XC7K325T-2FFG676I - Kintex-7 FPGA 326K Logic Cells | AMD
MPN： XC7K325T-2FFG676I ✓ 啟用中| 數量 | 單價 | 小計 |
|---|---|---|
| 1 | $123.63 | $123.63 |
| 10 | $118 | $1,180.00 |
| 100 | $110 | $11,000.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $98 | $98,000.00 |
XC7K325T-2FFG676I 概覽
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be customized to perform specific functions. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware acceleration or frequent design updates. The Kintex-7 family sits within the broader FPGA hierarchy, offering a balance between the cost-optimized Artix-7 and the high-performance Virtex-7 families.
Key features of the XC7K325T-2FFG676I include 840 DSP slices for high-throughput digital signal processing, 500 I/O pins (400 user I/Os), and support for a core voltage of 0.97V to 1.03V. The device operates at a maximum frequency of 470.37 MHz and includes advanced clock management tiles (CMTs) with MMCM and PLL for precise clock generation. The -2 speed grade provides a strong balance between performance and power consumption, making it suitable for a wide range of high-speed applications.
Technically, the Kintex-7 architecture integrates a 28nm high-k metal gate (HKMG) process, enabling high logic density and low power. The device includes hardened memory controllers, high-speed transceivers, and PCIe blocks, reducing the need for external components and simplifying system design. The 676-ball FCBGA package offers excellent thermal and electrical performance, supporting the high I/O count and high-speed interfaces required for demanding applications.
Typical applications include software-defined radio, high-performance computing, medical imaging, and aerospace and defense systems. The device's high DSP ratio and support for 10G Ethernet make it particularly well-suited for signal processing and high-throughput data acquisition. Its cost-effective packaging and mainstream standard support also make it a popular choice for communications infrastructure and test and measurement equipment.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The core voltage must be maintained within the specified range, and adequate cooling should be provided to keep the junction temperature within limits. The device's configuration interface should be planned early in the design to ensure reliable programming and reconfiguration.
直接替換替代品，適用於 XC7K325T-2FFG676I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7K325T-2FFG676I （相同外形與佔位） — 差異在於 Operating Temperature, Mounting Type, RoHS Status.
快速比較工具 — 選擇替代零件進行並排比較：
XC7K325T-2FFG676C
📋 參考替代品（不在目錄中）
XC7K325T-1FFG676I
📋 參考替代品（不在目錄中）
XC7K325T-3FFG900E
📋 參考替代品（不在目錄中）
CWC2P300T-FFG676I
📋 參考替代品（不在目錄中）
XC7K325T-2FFG676
📋 參考替代品（不在目錄中）
XC7K325T-2FFG676I 最大額定值與電氣特性
| Family | Kintex-7 |
| Number of Logic Elements/Cells | 326080 |
| Number of LABs/CLBs | 25475 |
| Total RAM Bits | 16404480 |
| Number of I/O | 400 |
| Number of DSP Slices | 840 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Maximum Operating Frequency | 470.37 MHz |
| 封裝 / 外殼 | 676-BBGA, FCBGA |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40°C ~ 100°C (TJ) |
| Speed Grade | -2 |
| Number of MMCM/PLL | 10 MMCM, 4 PLL |
| RoHS 狀態 | Compliant |
XC7K325T-2FFG676I 腳位配置
| 腳位 A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 腳位 A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 腳位 B1 | VCCINT — Internal core voltage supply (0.97V-1.03V) |
| 腳位 B2 | GND — Ground |
| 腳位 C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| 腳位 C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| 腳位 D1 | VCCAUX — Auxiliary voltage supply (1.8V) |
| 腳位 D2 | GND — Ground |
| 腳位 E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| 腳位 E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| 腳位 F1 | VCCIO_0 — I/O bank 0 voltage supply |
| 腳位 F2 | GND — Ground |
典型應用
XC7K325T-2FFG676I 適用於 6 應用s: Software-Defined Radio, High-Performance Computing, Medical Imaging, Aerospace and Defense, Communications Infrastructure, Test and Measurement.
