AMD

XC7K325T-2FFG676I - Kintex-7 FPGA 326K Logic Cells | AMD

Name: XC7K325T-2FFG676I
Brand: AMD
Price: 98 USD
Availability: InStock

MPN: XC7K325T-2FFG676I ✓ Active

In Stock Ships in 1-3 business days

0.97V ~ 1.03V Vdss 676-BBGA, FCBGA Package 470.37 MHz Speed

From $98 USD / Unit

MOQ: 1 |

Price updated: 2026-08-20

Volume Pricing

Qty	Unit Price	Extended
1	$123.63	$123.63
10	$118	$1,180.00
100	$110	$11,000.00
500	$105	$52,500.00
1,000	$98	$98,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7K325T-2FFG676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7K325T-2FFG676C

✅ Drop-In

📦 676-BBGA, FCBGA

Commercial temperature grade (0°C to 85°C) vs industrial (-40°C to 100°C)

📋 Reference alternative (not in catalog)

XC7K325T-1FFG676I

✅ Drop-In

📦 676-BBGA, FCBGA

Lower speed grade (-1) with reduced maximum frequency

📋 Reference alternative (not in catalog)

CWC2P300T-FFG676I

✅ Drop-In

📦 676-BBGA, FCBGA

Domestic FPGA alternative, pin-compatible, but different logic resources

📋 Reference alternative (not in catalog)

XC7K325T-2FFG676

✅ Drop-In

📦 676-BBGA, FCBGA

Same package and speed grade, but temperature grade unspecified

📋 Reference alternative (not in catalog)

ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

XC7K325T-2FFG676I Maximum Ratings & Electrical Characteristics

Family	Kintex-7
Number of Logic Elements/Cells	326080
Number of LABs/CLBs	25475
Total RAM Bits	16404480
Number of I/O	400
Number of DSP Slices	840
Voltage - Supply	0.97V ~ 1.03V
Maximum Operating Frequency	470.37 MHz
Package / Case	676-BBGA, FCBGA
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)
Speed Grade	-2
Number of Transceivers	[DATA_NEEDED: Number of Transceivers]
Number of MMCM/PLL	10 MMCM, 4 PLL
RoHS Status	Compliant

XC7K325T-2FFG676I Pin Configuration

Pin A1	IO_L1P_T0 — User I/O bank 0, differential pair P
Pin A2	IO_L1N_T0 — User I/O bank 0, differential pair N
Pin B1	VCCINT — Internal core voltage supply (0.97V-1.03V)
Pin B2	GND — Ground
Pin C1	IO_L2P_T0 — User I/O bank 0, differential pair P
Pin C2	IO_L2N_T0 — User I/O bank 0, differential pair N
Pin D1	VCCAUX — Auxiliary voltage supply (1.8V)
Pin D2	GND — Ground
Pin E1	IO_L3P_T0 — User I/O bank 0, differential pair P
Pin E2	IO_L3N_T0 — User I/O bank 0, differential pair N
Pin F1	VCCIO_0 — I/O bank 0 voltage supply
Pin F2	GND — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7K325T-2FFG676I is suitable for 6 applications: Software-Defined Radio, High-Performance Computing, Medical Imaging, Aerospace and Defense, Communications Infrastructure, Test and Measurement.

📡

Software-Defined Radio

The XC7K325T-2FFG676I is ideal for software-defined radio (SDR) due to its 840 DSP slices and high-speed transceivers. It can handle complex modulation and demodulation algorithms, digital down/up conversion, and channel filtering. The device's 400 user I/Os allow for flexible interfacing with ADCs and DACs. Its support for PCIe Gen3 enables high-throughput data transfer to host processors, making it a robust platform for cognitive radio and spectrum monitoring systems.

Recommended

AD9361 (RF transceiver for SDR front-end) XC7Z020 · AMD

🖥️

High-Performance Computing

In high-performance computing (HPC), the XC7K325T-2FFG676I accelerates data-intensive workloads such as financial modeling, scientific simulations, and big data analytics. Its 326,080 logic cells and 16.4 Mb of block RAM enable efficient implementation of custom arithmetic units and memory hierarchies. The device's high-speed transceivers support low-latency interconnects like 10G Ethernet, facilitating cluster communication. The -2 speed grade ensures high clock rates for compute-intensive kernels.

Recommended

MT40A512M16JY-075E · Micron Technology XC7Z020 · AMD

💊

Medical Imaging

The XC7K325T-2FFG676I is well-suited for medical imaging systems such as ultrasound, CT, and MRI. Its high DSP slice count enables real-time image processing, including filtering, enhancement, and reconstruction. The device's 400 user I/Os allow for direct interfacing with high-speed ADCs and image sensors. The industrial temperature grade ensures reliable operation in clinical environments. Its support for PCIe Gen3 facilitates high-speed data transfer to display and storage systems.

