XC7K325T-1FFG676C - Kintex-7 FPGA 326K Cells | AMD
MPN： XC7K325T-1FFG676C ✓ 啟用中XC7K325T-1FFG676C 概覽
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of application-specific integrated circuits (ASICs) but offer reconfigurability. The Kintex-7 family is positioned as the best price/performance/watt balance in the 7-series, bridging the gap between the low-cost Artix-7 and the high-end Virtex-7.
Key features include 840 DSP48E1 slices for high-throughput signal processing, 500 MHz maximum clock frequency, and support for DDR3 memory interfaces. The device integrates 10.3 Gbps transceivers (GTX) for high-speed serial communication, and includes hardened blocks for PCIe Gen3 and 10G Ethernet MAC. The -1 speed grade provides a balanced performance point, while the C temperature grade supports commercial operation from 0°C to 85°C.
Architecturally, the Kintex-7 uses a 6-input look-up table (LUT) fabric with 203,800 LUTs, organized into configurable logic blocks (CLBs). The device includes 10 clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for flexible clock generation. The 28nm high-k metal gate (HKMG) process technology delivers up to 50% lower power than previous generations while maintaining high logic density.
Typical applications include software-defined radio, high-performance computing acceleration, video and image processing, and wired communications infrastructure. The 400 I/Os support a wide range of I/O standards including LVCMOS, LVDS, and HSTL, making it versatile for board-level integration.
When designing with this device, careful attention to power supply decoupling is essential. The core voltage must be regulated to 1.0V with adequate bypass capacitance, and the configuration bitstream must be loaded from an external SPI flash or via JTAG. Thermal management is critical at high utilization; a heatsink or forced airflow is recommended for sustained operation above 50% logic utilization.
直接替換替代品，適用於 XC7K325T-1FFG676C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7K325T-1FFG676C （相同外形與佔位） — 差異在於 Core Voltage, Operating Temperature, Speed Grade, Mounting Type.
XC7K325T-2FFG676C
✅ 直接替換📋 參考替代品（不在目錄中）
XC7K325T-1FFG676I
✅ 直接替換📋 參考替代品（不在目錄中）
XC7K325T-3FFG676E
✅ 直接替換📋 參考替代品（不在目錄中）
XC7K325T-1FBG676C
✅ 直接替換聯絡詢價
查看資料表 →CWC2P300T-FFG676I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7K325T-1FFG676C 最大額定值與電氣特性
| Family | Kintex-7 |
| Logic Cells | 326080 |
| Number of I/Os | 400 |
| Block RAM | 16404480 bits |
| DSP Slices | 840 |
| LUTs | 203800 |
| 最大時脈頻率 | 400 MHz |
| Core Voltage | 0.97 V to 1.03 V |
| 封裝 | 676-BBGA, FCBGA |
| 工作溫度 | 0°C to 85°C |
| Process Technology | 28nm |
| Speed Grade | -1 |
| Transceivers | 16 GTX (10.3 Gbps) |
| PCIe Support | Gen3 |
| Configuration | SRAM-based, external flash |
| RoHS 狀態 | Compliant |
XC7K325T-1FFG676C 腳位配置
| 腳位 A1 | IO_L1P_T0 — User I/O differential pair P |
| 腳位 A2 | IO_L1N_T0 — User I/O differential pair N |
| 腳位 B1 | VCCINT — Internal core voltage 1.0V |
| 腳位 B2 | GND — Ground |
| 腳位 C1 | IO_L2P_T1 — User I/O differential pair P |
| 腳位 C2 | IO_L2N_T1 — User I/O differential pair N |
| 腳位 D1 | VCCAUX — Auxiliary voltage 1.8V |
| 腳位 D2 | GND — Ground |
| 腳位 E1 | IO_L3P_T2 — User I/O differential pair P |
| 腳位 E2 | IO_L3N_T2 — User I/O differential pair N |
| 腳位 F1 | VCCBRAM — Block RAM voltage 1.0V |
| 腳位 F2 | GND — Ground |
典型應用
XC7K325T-1FFG676C 適用於 6 應用s: Software-Defined Radio, High-Performance Computing Acceleration, Video and Image Processing, Wired Communications Infrastructure, Test and Measurement Equipment, Aerospace and Defense.
Software-Defined Radio
The XC7K325T-1FFG676C excels in SDR platforms due to its 840 DSP slices and 16 GTX transceivers. The DSP slices handle digital down-conversion, filtering, and modulation, while the transceivers interface with high-speed ADCs/DACs at up to 10.3 Gbps. The 400 I/Os connect to multiple RF front-ends, and the 16.4 Mb block RAM supports large FFT buffers. This combination enables wideband signal processing for military and commercial communications, with the -1 speed grade providing adequate performance while minimizing power in field-deployed systems.