Software-Defined Radio
The XC7K325T-2FFG676I is ideal for software-defined radio (SDR) due to its 840 DSP slices and high-speed transceivers. It can handle complex modulation and demodulation algorithms, digital down/up conversion, and channel filtering. The device's 400 user I/Os allow for flexible interfacing with ADCs and DACs. Its support for PCIe Gen3 enables high-throughput data transfer to host processors, making it a robust platform for cognitive radio and spectrum monitoring systems.
推薦
High-Performance Computing
In high-performance computing (HPC), the XC7K325T-2FFG676I accelerates data-intensive workloads such as financial modeling, scientific simulations, and big data analytics. Its 326,080 logic cells and 16.4 Mb of block RAM enable efficient implementation of custom arithmetic units and memory hierarchies. The device's high-speed transceivers support low-latency interconnects like 10G Ethernet, facilitating cluster communication. The -2 speed grade ensures high clock rates for compute-intensive kernels.
推薦
Medical Imaging
The XC7K325T-2FFG676I is well-suited for medical imaging systems such as ultrasound, CT, and MRI. Its high DSP slice count enables real-time image processing, including filtering, enhancement, and reconstruction. The device's 400 user I/Os allow for direct interfacing with high-speed ADCs and image sensors. The industrial temperature grade ensures reliable operation in clinical environments. Its support for PCIe Gen3 facilitates high-speed data transfer to display and storage systems.
推薦
Aerospace and Defense
The XC7K325T-2FFG676I is designed for aerospace and defense applications, including radar, electronic warfare, and secure communications. Its industrial temperature range (-40°C to 100°C) ensures operation in harsh environments. The device's high logic density and DSP resources support complex signal processing and beamforming. Its support for 10G Ethernet and PCIe Gen3 enables high-speed data links. The 676-ball FCBGA package provides robust mechanical and thermal performance for mission-critical systems.
推薦
Communications Infrastructure
The XC7K325T-2FFG676I is a key component in communications infrastructure, including base stations, switches, and routers. Its support for 10G Ethernet and PCIe Gen3 enables high-speed packet processing and forwarding. The device's 326,080 logic cells provide ample resources for implementing protocol stacks and traffic management. The -2 speed grade ensures low-latency operation. Its 400 user I/Os allow for flexible interfacing with PHYs and network processors.
推薦
Test and Measurement
The XC7K325T-2FFG676I is used in test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its high-speed transceivers and DSP resources enable real-time signal acquisition and analysis. The device's 400 user I/Os allow for direct interfacing with high-speed ADCs and DACs. The industrial temperature grade ensures stable operation in lab environments. Its support for PCIe Gen3 facilitates high-speed data transfer to host computers for visualization and control.
推薦
推薦產品摘要
工程參考資料，適用於 XC7K325T-2FFG676I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7K325T-2FFG676C | XC7K325T-1FFG676I | XC7K325T-3FFG900E | CWC2P300T-FFG676I |
|---|---|---|---|---|---|
| Package | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 900-BBGA, FCBGA | 676-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD | CWC |
主要差異化特點
- Industrial temperature grade (對比XC7K325T-2FFG676C)
- Higher speed grade (對比XC7K325T-1FFG676I)
- Pin-compatible with commercial variant (對比XC7K325T-2FFG676C)
設計說明
The XC7K325T-2FFG676I requires a core voltage of 0.97V to 1.03V. Use a dedicated power management IC to provide a clean, stable supply. Decouple each power pin with a 100nF ceramic capacitor and a 10uF bulk capacitor. Ensure the power supply can handle the device's dynamic current demands, especially during configuration and high-speed operation.
The 676-ball FCBGA package has a thermal resistance that requires careful thermal management. For high-performance applications, use a heatsink and ensure adequate airflow. The junction temperature must not exceed 100°C for the industrial grade. Consider using thermal vias under the package to improve heat dissipation to the PCB ground plane.
For high-speed signals, maintain controlled impedance traces and minimize crosstalk. Use differential pairs for high-speed serial links and ensure proper termination. Place decoupling capacitors close to the FPGA power pins. Follow the layout guidelines in the AMD UG475 for the FCBGA package to ensure reliable operation.
合規資訊
RoHS compliant per DigiKey listing. Other compliance data not explicitly provided.