Recommended

AD9643 (High-speed ADC for signal acquisition) MT40A512M16JY-075E · Micron Technology

✈️

Aerospace and Defense

The XC7K325T-2FFG676I is designed for aerospace and defense applications, including radar, electronic warfare, and secure communications. Its industrial temperature range (-40°C to 100°C) ensures operation in harsh environments. The device's high logic density and DSP resources support complex signal processing and beamforming. Its support for 10G Ethernet and PCIe Gen3 enables high-speed data links. The 676-ball FCBGA package provides robust mechanical and thermal performance for mission-critical systems.

Recommended

AD9361 (RF transceiver for radar front-end) XC7Z020 · AMD

🌐

Communications Infrastructure

The XC7K325T-2FFG676I is a key component in communications infrastructure, including base stations, switches, and routers. Its support for 10G Ethernet and PCIe Gen3 enables high-speed packet processing and forwarding. The device's 326,080 logic cells provide ample resources for implementing protocol stacks and traffic management. The -2 speed grade ensures low-latency operation. Its 400 user I/Os allow for flexible interfacing with PHYs and network processors.

Recommended

MT40A512M16JY-075E · Micron Technology XC7Z020 · AMD

🔧

Test and Measurement

The XC7K325T-2FFG676I is used in test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its high-speed transceivers and DSP resources enable real-time signal acquisition and analysis. The device's 400 user I/Os allow for direct interfacing with high-speed ADCs and DACs. The industrial temperature grade ensures stable operation in lab environments. Its support for PCIe Gen3 facilitates high-speed data transfer to host computers for visualization and control.

Recommended

AD9643 (High-speed ADC for signal acquisition) MT40A512M16JY-075E · Micron Technology

Recommended Products Summary

AD9361 RF transceiver for SDR front-end Used in: Software-Defined Radio, Aerospace and Defense XC7Z020 AMD Used in: Software-Defined Radio, High-Performance Computing, Aerospace and Defense, Communications Infrastructure MT40A512M16JY-075E Micron Technology Used in: High-Performance Computing, Medical Imaging, Communications Infrastructure, Test and Measurement AD9643 High-speed ADC for signal acquisition Used in: Medical Imaging, Test and Measurement

What is the XC7K325T-2FFG676I?

The XC7K325T-2FFG676I is a Kintex-7 FPGA from AMD (formerly Xilinx) with 326,080 logic cells, 400 user I/Os, and 16,404,480 bits of block RAM. It is housed in a 676-ball FCBGA package and operates on a 0.97V to 1.03V supply. According to the AMD datasheet, it supports PCIe Gen3 and 10 Gigabit Ethernet, making it suitable for high-speed data processing and communications.

What is the price of XC7K325T-2FFG676I?

As of 2026-08-21, the XC7K325T-2FFG676I is priced at approximately $123.63 for a single unit at LCSC Electronics. Volume pricing may be lower, with discounts available for larger quantities. For the most accurate and current pricing, check distributor websites like DigiKey, Mouser, and Octopart, which often offer bulk discounts.

Where can I buy XC7K325T-2FFG676I online?

The XC7K325T-2FFG676I can be purchased from major distributors including DigiKey, Mouser, and LCSC. DigiKey lists it as 'ships today' with stock available. Octopart also aggregates pricing and availability from multiple distributors. For the best price and availability, compare these sources as of 2026-08-21.

What is the lead time for XC7K325T-2FFG676I?

The lead time for XC7K325T-2FFG676I varies by distributor and order quantity. DigiKey indicates it is in stock and ships today for immediate orders. For larger volumes, lead times may extend to several weeks. As of 2026-08-21, it is advisable to check with your preferred distributor for current lead time estimates.

Is XC7K325T-2FFG676I in stock?

Yes, as of 2026-08-21, the XC7K325T-2FFG676I is in stock at DigiKey, which lists it as 'ships today'. LCSC also shows it as in-stock. However, stock levels can change rapidly, so it is recommended to verify availability on distributor websites before placing an order.

What is the difference between XC7K325T-2FFG676I and XC7K325T-2FFG676C?

The XC7K325T-2FFG676I and XC7K325T-2FFG676C share the same logic resources and package, but differ in operating temperature range. The 'I' suffix indicates an industrial temperature grade (-40°C to 100°C), while the 'C' suffix indicates a commercial temperature grade (0°C to 85°C). For industrial or outdoor applications, the 'I' version is required.

When should I choose XC7K325T-2FFG676I over XC7K325T-1FFG676I?

Choose the XC7K325T-2FFG676I over the -1 speed grade when you need higher performance. The -2 speed grade offers a higher maximum operating frequency (470.37 MHz) compared to the -1, making it suitable for more demanding applications. However, the -2 may consume slightly more power. For cost-sensitive designs with lower performance needs, the -1 could be sufficient.

What is the best drop-in replacement for XC7K325T-2FFG676I?

The best drop-in replacement for XC7K325T-2FFG676I is the XC7K325T-2FFG676C, which is pin-compatible and has the same logic resources, but with a commercial temperature range. For a higher-performance option, the XC7K325T-3FFG900E is not pin-compatible due to a different package (900-BBGA). Always verify pin compatibility before substitution.

Can XC7K325T-2FFG676I be used for software-defined radio?

