XC7S50-2CSGA324I - Spartan-7 FPGA, 52K Logic Cells | AMD
부품 번호: XC7S50-2CSGA324I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $71.5 | $71.50 |
| 10 | $65.2 | $652.00 |
| 100 | $56.85 | $5,685.00 |
| 500 | $49.4 | $24,700.00 |
| 1,000 | $43.1 | $43,100.00 |
XC7S50-2CSGA324I 개요
What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs) surrounded by programmable routing and I/O cells. Unlike an ASIC, an FPGA can be reconfigured in the field via an HDL bitstream, which dramatically reduces non-recurring engineering cost for low- and mid-volume designs. The Spartan-7 family sits in AMD's low-power, low-cost segment below Artix-7, built on a 28 nm process node that lowers static and dynamic power versus the prior Spartan-6 generation while retaining a familiar 7-series tool flow (Vivado, IP catalog, AXI infrastructure).
Key features include 52,160 logic cells, 75 36 Kb block RAMs, 120 DSP48 slices, six clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and integrated hard IP such as GTP serial transceivers on selected devices. The -2 speed grade improves Fmax versus the raw Geisinger -1, enabling tighter timing margins in pipelined DSP and video pipelines. On-chip security and bitstream encryption via AES-256, along with built-in configuration interfaces (SPI, BPI, JTAG, SelectMAP), accelerate system bring-up.
Typical applications include industrial motor control and machine vision, automotive driver-assistance subsystems, low-cost video bridging, embedded vision edge nodes, and portable test and measurement. The 52K-cell capacity comfortably fits image-processing pipelines, real-time control loops, and mid-bandwidth protocol bridges.
When designing with this board, validate signal integrity on the CSGA324 BGA escape with manufacturer pinout files (UG475), respect the 0.8 mm pitch BGA manufacturing rules, and verify configuration mode and bank voltage against UG470. Plan thermal dissipation against theta_JA from the package data sheet for industrial enclosures.
드롭인 대체품: XC7S50-2CSGA324I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7S50-2CSGA324I (동일 폼 팩터 및 풋프린트) — 차이점: DSP Slices, Package, Speed Grade, Block RAM, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7S50-1CSGA324I
✅ 드롭인✓ 재고 있음
$98.2 / 개
데이터시트 보기 →XC7S50-2CSGA324C
✅ 드롭인✓ 재고 있음
$110.85 / 개
데이터시트 보기 →XC7S50-2CSG324I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7S50-2CSGA324Q
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7S50-2CSGA324I 최대 정격 & 전기적 특성
| Series | Spartan-7 |
| Manufacturer | AMD (formerly Xilinx) |
| Logic Cells | 52,160 |
| Block RAM (36 Kb blocks) | 75 |
| DSP Slices | 120 |
| User I/O Count | 210 |
| 패키지 | 324-LFBGA / CSGA324 (15 x 15 mm, 0.8 mm pitch) |
| 실장 유형 | Surface Mount (BGA) |
| Speed Grade | -2 |
| 동작 온도 | -40C to +100C (Industrial, I) |
| Process Node | 28 nm |
| Configuration Memory | SRAM-based, AES-256 bitstream encryption |
| Clock Management Tiles (CMTs) | 6 |
| Configuration Interfaces | SPI, BPI, JTAG, SelectMAP |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
| Part Status | Active |
XC7S50-2CSGA324I 324-lfbga / csga324 (15 x 15 mm, 0.8 mm pitch) 핀 구성 가이드
XC7S50-2CSGA324I(324-lfbga / csga324 (15 x 15 mm, 0.8 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7S50-2CSGA324I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7S50-2CSGA324I 적합 용도: 6 애플리케이션s: Industrial Motor Control & Drive, Machine Vision & Image Processing, Automotive Driver-Assistance Subsystems, Portable Test & Measurement, Industrial IoT Edge Gateway, LED Video Wall & Display Bridging.
Industrial Motor Control & Drive
The XC7S50-2CSGA324I is well matched to multi-axis industrial motor drives where field-oriented control (FOC) and space-vector PWM are computed in real time. Its 120 DSP48 slices execute the fast inner current loop in a single cycle, while 52K logic cells absorb encoder interfaces, commutation state machines, and protective logic. The industrial -40C to +100C temperature grade handles under-hood or cabinet environments. Place the FPGA between the power section and the host controller with opto-isolated HR I/Os to PWM and analog feedback paths.
추천
Machine Vision & Image Processing
The XC7S50-2CSGA324I supports mid-resolution machine-vision pipelines: MIPI CSI-2 bridge, Bayer demosaic, and basic defect classification. Its 120 DSP slices accelerate 2D convolution and Sobel filters, while 75 of 36 Kb block RAMs hold line buffers and small frame tiles. The 210 HR I/Os connect directly to CMOS image sensors and parallel LVDS serializers. Industrial temperature grade suits factory-line deployments. Stack with an external LPDDR4 memory controller and use a soft MIPI D-PHY in the HR I/O banks.
