XC3S50-4TQG144C - 50K Spartan-3 FPGA, 144-TQFP | AMD Xilinx
MPN： XC3S50-4TQG144C ✓ 啟用中XC3S50-4TQG144C 概覽
A field-programmable gate array is a semiconductor containing programmable lookup tables, routing, block memory, and configurable input/output resources. It sits within the broader programmable-logic hierarchy of FPGA and CPLD devices, enabling parallel digital logic, control functions, serial communication, and embedded memory to be consolidated into one configurable device. The XC3S50-4TQG144C provides 97 dedicated I/O resources according to its distributor listing, giving a designer a substantial interface complement relative to its 50,000-system-gate logic capacity.
The Spartan-3 architecture combines configurable logic with embedded block RAM and dedicated input/output resources in a single device. Its stated 630 MHz performance figure makes it suitable for clocked control logic, data acquisition, industrial interfaces, communications equipment, and embedded system prototypes. The four-speed-grade suffix identifies a device positioned for a maximum 630 MHz operation, while the TQG144 portion identifies the physical 144-pin TQFP package used for surface-mount PCB assembly.
The 90 nm process and 1.2 V core supply provide useful context when comparing this device with later programmable-logic families. A 1.2 V core requires appropriate on-board supply regulation and decoupling, while the 144-pin package offers a conventional quad-flat lead arrangement that can simplify inspection and rework. Designers should still follow the AMD Spartan-3 selection guide, pinout, configuration guidance, and power-supply recommendations for the exact device variant.
Typical uses include industrial automation, communications, automotive electronics, embedded control, data-capture, and general digital prototyping. In these applications, the FPGA can implement parallel pipelines or state machines while its programmable I/O interfaces external converters, sensors, memories, and communications transceivers. Its commercial operating grade and 50,000-system-gate capacity make it most appropriate when moderate logic density is needed without moving to a larger package.
The principal design consideration is migration and configuration reliability. PCB design must preserve the TQFP-144 footprint, power and ground distribution, decoupling, configuration interface, and exposed I/O constraints of the selected Spartan-3 device. Although XC3S50AN-4TQG144C appears in cross-reference results, designers must confirm that configuration behavior, supported I/O standards, memory resources, and power requirements are fully interchangeable before using it as a replacement.
This page consolidates verified distributor specifications, package details, temperature information, and candidate replacement data with practical selection guidance. It also distinguishes true same-package options from alternatives that require a different package, helping engineers reduce procurement and PCB-rework risk.
直接替換替代品，適用於 XC3S50-4TQG144C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC3S50-4TQG144C （相同外形與佔位） — 差異在於 Core Supply Voltage, Device Type, Operating Temperature, Package Type.
XC3S50AN-4TQG144C
✅ 直接替換📋 參考替代品（不在目錄中）
XC3S50A-4TQG144C
✅ 直接替換📋 參考替代品（不在目錄中）
XC3S50-4TQG144I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC3S50-4TQG144E
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC3S50-5TQG144C
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC3S50-4TQG144C 最大額定值與電氣特性
| Device Type | FPGA |
| FPGA Family | Spartan-3 |
| System Gates | 50,000 gates |
| Logic Cells | 1,728 cells |
| Performance Rating | 630 MHz |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V nominal |
| Operating Supply Voltage Range | 1.14 V to 1.26 V |
| I/O Count | 97 I/O |
| Package Type | 144-lead TQFP |
| 安裝類型 | Surface mount |
| 工作接面溫度範圍 | 0°C to 85°C |
| Device Classification | Commercial temperature grade |
XC3S50-4TQG144C 144-lead tqfp 腳位配置指南
XC3S50-4TQG144C（144-lead tqfp 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC3S50-4TQG144C.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC3S50-4TQG144C 適用於 6 應用s: Industrial Automation Controllers, Communications Interface Equipment, Data Acquisition and Signal Conditioning, Embedded Control and Prototyping, Automotive Electronic Control Modules, Programmable Test and Measurement Logic.
Industrial Automation Controllers
The XC3S50-4TQG144C fits compact industrial automation controllers that coordinate sensors, relays, converters, and operator interfaces. Its 50,000 system gates and 1,728 logic cells provide parallel capacity for control state machines, sequencing, diagnostics, and communication protocols, while 97 I/O provide substantial board-level connectivity. The 630 MHz performance rating supports demanding clocked control paths. Its 1.2 V core and 0°C to 85°C commercial junction range require a regulated supply and controlled enclosure temperature. In production, engineers should also confirm logic timing, I/O voltage standards, and industrial qualification requirements.
Communications Interface Equipment
The XC3S50-4TQG144C is suitable for communications equipment requiring configurable serial interfaces, packet framing, and real-time data routing. The Spartan-3 FPGA provides 1,728 logic cells and 97 I/O for parallel-to-serial conversion, clock-domain logic, and protocol handling, while its 630 MHz rating supports high-speed digital processing. In a communications board, the device can sit between a transceiver and a host processor or implement line encoding and framing directly. The verified 1.14 V to 1.26 V core range must be met with low-noise regulation, and timing closure should be checked against the selected I/O standard.