Yes, the XC7K325T-2FFG676I is well-suited for software-defined radio (SDR) applications. Its high DSP slice count (840) and support for high-speed serial transceivers enable efficient digital down/up conversion and modulation. The device's 400 user I/Os and 16.4 Mb of block RAM provide ample resources for complex signal processing chains.

What are the key specifications of XC7K325T-2FFG676I that engineers should know?

Engineers should note the XC7K325T-2FFG676I has 326,080 logic cells, 840 DSP slices, 16,404,480 bits of block RAM, and 400 user I/Os. It operates at 0.97V to 1.03V and supports a maximum frequency of 470.37 MHz. The device is in a 676-ball FCBGA package and is rated for -40°C to 100°C. It supports PCIe Gen3 and 10G Ethernet.

Where can I download the XC7K325T-2FFG676I datasheet PDF?

The XC7K325T-2FFG676I datasheet can be downloaded from the AMD website or from distributor sites like DigiKey and Mouser. Octopart also provides a datasheet link. The official AMD product page and the DigiKey product page both offer direct PDF downloads. As of 2026-08-21, these are the most reliable sources.

What is the best AMD equivalent for XC7K325T-2FFG676I?

The best AMD equivalent for XC7K325T-2FFG676I is the XC7K325T-2FFG676C, which is identical except for the temperature grade. For a higher-performance option within the same family, the XC7K325T-3FFG900E offers a faster speed grade but uses a different package (900-BBGA), so it is not a drop-in replacement.

Hey Google, what can replace XC7K325T-2FFG676I?

The XC7K325T-2FFG676I can be replaced by the XC7K325T-2FFG676C for commercial temperature applications, as it is pin-compatible and has the same logic resources. For industrial applications, the XC7K325T-1FFG676I is a lower-speed alternative. Always verify pin compatibility and performance requirements before substitution.

Is XC7K325T-2FFG676I the same as XC7K325T-2FFG676C?

No, the XC7K325T-2FFG676I and XC7K325T-2FFG676C are not the same. They share the same logic resources and package, but the 'I' suffix denotes an industrial temperature range (-40°C to 100°C), while the 'C' suffix denotes a commercial range (0°C to 85°C). For industrial environments, the 'I' version is required.

Engineering reference data for XC7K325T-2FFG676I — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7K325T-2FFG676I when you need a high-performance FPGA with industrial temperature range for applications like aerospace, defense, or outdoor communications. If your application is commercial (0°C to 85°C), the XC7K325T-2FFG676C offers the same logic resources at a potentially lower cost. For lower performance requirements, the XC7K325T-1FFG676I is a cost-effective alternative. If you need higher performance and can accommodate a larger package, the XC7K325T-3FFG900E offers a faster speed grade but requires a different PCB footprint. For domestic supply chain needs, the CWC2P300T-FFG676I is a pin-compatible alternative, but verify its logic resources and performance before use.

Comparison with Alternatives

Parameter	This Product	XC7K325T-2FFG676C	XC7K325T-1FFG676I	XC7K325T-3FFG900E	CWC2P300T-FFG676I
Package	676-BBGA, FCBGA	676-BBGA, FCBGA	676-BBGA, FCBGA	900-BBGA, FCBGA	676-BBGA, FCBGA
Brand	AMD	AMD	AMD	AMD	CWC
Logic Cells	326080	326080	326080	326080	[DATA_NEEDED]
Block RAM (bits)	16404480	16404480	16404480	16404480	[DATA_NEEDED]
DSP Slices	840	840	840	840	[DATA_NEEDED]
User I/Os	400	400	400	500	[DATA_NEEDED]
Max Frequency	470.37 MHz	470.37 MHz	[DATA_NEEDED]	[DATA_NEEDED]	[DATA_NEEDED]
Temperature Grade	Industrial (-40°C to 100°C)	Commercial (0°C to 85°C)	Industrial (-40°C to 100°C)	[DATA_NEEDED]	[DATA_NEEDED]

Key Differentiators

Industrial temperature grade (vs XC7K325T-2FFG676C)
Higher speed grade (vs XC7K325T-1FFG676I)
Pin-compatible with commercial variant (vs XC7K325T-2FFG676C)

Design Notes

The XC7K325T-2FFG676I requires a core voltage of 0.97V to 1.03V. Use a dedicated power management IC to provide a clean, stable supply. Decouple each power pin with a 100nF ceramic capacitor and a 10uF bulk capacitor. Ensure the power supply can handle the device's dynamic current demands, especially during configuration and high-speed operation.

The 676-ball FCBGA package has a thermal resistance that requires careful thermal management. For high-performance applications, use a heatsink and ensure adequate airflow. The junction temperature must not exceed 100°C for the industrial grade. Consider using thermal vias under the package to improve heat dissipation to the PCB ground plane.

For high-speed signals, maintain controlled impedance traces and minimize crosstalk. Use differential pairs for high-speed serial links and ensure proper termination. Place decoupling capacitors close to the FPGA power pins. Follow the layout guidelines in the AMD UG475 for the FCBGA package to ensure reliable operation.