추천
Automotive Driver-Assistance Subsystems
The XC7S50-2CSGA324I handles surround-view stitching, rear-camera overlay, and ultrasonic sensor fusion in entry-level ADAS modules. Its 52K logic cells run multi-camera warp-blend pipelines, while 120 DSP slices perform perspective correction in real time. The CSGA324 BGA is automotive-friendly when paired with AEC-Q100 peripherals. Industrial temperature grade suits in-cabin environments; for under-hood ECUs consider the Q automotive variant.
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Portable Test & Measurement
The XC7S50-2CSGA324I powers handheld oscilloscopes, logic analyzers, and protocol testers where low power and reconfigurability matter. Its 52K logic cells implement custom protocol decodes, while 75 of 36 Kb block RAMs serve deep acquisition buffers. The -2 speed grade supports 200+ MHz sample-clock logic with comfortable timing closure. Industrial temperature grade enables field use. Use the JTAG configuration interface for in-the-field firmware updates via the host MCU.
추천
Industrial IoT Edge Gateway
The XC7S50-2CSGA324I serves as a protocol-conversion hub between legacy industrial fieldbuses (Modbus, Profibus, CAN) and modern OPC-UA / MQTT Ethernet. Its 52K logic cells implement multiple soft protocol cores concurrently, and the 210 HR I/Os handle RS-485, RS-232, and CAN transceivers. Industrial temperature grade ensures cabinet reliability. Pair with an external Ethernet MAC for industrial-Ethernet protocols and the soft Ethernet MAC for in-band management.
추천
LED Video Wall & Display Bridging
The XC7S50-2CSGA324I bridges HDMI or DisplayPort inputs to proprietary LED video-wall protocols, performing color-space conversion and gamma correction in real time. Its 120 DSP slices accelerate 3x3 color-matrix multiplies, while 75 of 36 Kb block RAMs buffer scan-line data for multi-tile output. The 210 HR I/Os drive 24+ parallel LED data channels. Industrial temperature grade supports outdoor enclosures; use SelectMAP-free HR I/O bank configuration for high-speed LVDS data lanes.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7S50-2CSGA324I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7S50-1CSGA324I | XC7S50-2CSGA324C | XC7S50-2CSG324I | XC7S50-2CSGA324Q |
|---|---|---|---|---|---|
| Package | CSGA324 (324-LFBGA, 15x15 mm) | CSGA324 - same | CSGA324 - same | CSG324 - same footprint, alt stack | CSGA324 - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 52,160 | 52,160 | 52,160 | 52,160 | 52,160 |
| Speed Grade | -2 | -1 (lower Fmax) | -2 (same) | -2 (same) | -2 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive (AEC-Q100) |
| DSP Slices | 120 | 120 | 120 | 120 | 120 |
| Block RAM (36 Kb) | 75 | 75 | 75 | 75 | 75 |
| User I/O | 210 HR I/Os | 210 HR I/Os | 210 HR I/Os | 210 HR I/Os | 210 HR I/Os |
주요 차별점
- Industrial temperature grade (-40C to +100C) for harsh environments (vs XC7S50-2CSGA324C)
- Higher Fmax from the -2 speed grade versus -1 (vs XC7S50-1CSGA324I)
- Pin-compatible cross-brand option via Lattice ECP5 (vs LFE5U-45F-6BG256C)
설계 노트
The CSGA324 is a 324-ball BGA at 0.8 mm pitch - escape routing requires high-density interconnect (HDI) PCB technology with microvias. Use AMD's pinout files from UG475 to plan ball escape and verify the SDIO, configuration, and transceiver banks against your schematic. Place decoupling caps on the bottom side directly under each power/ground ball pair.
Sequence the Spartan-7 rails in the order VCCINT (0.95 V core), VCCAUX (1.8 V), then VCCO (1.2 V-3.3 V I/O banks) to avoid in-rush current and latch-up. AMD specifies monotonic ramp-up and a maximum delta between rails; use a multi-rail PMIC or discrete supervisors. Hold POR low until all rails are stable.
Keep GTP/GTX reference clock traces at 100 ohm differential with length-matching within 5 mils. Use SelectMAP mode for fast parallel configuration when boot time matters; use SPI flash for smallest BOM. Maintain at least 8 mm of PCB-to-frame clearance under the BGA for thermal dissipation on industrial designs.
Do not use the -2 speed grade with a -1 rated voltage regulator - the dropout behavior shifts and may violate POR. Avoid mixing LVCMOS25 and LVDS25 in the same bank unless explicitly listed as compatible in UG471. Industrial-temperature (I) parts have tighter AC timing margins than commercial parts at the same speed grade.
규정 준수 정보
RoHS and REACH compliant per AMD Spartan-7 family environmental certification. Standard industrial -I grade is not AEC-Q100 - select the Q variant for AEC-Q100. Lead-free BGA ball finish.
