hibernate mode, otherwise RTC retention is lost.
合規資訊
RoHS and halogen-free compliant per TI product page. Not AEC-Q100 qualified; this part targets industrial/consumer embedded markets, not automotive. For automotive-grade Tiva equivalents, look at TI's automotive-qualified TM4C123x AEC-Q100 variants.