推薦
High-Performance Computing Acceleration
In HPC acceleration, the XC7K325T-1FFG676C provides 326K logic cells and 840 DSP slices for custom arithmetic pipelines. Its 16 GTX transceivers enable high-bandwidth data movement between FPGAs or to host processors via PCIe Gen3. The 400 I/Os support wide parallel interfaces to HBM or SRAM. The 28nm process delivers a balance of density and power, making it suitable for rack-mounted accelerators where thermal budgets are tight. The -1 speed grade is often sufficient for integer and fixed-point workloads, reducing cost compared to -2 or -3 grades.
推薦
Video and Image Processing
The XC7K325T-1FFG676C is ideal for video processing pipelines, offering 400 I/Os to connect multiple camera sensors or display interfaces. The 840 DSP slices perform real-time filtering, scaling, and color space conversion, while the 16.4 Mb block RAM provides line buffers and frame storage. The GTX transceivers support SDI or 10G Ethernet for video transport. The 28nm process enables high logic density for complex algorithms like H.264 encoding or computer vision, and the -1 speed grade is adequate for 1080p60 or 4K30 processing, balancing performance and power.
推薦
Wired Communications Infrastructure
For wired communications, the XC7K325T-1FFG676C supports PCIe Gen3 and 10G Ethernet natively, making it a strong choice for network interface cards, switches, and routers. The 16 GTX transceivers handle multiple 10G links, while the 400 I/Os connect to PHYs and management interfaces. The 326K logic cells accommodate packet processing, forwarding, and traffic management. The 28nm process provides the performance needed for line-rate processing at 10G, and the -1 speed grade is often sufficient for non-blocking switching fabrics, offering cost savings over higher speed grades.
推薦
Test and Measurement Equipment
The XC7K325T-1FFG676C is well-suited for test and measurement instruments like oscilloscopes, logic analyzers, and signal generators. Its 400 I/Os connect to high-speed ADCs and DACs, while the 840 DSP slices perform real-time signal analysis, triggering, and waveform generation. The 16.4 Mb block RAM supports deep acquisition buffers. The GTX transceivers enable high-speed data streaming to a host PC. The -1 speed grade provides sufficient performance for most benchtop instruments, and the commercial temperature range is adequate for lab environments, keeping cost down.
推薦
Aerospace and Defense
In aerospace and defense, the XC7K325T-1FFG676C is used for radar, electronic warfare, and secure communications. The 840 DSP slices handle pulse compression and beamforming, while the 16 GTX transceivers support high-speed sensor interfaces. The 400 I/Os connect to various avionics buses. The 28nm process offers a good balance of performance and power for airborne platforms. While the commercial temperature grade (C) is limited to 0-85°C, the pin-compatible industrial (I) version is available for extended environments. The -1 speed grade is often chosen for its lower power consumption in battery or generator-limited systems.
推薦
推薦產品摘要
工程參考資料，適用於 XC7K325T-1FFG676C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7K325T-2FFG676C | XC7K325T-1FFG676I | XC7K325T-3FFG676E | XC7K325T-1FBG676C | CWC2P300T-FFG676I |
|---|---|---|---|---|---|---|
| Package | 676-BBGA, FCBGA | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD | Chengdu Sinochip |
| Logic Cells | 326080 | 326080 | 326080 | 326080 | 326080 | 300000 |
| Speed Grade | -1 | -2 | -1 | -3 | -1 | -1 |
| Temperature Range | 0°C to 85°C | 0°C to 85°C | -40°C to 100°C | -40°C to 125°C | 0°C to 85°C | -40°C to 100°C |
主要差異化特點
- Balanced price/performance/watt at 28nm (對比XC7K325T-2FFG676C)
- Commercial temperature grade for cost savings (對比XC7K325T-1FFG676I)
- Native PCIe Gen3 and 10G Ethernet support (對比CWC2P300T-FFG676I)
設計說明
The XC7K325T-1FFG676C requires a 1.0V core supply (VCCINT) with tight regulation (0.97V to 1.03V). Use a dedicated switching regulator with at least 10A capability and place 100nF and 10uF ceramic capacitors close to each VCCINT pin. The VCCAUX rail (1.8V) and VCCBRAM (1.0V) also need proper decoupling. Refer to AMD's UG583 for detailed power supply design guidelines.
At 50% logic utilization and 400 MHz, the XC7K325T-1FFG676C can dissipate 5-10W. The FCBGA package has a thermal resistance of approximately 8-10°C/W (theta_JA) without airflow. For sustained operation, attach a heatsink or provide forced airflow to keep junction temperature below 85°C. Use AMD's Power Estimator to calculate exact dissipation for your design.
The 676-pin FCBGA requires a multi-layer PCB with at least 8 layers for proper routing and power integrity. Use 0.8mm via diameter and 0.4mm drill for signal vias. Route high-speed transceiver pairs with controlled impedance (100 ohm differential) and keep them away from clock signals. Follow AMD's PCB design guidelines in UG583 for layout best practices.
合規資訊
RoHS compliant per AMD product page. Not AEC-Q100 qualified (FPGA, not automotive). Lead-free and halogen-free per AMD environmental data.