Data Acquisition and Signal Conditioning
The XC3S50-4TQG144C can implement programmable digital acquisition, filtering, and data-format conversion where parallel logic and configurable I/O are more valuable than a fixed function. Its 1,728 logic cells and 97 I/O allow parallel sampling interfaces, trigger logic, counters, and buffers to be integrated in one device. The 630 MHz performance rating supports pipelined processing, although converter bandwidth and output latency remain design constraints. Engineers should use the manufacturer I/O characteristics to confirm voltage compatibility, drive strength, and timing, and should use the exact Spartan-3 pinout rather than relying on generic TQFP-144 assumptions.
Embedded Control and Prototyping
The XC3S50-4TQG144C provides a practical platform for embedded-control prototypes that combine state-machine logic, timing, and multiple peripheral interfaces. With 50,000 system gates, 1,728 logic cells, and 97 I/O, it can consolidate control logic that would otherwise occupy several fixed-function devices. Its 630 MHz performance rating allows synchronous pipelines, while the 1.2 V core simplifies integration with FPGA-oriented power designs. Designers must account for configuration storage, startup behavior, JTAG access, and I/O assignment. These functions must be validated against the exact manufacturer documentation and design-tool support for the selected device revision.
Automotive Electronic Control Modules
The XC3S50-4TQG144C can serve as the programmable logic element in selected automotive electronics, a use area specifically identified by the verified product listing. Its 50,000-system-gate capacity supports body, comfort, interface, and supervisory control functions, while the 97 I/O and 1,728 logic cells allow multiple digital inputs and outputs to be consolidated. The commercial 0°C to 85°C operating junction range must be checked against the vehicle's actual thermal environment. Automotive deployment also requires the applicable qualification, reliability, and change-control evidence, none of which is established by the supplied source records.
Programmable Test and Measurement Logic
The XC3S50-4TQG144C is suitable for building programmable test logic, sequencers, and pattern-generation blocks around laboratory or production equipment. Its 1,728 logic cells and 97 I/O allow parallel timing generation, acquisition channels, and control signals to share a single programmable device. The 630 MHz performance rating offers useful margin for synchronous digital test functions, while 50,000 system gates balance capacity against board complexity. Exact I/O speeds, output standards, and timing specifications must be verified in the manufacturer datasheet. High-speed instrumentation may require external drivers, terminations, or additional FPGA resources beyond the XC3S50 device.
工程參考資料，適用於 XC3S50-4TQG144C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC3S50AN-4TQG144C | XC3S50A-4TQG144C | XC3S50-4TQG144I | XC3S50-4TQG144E | XC3S50-5TQG144C |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-3 | Spartan-3AN | Spartan-3A | Spartan-3 | Spartan-3 | Spartan-3 |
| Speed Grade | -4, 630 MHz | -4 | -4 | -4 | -4 | -5, higher than 630 MHz |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
主要差異化特點
- Commercial-grade option with a verified 630 MHz performance rating (對比XC3S50-5TQG144C)
- Verified 1.14 V to 1.26 V operating supply range (對比XC3S50AN-4TQG144C)
- Directly documented commercial operating-junction range (對比XC3S50-4TQG144I)
- Original 50,000-system-gate Spartan-3 device position (對比XC3S50A-4TQG144C)
設計說明
Design the FPGA core around a regulated 1.2 V nominal supply constrained to the verified 1.14 V to 1.26 V operating range. Place the manufacturer-required bypass capacitors immediately adjacent to the associated power and ground pins, and use a low-impedance power and ground plane arrangement. Do not copy the capacitor values from a generic TQFP design; use the exact Spartan-3 power guidelines because configuration and I/O requirements can affect the recommended network.
Preserve the manufacturer's TQFP-144 footprint, pad dimensions, solder-mask rules, and pin numbering when designing or modifying the PCB. Treat XC3S50AN-4TQG144C and XC3S50A-4TQG144C as candidate replacements only after comparing their exact pinout and configuration behavior. A matching package count alone does not prove that power pins, configuration pins, I/O standards, or user I/O assignments are interchangeable.
Route clocks and high-speed interfaces with short, controlled-impedance paths and provide unobstructed return paths on the reference plane. Separate noisy switching or clock-return paths from precision analog and sensor interfaces, and avoid routing demanding signals beneath the FPGA unless the stack-up and reference-plane arrangement have been evaluated. Although the device is primarily digital, PCB layout still determines clock jitter, input threshold behavior, and signal-integrity margin.
Avoid assuming that a TQFP package is interchangeable with a PQFP package merely because both contain 144 leads. The verified Lovechip result describes XC3S50-4PQG144C as functionally identical but places it in a different PQFP-144 package, so it is excluded from the strict drop-in alternatives. Also verify configuration memory, JTAG behavior, supported I/O standards, and tool-version support before changing the bill of materials.
合規資訊
The supplied records identify the device as a commercial-grade FPGA but do not provide extractable RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive-qualification statements. AEC-Q100 is marked not_applicable because no automotive qualification claim appears in the source data.
